Wafer Polishing Locating Ring and Chemical Mechanical Polishing Device

Abstract

This application provides a wafer polishing locating ring. The wafer polishing locating ring includes a ring body and a plurality of grooves formed in the ring body. The ring body is a circular ring body and includes an inner sidewall and an outer sidewall. The grooves run through the outer sidewall and inner sidewall of the ring body. An included angle between a sidewall and a bottom of each groove is an acute angle. This application solves the problem of short service life of the existing wafer polishing locating ring.

What is claimed is: 
     
         1 . A wafer polishing locating ring, comprising a ring body and a plurality of grooves formed in the ring body, wherein the ring body is a circular ring body and comprises an inner sidewall and an outer sidewall, the grooves run through the outer sidewall and inner sidewall of the ring body, and an included angle between a sidewall and a bottom of each groove is an acute angle. 
     
     
         2 . The wafer polishing locating ring according to  claim 1 , wherein two sidewalls of each groove are in parallel. 
     
     
         3 . The wafer polishing locating ring according to  claim 1 , wherein a vertical height of each groove is 3 mm-4 mm; and a horizontal width of each groove is 3 mm-4 mm. 
     
     
         4 . The wafer polishing locating ring according to  claim 3 , wherein the vertical height of each groove is 3 mm-3.2 mm; and the horizontal width of each groove is 3 mm-3.2 mm. 
     
     
         5 . The wafer polishing locating ring according to  claim 1 , wherein edges of the grooves close to the inner sidewall and the outer sidewall are in an arc shape. 
     
     
         6 . The wafer polishing locating ring according to  claim 5 , wherein an angle of the arc shape is 30°-75°. 
     
     
         7 . The wafer polishing locating ring according to  claim 1 , wherein the grooves are inclined clockwise from the inner sidewall to the outer sidewall. 
     
     
         8 . The wafer polishing locating ring according to  claim 1 , wherein a material of the wafer polishing locating ring comprises polyphenylene sulfide, polyether ether ketone, or semi-crystalline thermoplastic polymer. 
     
     
         9 . A chemical mechanical polishing device, comprising a polishing disc, a polishing pad adhered to the polishing disc, a polishing head, and the wafer polishing locating ring according to  claim 1 , wherein the wafer polishing locating ring is provided on the polishing head. 
     
     
         10 . The chemical mechanical polishing device according to  claim 9 , wherein the chemical mechanical polishing device further comprises a rubber diaphragm, and the rubber diaphragm is provided on the polishing head.