Electronic device comprising optical sensor module

Abstract

According to various embodiments, an electronic device is provided and includes a housing, a support frame which is arranged in an internal space of the housing and has a first surface, a second surface facing a direction opposite to the first surface, and a through hole, a display supported by the first surface and arranged to be seen from outside through at least a part of the housing, and an optical sensor module arranged in the second surface to face the through hole.

What is claimed is: 
     
         1 . An electronic device comprising:
 a front cover;   a rear cover facing in a direction opposite to the front cover;   a support frame disposed in a space between the front cover and the rear cover, the support frame comprising a through-hole;   a display supported by the support frame and disposed to be visible from an outside of the electronic device through at least a portion of the front cover;   an optical sensor module disposed on the support frame between the support frame and the rear cover and corresponding to the through-hole; and   a support wall extending from the support frame, the support wall protruding from the support frame toward the rear cover and disposed to surround at least a portion of the optical sensor.   
     
     
         2 . The electronic device of  claim 1 , wherein the optical sensor module comprises:
 a module housing;   at least one image sensor disposed in an inner space of the module housing, and configured to detect an external environment through the display; and   a flexible printed circuit board (FPCB) drawn out from the module housing.   
     
     
         3 . The electronic device of  claim 2 , wherein the support wall protrudes from the support frame to at least partially surround the module housing around the through-hole. 
     
     
         4 . The electronic device of  claim 2 , wherein the optical sensor module comprises a fingerprint sensor module, and wherein the fingerprint sensor module is fixed to the support frame via an adhesive tape. 
     
     
         5 . The electronic device of  claim 1 , wherein the support wall is formed to have a length that contacts the rear cover with priority over the optical sensor module when the display is pressed. 
     
     
         6 . The electronic device of  claim 1 , further comprising at least one screw through-hole disposed around the through hole in the support frame,
 wherein the support frame is fixed to the rear cover by fastening a screw penetrated through the at least one screw through hole.   
     
     
         7 . The electronic device of  claim 1 , wherein the optical sensor module is fixed to the support frame through a screw. 
     
     
         8 . The electronic device of  claim 1 , wherein the optical sensor module is fixed to the support frame and maintained at a specific interval from the rear cover. 
     
     
         9 . The electronic device of  claim 1 , further comprising a pressure dispersion unit disposed in a loop shape to at least partially surround a periphery of the through-hole between the support frame and the display,
 wherein the pressure dispersion unit is attached to the support frame via a first adhesive member and is in contact with the display.   
     
     
         10 . The electronic device of  claim 9 , wherein pressure dispersion unit is disposed in a recess formed on a surface of the support frame, and
 wherein the recess is formed in the surface to be lower than the surface such that the pressure dispersion unit has a height that is at least flush with the surface when the pressure dispersion unit is disposed in the recess.   
     
     
         11 . The electronic device of  claim 9 , further comprising a buffer unit disposed between the optical sensor module and the rear cover. 
     
     
         12 . The electronic device of  claim 11 , wherein the buffer unit is attached to the optical sensor module and the rear cover via a second adhesive member. 
     
     
         13 . The electronic device of  claim 11 , wherein the buffer unit is formed of an elastic material having relatively higher compressibility than the pressure dispersion unit. 
     
     
         14 . The electronic device of  claim 11 , wherein the buffer unit is disposed in a recess formed to be lower than a surface of the rear cover. 
     
     
         15 . The electronic device of  claim 1 , further comprising a printed circuit board (PCB) disposed on the support frame between the support frame and the rear cover,
 wherein the optical sensor module is electrically connected to the PCB through a FPCB drawn out from the optical sensor module.   
     
     
         16 . The electronic device of  claim 15 , wherein the FPCB is fixed to a position spaced apart from the PCB by a predetermined distance on the support frame, and
 wherein the PCB and the FPCB are electrically connected to each other via a bridge board.   
     
     
         17 . The electronic device of  claim 16 , wherein the bridge board is disposed on the rear cover. 
     
     
         18 . The electronic device of  claim 15 , wherein the PCB comprises at least one electronic component disposed to be exposed to an exterior in at least a portion of the electronic device. 
     
     
         19 . The electronic device of  claim 18 , wherein the at least one electronic component comprises at least one of a receptacle, an ear jack assembly, a speaker module, a microphone module and an external environment detection sensor module. 
     
     
         20 . The electronic device of  claim 1 , wherein the through-hole overlaps at least a portion of the display when the support frame is viewed from above.