Head module

Abstract

A head module includes: a head chip having a nozzle plate and an IC; a cooler which is in thermal contact with the IC and which is configured to cool the IC; and a supplying device fluidly connected to the head chip and configured to supply ink to the head chip. In a first direction orthogonal to the nozzle plate, the cooler and the supplying device are positioned on one side with respect to the nozzle plate, the cooler and the supplying device are overlapped as seen from the first direction, and the cooler and the supplying device are thermally isolated from each other.

What is claimed is: 
     
         1 . A head module, comprising:
 a head chip having a nozzle plate and an IC;   a cooler which is in thermal contact with the IC and which is configured to cool the IC; and   a supplying device fluidly connected to the head chip and configured to supply ink to the head chip,   wherein in a first direction orthogonal to the nozzle plate, the cooler and the supplying device are positioned on one side with respect to the nozzle plate,   the cooler and the supplying device are overlapped as seen from the first direction, and   the cooler and the supplying device are thermally isolated from each other.   
     
     
         2 . The head module according to  claim 1 , wherein a clearance is defined between the cooler and the supplying device. 
     
     
         3 . The head module according to  claim 1 , wherein the cooler has a coolant channel through which coolant flows. 
     
     
         4 . The head module according to  claim 3 , wherein
 the cooler has a contacting part which is in thermal contact with the IC, and   the contacting part is overlapped with the supplying device as seen from the first direction.   
     
     
         5 . The head module according to  claim 4 , wherein
 the head chip comprises a first connecting port connected to the supplying device, the ink being supplied from the supplying device to the head chip via the first connecting port,   the head chip has a rectangular outer shape,   the cooler is fixed to a first side of the head chip, and   the first connecting port is positioned in a second side of the head chip.   
     
     
         6 . The head module according to  claim 5 , wherein the cooler and the supplying device are positioned so as not to cross over an outer edge of the head chip as seen from the first direction. 
     
     
         7 . The head module according to  claim 5 , wherein
 the head chip further has a second connecting port connected to the supplying device, the ink being supplied from the supplying device to the head chip via the second connecting port, and   the second connecting port is positioned in a third side of the head chip.   
     
     
         8 . The head module according to  claim 7 , wherein the second side and the third side of the head chip face each other. 
     
     
         9 . The head module according to  claim 5 , wherein
 the supplying device comprises an ink supplying channel through which the ink is supplied to the head chip, and   as seen from the first direction, an upstream end of the ink supplying channel and an upstream end and a downstream end of the coolant channel are positioned on an inner side with respect to an outer edge of the head chip and are opened toward the one side in the first direction.   
     
     
         10 . The head module according to  claim 9 , wherein the upstream end of the ink supplying channel and each of the upstream end and the downstream end of the coolant channel are different in a shape of a cross section which is orthogonal to the first direction. 
     
     
         11 . The head module according to  claim 1 , wherein the supplying device comprises: an ink supplying channel through which the ink is supplied to the head chip; and an ink recovering channel through which the ink is recovered from the head chip. 
     
     
         12 . The head module according to  claim 5 , wherein in a cross section which is orthogonal to the nozzle plate and which is parallel to the second side of the head chip, the coolant channel is positioned on the one side in the first direction with respect to the IC and the supplying device is positioned on the one side in the first direction with respect to the coolant channel. 
     
     
         13 . The head module according to  claim 1 , wherein the ink supplied from the supplying device to the head chip is heated by a heater.