Aqueous suspension and cutting fluid including the same

Abstract

Proposed is an aqueous suspension including water, a hexagonal boron nitride (hBN) particle, and a dispersant. A cutting fluid prepared by diluting the aqueous suspension with water is also proposed. The hexagonal boron nitride (hBN) particle is a hydrophilic particle that is wettable with water. The hexagonal boron nitride (hBN) particle has a particle size D50 of 30 to 250 nm and a particle size D90 of 1 um or less for a primary particle and a secondary particle through an application of ultrasound for 24 hours. The hexagonal boron nitride (hBN) particle is synthesized at a temperature of 1600° C. or lower. The hexagonal boron nitride (hBN) particle is mixed with water at a weight ratio of 10 or less, and the dispersant is mixed at a weight ratio of 10 or less.

1 . An aqueous suspension comprising:
 water;   a hexagonal boron nitride (hBN) particle; and   a dispersant,   wherein the hexagonal boron nitride (hBN) particle is a hydrophilic particle that is wettable with water.   
     
     
         2 . The aqueous suspension of  claim 1 , wherein the hexagonal boron nitride (hBN) particle has a particle size D50 of 30 to 250 nm and a particle size D90 of 1 um or less for a primary particle and a secondary particle through an application of ultrasound for 24 hours. 
     
     
         3 . The aqueous suspension of  claim 1 , wherein the hexagonal boron nitride (hBN) particle is synthesized at a temperature of 1600° C. or lower. 
     
     
         4 . The aqueous suspension of  claim 1 , wherein the hexagonal boron nitride (hBN) particle is mixed with water at a weight ratio of 10 or less, and the dispersant is mixed at a weight ratio (solid weight of the dispersant) of 10 or less. 
     
     
         5 . The aqueous suspension of  claim 1 , wherein as the dispersant, one or more selected from the group consisting of anionic, cationic, zwitterionic, and nonionic dispersants is used alone or in combination. 
     
     
         6 . The aqueous suspension of  claim 1 , further comprising one or more selected from the group consisting of rust preventatives, anti-foaming agents, anti-freezing agents, and preservatives. 
     
     
         7 . The aqueous suspension of  claim 1 , further comprising one or more selected from the group consisting of CNTs, graphene, and Al 2 O 3 , MoSe, SiO 2 , ZrO 2 , CuO, SiC, TiO 2 , diamond powder having a particle size D50 of 1 um or less for a secondary particle. 
     
     
         8 . A cutting fluid prepared by diluting the aqueous suspension according to  claim 1  with water. 
     
     
         9 . The cutting fluid of  claim 8 , for use in an MQL spray method.