Resistor and plating apparatus

Abstract

Provided is a resistor or the like that can improve uniformity of a plating film formed on a substrate. A resistor disposed between a substrate and an anode in a plating tank is provided. The resistor includes a first plurality of holes each formed on three or more reference circles being concentric and having different diameters and a second plurality of holes formed on an outer circumferential reference line surrounding the three or more reference circles, at least a part of the outer circumferential reference line being a trochoid curve.

1 . A resistor disposed between a substrate and an anode in a plating tank, the resistor comprising:
 a first plurality of holes each formed on three or more reference circles being concentric and having different diameters and   a second plurality of holes formed on an outer circumferential reference line surrounding the three or more reference circles, at least a part of the outer circumferential reference line being a trochoid curve.   
     
     
         2 . The resistor according to  claim 1 , wherein at least some of the second plurality of holes are long holes that are long along a circumferential direction. 
     
     
         3 . The resistor according to  claim 2 , wherein the long holes have a length increasing along the circumferential direction as being formed in a region away from the three or more reference circles. 
     
     
         4 . The resistor according to any one of  claims 1 to 3 , wherein the second plurality of holes are not formed in a predetermined region where a distance between the reference circle of an outermost circumference in the three or more reference circles and the outer circumferential reference line is less than a first distance. 
     
     
         5 . The resistor according to  claim 4 , wherein in the predetermined region, the first plurality of holes formed in the reference circle of the outermost circumference are larger than the first plurality of holes formed in the reference circle of the outermost circumference that is not in the predetermined region. 
     
     
         6 . The resistor according to any one of  claims 1 to 5 , wherein the first plurality of holes are arranged at equal intervals along a circumferential direction on the reference circles. 
     
     
         7 . The resistor according to any one of  claims 1 to 6 , wherein the first plurality of holes have the same dimension except for at least holes formed on the reference circle of an outermost circumference in the three or more reference circles. 
     
     
         8 . The resistor according to any one of  claims 1 to 7 , wherein a difference between a diameter of an arbitrary reference circle and a diameter of a reference circle adjacent to the arbitrary reference circle is constant. 
     
     
         9 . A plating apparatus comprising:
 the resistor according to any one of claims  1  to  8 , and   a plating tank that houses the resistor.   
     
     
         10 . The plating apparatus according to  claim 9 , further comprising:
 a substrate holder holding a substrate, and   a rotating mechanism that rotates the substrate holder.