US2024321663A1PendingUtilityA1

High-performance stress buffer die-coat and devices and processes implementing the same

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Assignee: WOLFSPEED INCPriority: Mar 22, 2023Filed: Mar 22, 2023Published: Sep 26, 2024
Est. expiryMar 22, 2043(~16.6 yrs left)· nominal 20-yr term from priority
Inventors:Afshin DadvandDev Balaraman
H10W 90/756H10W 90/736H10W 74/476H10W 74/43H10W 74/016H10W 72/50H10W 74/111H10W 74/121H10W 74/127H10W 74/473H10W 72/30F28F 21/04C08K 3/38C08F 8/00Y10S977/847B29K 2496/02B05D 1/28B05D 1/18B05D 5/12B05D 3/0254B05D 2505/50B05D 1/02B05D 1/26B05D 2601/00B05D 2430/00B05D 1/12H01L 2924/13091H01L 2924/12032H01L 2224/48245H01L 2224/32245H01L 24/48H01L 24/32H01L 23/296H01L 23/291H01L 21/565H01L 23/3135
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PatentIndex Score
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Cited by
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References
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Claims

Abstract

A device may include device parts, a composite coating material arranged on one or more of the device parts, and a molding compound arranged on and/or around one or more of the device parts. Moreover, the device may include where the composite coating material may include a polymer matrix including and/or incorporating ceramic particles.

Claims

exact text as granted — not AI-modified
1 . A device comprising:
 device parts;   a composite coating material arranged on one or more of the device parts; and   a molding compound arranged on and/or around one or more of the device parts,   wherein the composite coating material comprises a polymer matrix including and/or incorporating ceramic particles.   
     
     
         2 . The device according to  claim 1  wherein the molding compound is further arranged on one or more of the device parts implemented without the composite coating material coated thereon. 
     
     
         3 . The device according to  claim 1  wherein the device parts comprise one or more of a first lead, a second lead, at least one device component, a mount, at least one interconnect, a component attach, and/or at least one connection. 
     
     
         4 . The device according to  claim 1  wherein the device parts comprise at least one lead frame. 
     
     
         5 . The device according to  claim 1  wherein the composite coating material is arranged on all exposed surfaces of one or more of the device parts. 
     
     
         6 . The device according to  claim 1  wherein the composite coating material is arranged on surfaces of one or more of the device parts that contact the molding compound. 
     
     
         7 . The device according to  claim 1  wherein the composite coating material is formulated and/or configured to reduce failures of the device parts associated with interfacial stress exhibited during high temperature operation of the device. 
     
     
         8 . The device according to  claim 1  wherein the polymer matrix comprises a polyimide, a silicon, a fluoropolymer, and/or copolymers of a polyimide-silicon. 
     
     
         9 . The device according to  claim 1  wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the hexagonal boron-nitride (h-BN) particles comprise 5 nm to 5 μm sized h-BN particles. 
     
     
         10 . The device according to  claim 1  wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the hexagonal boron-nitride (h-BN) particles comprise a filler within the composite coating material. 
     
     
         11 . The device according to  claim 1  wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the hexagonal boron-nitride (h-BN) particles comprise h-BN in forms of h-BN nano-particles, h-BN microparticles, h-BN nanotubes (NT), and/or h-BN pallets. 
     
     
         12 . The device according to  claim 1  wherein the composite coating material comprises a dispensed coating on one or more of the device parts. 
     
     
         13 . The device according to  claim 1  wherein the composite coating material comprises an inkjet coating on one or more of the device parts. 
     
     
         14 . The device according to  claim 1  wherein the composite coating material comprises a spray coating on one or more of the device parts. 
     
     
         15 . The device according to  claim 1  wherein the composite coating material comprises a screen printed coating on one or more of the device parts. 
     
     
         16 . The device according to  claim 1  wherein the composite coating material comprises a cured coating on one or more of the device parts. 
     
     
         17 . The device according to  claim 1  wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the composite coating material comprises a mixture of at least the hexagonal boron-nitride (h-BN) particles and the polymer matrix. 
     
     
         18 . The device according to  claim 1  wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the composite coating material comprises a mixture of at least the hexagonal boron-nitride (h-BN) particles and the polymer matrix together with other fillers. 
     
     
         19 . The device according to  claim 1  wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the hexagonal boron-nitride (h-BN) particles comprise a surface functionalization. 
     
     
         20 . The device according to  claim 1  wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the hexagonal boron-nitride (h-BN) particles are grafted to the polymer matrix. 
     
     
         21 . The device according to  claim 1  wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and wherein the hexagonal boron-nitride (h-BN) particles comprise surface functionalization and the hexagonal boron-nitride (h-BN) particles are grafted to the polymer matrix. 
     
     
         22 . The device according to  claim 3  wherein the at least one device component comprises one or more MOSFETs and/or diodes. 
     
     
         23 . The device according to  claim 3  wherein the at least one device component comprises one or more active devices, passive devices, dies, chips, and/or transistors. 
     
     
         24 . The device according to  claim 3  wherein the at least one interconnect comprises one or more wires, wire bonds, and/or leads. 
     
     
         25 . The device according to  claim 1  wherein the device comprises a package, a power device package, and/or a power module. 
     
     
         26 . A process of manufacturing a device comprising:
 providing device parts;   arranging a composite coating material on one or more of the device parts; and   arranging a molding compound on and/or around one or more of the device parts,   wherein the composite coating material comprises a polymer matrix including and/or incorporating ceramic particles.   
     
     
         27 .- 36 . (canceled) 
     
     
         37 . The process of manufacturing a device according to  claim 26  further comprising dispensing the composite coating material on one or more of the device parts to form a dispensed coating on one or more of the device parts. 
     
     
         38 . The process of manufacturing a device according to  claim 26  further comprising ink jetting the composite coating material on one or more of the device parts to form an inkjet coating on one or more of the device parts. 
     
     
         39 . The process of manufacturing a device according to  claim 26  further comprising spray coating the composite coating material on one or more of the device parts to form a spray coating on one or more of the device parts. 
     
     
         40 . The process of manufacturing a device according to  claim 26  further comprising screen printing the composite coating material on one or more of the device parts to form a screen printed coating on one or more of the device parts. 
     
     
         41 . The process of manufacturing a device according to  claim 26  further comprising curing the composite coating material on one or more of the device parts to form a cured coating on one or more of the device parts. 
     
     
         42 .- 43 . (canceled) 
     
     
         44 . The process of manufacturing a device according to  claim 26  wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and the process further comprising processing the hexagonal boron-nitride (h-BN) particles to form a surface functionalization. 
     
     
         45 . The process of manufacturing a device according to  claim 26  wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and the process further comprising grafting the hexagonal boron-nitride (h-BN) particles to the polymer matrix. 
     
     
         46 . The process of manufacturing a device according to  claim 26  wherein the ceramic particles comprise hexagonal boron-nitride (h-BN) particles; and the process further comprising:
 processing the hexagonal boron-nitride (h-BN) particles to form a surface functionalization; and 
 grafting the hexagonal boron-nitride (h-BN) particles to the polymer matrix. 
 
     
     
         47 .- 50 . (canceled)

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