US2024301583A1PendingUtilityA1

Electrodeposition apparatus and method for electrodeposition

Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTDPriority: Mar 10, 2023Filed: Dec 29, 2023Published: Sep 12, 2024
Est. expiryMar 10, 2043(~16.6 yrs left)· nominal 20-yr term from priority
Inventors:Jinyang Zhao
C25D 21/12C25D 13/22C25D 21/14C25D 21/04C25D 21/10C25D 17/06C25D 21/08C25D 17/10C25D 17/007
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Claims

Abstract

Embodiments of the present application provide an electrodeposition apparatus including a laminating mechanism, a dispensing platform, a liquid-feed device, a power supply device, and a control module. A first electrode substrate is fixed on a first surface of the dispensing platform. A second electrode substrate is fixed on a second surface of the laminating mechanism. The control module is configured to control movement of the laminating mechanism so that a gap is defined between the first surface and the second surface. The control module is further configured to control the liquid-feed device to inject a nanoparticle solution into the gap, and control the power supply device to apply voltages to the first electrode substrate and the second electrode substrate to perform electrodeposition process on the first electrode substrate and/or the second electrode substrate.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An electrodeposition apparatus, comprising: a laminating mechanism, a dispensing platform, a liquid-feed device, a power supply device, and a control module;
 wherein the dispensing platform comprises a first surface, and is configured to fix a first electrode substrate on the first surface;   wherein the laminating mechanism comprises a second surface opposite to the first surface, is configured to fix a second electrode substrate on the second surface; and   wherein the control module is electrically connected to the laminating mechanism, the liquid-feed device, and the power supply device, respectively; the control module is configured to control a movement of the laminating mechanism so that a gap is defined between the first surface and the second surface; the control module is further configured to control the liquid-feed device to inject a nanoparticle solution being preset into the gap, and control the power supply device to apply voltages to the first electrode substrate and the second electrode substrate, so as to perform an electrodeposition process on the first electrode substrate and/or the second electrode substrate; and the nanoparticle solution comprises nanoparticles with charges.   
     
     
         2 . The electrodeposition apparatus according to  claim 1 , wherein the laminating mechanism further comprises an X-axis moving slide rail, a Y-axis moving slide rail, and a Z-axis moving slide rail; the X-axis moving slide rail and the Y-axis moving slide rail are moving slide rails that are perpendicular to each other and parallel to the horizontal plane, and the Z-axis moving slide rail is a moving slide rail that is perpendicular to the horizontal plane; and
 wherein the X-axis moving slide rail, the Y-axis moving slide rail, and the Z-axis moving slide rail are configured for the laminating mechanism to move along an X-axis direction, a Y-axis direction, and a Z-axis direction, respectively.   
     
     
         3 . The electrodeposition apparatus according to  claim 1 , wherein the laminating mechanism further comprises counterweight module connected to the Z-axis moving slide rail. 
     
     
         4 . The electrodeposition apparatus according to  claim 1 , wherein the first surface and the second surface are provided with a plurality of micropores, respectively; and
 wherein the micropores defined on the first surface are configured to fix the first electrode substrate through vacuum adsorption, and the micropores defined on the second surface are configured to fix the second electrode substrate through vacuum adsorption.   
     
     
         5 . The electrodeposition apparatus according to  claim 1 , wherein the first surface and the second surface are provided with a power-on probe being protruded, respectively;
 the power-on probe on the first surface is configured to be electrically connected to the second electrode substrate and provide power to the second electrode substrate; and   the power-on probe on the second surface is configured to be electrically connected to the first electrode substrate and provide power to the first electrode substrate.   
     
     
         6 . The electrodeposition apparatus according to  claim 4 , wherein the power-on probe is a retractable probe. 
     
     
         7 . The electrodeposition apparatus according to  claim 4 , wherein the power-on probe is a movable probe. 
     
     
         8 . The electrodeposition apparatus according to  claim 1 , further comprising a cleaning device and a gas collection device;
 wherein the cleaning device is configured to clean the first electrode substrate and/or the second electrode substrate after electrodeposition process to remove undeposited impurities, and heat the first electrode substrate and/or the second electrode substrate after clean process to volatilize solutions on the first electrode substrate and/or the second electrode substrate; and   wherein the gas collection device is configured to collect gases that are volatilized.   
     
     
         9 . The electrodeposition apparatus according to  claim 1 , wherein the laminating mechanism further comprises a micrometer head; and
 the micrometer head is configured to horizontally adjust the second surface.   
     
     
         10 . The electrodeposition apparatus according to  claim 1 , wherein the laminating mechanism further comprises a height measuring sensor;
 the height measuring sensor is configured to measure a distance between the first electrode substrate and the second electrode substrate.   
     
     
         11 . The electrodeposition apparatus according to  claim 1 , wherein the liquid-feed device comprises a syringe and a moving motor;
 wherein the syringe is provided with the nanoparticle solution, one end of the syringe adjacent to the gap between the first electrode substrate and the second electrode substrate is provided with a needle; and   wherein the moving motor controls a movement of the nanoparticle solution disposed in the syringe by pushing.   
     
     
         12 . The electrodeposition apparatus according to  claim 11 , wherein the liquid-feed device further comprises a stop leak valve, and the stop leak valve is configured to prevent the nanoparticle solution disposed in the syringe from passing. 
     
     
         13 . The electrodeposition apparatus according to  claim 12 , wherein the liquid-feed device further comprises a swing cylinder, and the swing cylinder is configured to control opening and closing of the stop leak valve to control injection of the nanoparticle solution into the gap. 
     
     
         14 . The electrodeposition apparatus according to  claim 11 , wherein the liquid-feed device further comprises a liquid level sensor, and the liquid level sensor is configured to detect a volume of a remaining solution in the syringe. 
     
     
         15 . A method for electrodeposition, comprising the following steps:
 fixing a first electrode substrate and a second electrode substrate on a first surface and a second surface that are arranged oppositely, respectively;   moving the first surface to form a gap defined between the first surface and the second surface;   injecting a nanoparticle solution into the gap, wherein the nanoparticle solution comprises nanoparticles with charge; and   applying voltages to the first electrode substrate and the second electrode substrate to perform an electrodeposition process on the first electrode substrate and/or the second electrode substrate.   
     
     
         16 . The method for electrodeposition according to  claim 15 , wherein the nanoparticle solution comprises nanoparticles with positive charges and/or negative charges; and the step of applying voltages to the first electrode substrate and the second electrode substrate to perform an electrodeposition process on the first electrode substrate and/or the second electrode substrate comprising:
 applying voltages to the first electrode substrate and the second electrode substrate to form an electric field between the first electrode substrate and the second electrode substrate, so that the nanoparticles form a nanoparticle thin film on the first electrode substrate and/or the second electrode based on an electric field force of the electric field.

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