Cooling device for optical engine

Abstract

A cooling device for an optical engine includes a cooler module, a first temperature/humidity sensor, a second temperature/humidity sensor and a temperature control system. The cooler module includes a cooler, the cooler has a heat-absorbing surface and a heat-dissipating surface, and the heat-absorbing surface is thermally coupled to at least one heat source. The first temperature/humidity sensor is disposed in a position not in contact with the cooler module, and the second temperature/humidity sensor is disposed on the heat-absorbing surface. The temperature control system is capable of receiving a signal from the first temperature/humidity sensor, receiving a signal from the second temperature/humidity sensor, and transmitting a signal to the cooler module.

What is claimed is: 
     
         1 . A cooling device for an optical engine having at least one heat source, comprising:
 a cooler module comprising a cooler, the cooler having a heat-absorbing surface and a heat-dissipating surface, and the heat-absorbing surface being thermally coupled to the at least one heat source;   a first temperature/humidity sensor disposed in a position not in contact with the cooler module;   a second temperature/humidity sensor disposed on the heat-absorbing surface; and   a temperature control system capable of receiving a signal from the first temperature/humidity sensor, receiving a signal from the second temperature/humidity sensor, and transmitting a signal to the cooler module.   
     
     
         2 . The cooling device as claimed in  claim 1 , wherein the cooler module further comprises a base and a thermal block, and the cooler is disposed between the base and the thermal block. 
     
     
         3 . The cooling device as claimed in  claim 2 , wherein the cooler module further comprises a heat sink, and the heat sink is thermally coupled to the base. 
     
     
         4 . The cooling device as claimed in  claim 1 , wherein the second temperature/humidity sensor is configured to detect a relative humidity around the heat-absorption surface if the first temperature/humidity sensor fails, and the temperature control system is capable of adjusting a power of the cooler according to the relative humidity detected by the second temperature/humidity sensor. 
     
     
         5 . The cooling device as claimed in  claim 1 , wherein the temperature control system is configured to reduce a cooling efficiency of the cooler if the second temperature/humidity sensor fails. 
     
     
         6 . The cooling device as claimed in  claim 1 , wherein the first temperature/humidity sensor is capable of detecting an ambient temperature and a relative humidity of environment and transmitting the detected ambient temperature and the relative humidity to the temperature control system, the temperature control system is capable of calculating a dew point of the environment based on the ambient temperature and the relative humidity, the second temperature/humidity sensor is capable of detecting a temperature of the heat-absorbing surface and transmitting the detected temperature to the temperature control system, and the temperature control system is capable of regulating the temperature of the heat-absorbing surface to ensure the temperature of the heat-absorbing surface is higher than the dew point. 
     
     
         7 . The cooling device as claimed in  claim 1 , wherein the heat source comprises at least one of a light-emitting diode, a laser diode and a digital micro-mirror chip. 
     
     
         8 . The cooling device as claimed in  claim 1 , wherein each of the first temperature/humidity sensor and the second temperature/humidity sensor comprises a thin film and a component layer having a recess, and the thin film overlays the recess of the component layer. 
     
     
         9 . The cooling device as claimed in  claim 8 , wherein the thin film is composed of either one or any combination of polyurethane methacrylate, polytetrafluoroethylene, polyvinyl chloride, and Teflon. 
     
     
         10 . A cooling device for an optical engine having at least one heat source, comprising:
 a cooler module thermally coupled to the at least one heat source;   a temperature/humidity sensor disposed in a position not in contact with the cooler module;   a temperature sensor disposed on the cooler module; and   a temperature control system electrically connected to the temperature/humidity sensor, the temperature sensor and the cooler module.   
     
     
         11 . The cooling device as claimed in  claim 10 , wherein the cooler module comprises a cooler having a heat-absorbing surface and a heat-dissipating surface. 
     
     
         12 . The cooling device as claimed in  claim 11 , wherein the cooler module further comprises a base and a thermal block, and the cooler is disposed between the base and the thermal block. 
     
     
         13 . The cooling device as claimed in  claim 12 , wherein the cooler module further comprises a heat sink, and the heat sink is thermally coupled to the base. 
     
     
         14 . The cooling device as claimed in  claim 11 , wherein the temperature/humidity sensor is capable of detecting an ambient temperature and a relative humidity of environment and transmitting the detected ambient temperature and the relative humidity to the temperature control system, the temperature control system is capable of calculating a dew point of the environment based on the ambient temperature and the relative humidity, the temperature sensor is capable of detecting a temperature of a heat-absorbing surface of the cooler module and transmits the detected temperature to the temperature control system, and the temperature control system is capable of regulating the temperature of the heat-absorbing surface to ensure the temperature of the heat-absorbing surface is higher than the dew point. 
     
     
         15 . The cooling device as claimed in  claim 11 , wherein the temperature control system is configured to reduce a cooling efficiency of the cooler if the temperature sensor fails. 
     
     
         16 . The cooling device as claimed in  claim 10 , wherein the heat source comprises at least one of a light-emitting diode, a laser diode and a digital micro-mirror chip. 
     
     
         17 . The cooling device as claimed in  claim 10 , wherein the temperature/humidity sensor comprises a thin film and a component layer having a recess, and the thin film overlays the recess of the component layer. 
     
     
         18 . The cooling device as claimed in  claim 17 , wherein a material of the thin film is selected from the group consisting of polyurethane methacrylate, polytetrafluoroethylene, polyvinyl chloride, and Teflon.