Methods of reducing or eliminating deposits in an electroplating system

Abstract

The present technology includes methods for reducing the formation of insoluble deposits in a plating system or a surface thereof. The methods include reducing a volume of a plating solution having a first pH in a plating bath from a first volume to a second volume, adding a replenishment agent to the plating solution to increase the volume of the plating solution from the second volume to the first volume. The replenishment agent is characterized by a second pH, where the second pH varies from the first pH by less than or about 5.

What is claimed is: 
     
         1 . A method of reducing formation of insoluble deposits in a plating system or a surface thereof, the method comprising:
 reducing a volume of a plating solution having a first pH in a plating bath from a first volume to a second volume; and   adding a replenishment agent to the plating solution to increase the volume of the plating solution from the second volume to the first volume, wherein the replenishment agent is characterized by a second pH, wherein the second pH varies from the first pH by less than or about 5.   
     
     
         2 . The method of  claim 1 , wherein the plating solution is characterized by a change in pH subsequent the addition of less than or about 3. 
     
     
         3 . The method of  claim 1 , wherein the plating solution further comprises metal ions, metal particles, organometallic particles, organic particles, or a combination thereof. 
     
     
         4 . The method of  claim 3 , wherein less than about 10 wt. % of the metal ions, metal particles, organometallic particles, organic particles, or a combination thereof precipitate from the plating solution subsequent the replenishment, based upon the weight of the metal ions, metal particles, organometallic particles, organic particles, or a combination thereof in the plating solution prior to addition. 
     
     
         5 . The method of  claim 1 , wherein the first pH is from about 0 to about 5, and wherein the second pH is from about 0 to about 5. 
     
     
         6 . The method of  claim 1 , wherein the first pH is from about 8 to about 12, and wherein the second pH is from about 8 to about 12. 
     
     
         7 . The method of  claim 1 , wherein the second pH varies from the first pH by less than or about 1.5. 
     
     
         8 . The method of  claim 7 , wherein the second pH varies from the first pH by less than or about 3. 
     
     
         9 . The method of  claim 1 , wherein the replenishment agent comprises a mineral acid, carbonic acid, cathode water, anode water, or a combination thereof. 
     
     
         10 . The method of  claim 9 , wherein the replenishment agent comprises methane sulfonic acid, carbonic acid, cathode water, anode water, or a combination thereof. 
     
     
         11 . The method of  claim 10 , wherein the replenishment agent is characterized by a pH of less than 3. 
     
     
         12 . The method of  claim 1 , wherein the reduction in volume includes evaporating a portion of the plating solution. 
     
     
         13 . The method of  claim 1 , wherein the plating solution comprises a first electrolyte concentration, and a second electrolyte concentration subsequent the addition, wherein the first electrolyte concentration varies from the second electrolyte concentration by less than or about 10 wt. % based upon a weight of electrolyte in the plating solution. 
     
     
         14 . A method of reducing formation of insoluble deposits in a plating system or a surface thereof, the method comprising:
 reducing a volume of a plating solution having a first pH in a plating bath;   conditioning a replenishment agent to a second pH, wherein the second pH is characterized by varying from the first pH by less than or about 3, wherein the replenishment agent comprises carbonic acid, electrolyzed water, or a combination thereof; and   adding the replenishment agent to the plating solution to increase the volume of the plating solution.   
     
     
         15 . The method of  claim 14 , wherein the replenishment agent is generally free of mineral acids. 
     
     
         16 . A method of reducing formation of insoluble deposits in a plating system or a surface thereof,
 the plating system comprising a plating bath containing a plating solution, a head comprising a seal, a substrate coupled with the seal, and a bath supply, the plating solution being characterized by a first pH;   the method comprising:
 moving the head from a first position to a second position, wherein the seal and the substrate are disposed in the plating solution in the second position, 
 contacting the substrate with one or more insoluble ions; and 
 adding a replenishment agent to the plating solution, wherein the replenishment agent is characterized by a second pH, wherein the second pH varies from the first pH by less than or about 5. 
   
     
     
         17 . The method of  claim 16 , wherein the plating system further comprises a plating solution conditioning system. 
     
     
         18 . The method of  claim 17 , further comprising conditioning the replenishment agent to the second pH. 
     
     
         19 . The method of  claim 18 , wherein the conditioning comprises selecting an acid, adjusting an acid concentration, adding an acidifying agent, adding an alkalization agent, or a combination thereof. 
     
     
         20 . The method of  claim 19 , wherein the acidifying agent and/or the alkalization agent includes electrolysis.