Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Abstract

An object is to provide a technology for enabling reduction in cracks in cut portions of adjacent molded parts when a runner part that connects the molded parts is cut and removed. A semiconductor manufacturing apparatus includes: a plurality of cavities filled with a molding resin to form a plurality of respective molded parts; and at least one runner through which the molding resin flows, the at least one runner having one end connected to a gate of one of the cavities, and an other end connected to a gate of an other of the cavities, the cavities being adjacent to each other, wherein an upper end of the at least one runner on one end side is higher than an upper end of the at least one runner on an other end side.

1 . A semiconductor manufacturing apparatus that manufactures a semiconductor device, comprising:
 a plurality of cavities filled with a molding resin to form a plurality of respective molded parts; and   at least one runner through which the molding resin flows, the at least one runner having one end connected to a gate of one of the cavities, and an other end connected to a gate of an other of the cavities, the cavities being adjacent to each other,   wherein an upper end of the at least one runner on one end side is higher than an upper end of the at least one runner on an other end side, and   no lead frame included in the semiconductor device is disposed at each of the gates of the cavities.   
     
     
         2 . The semiconductor manufacturing apparatus according to  claim 1 ,
 wherein a vertical width of the at least one runner on the one end side differs from a vertical width of the at least one runner on the other end side.   
     
     
         3 . The semiconductor manufacturing apparatus according to  claim 1 ,
 wherein the at least one runner includes a step between the one end side and the other end side.   
     
     
         4 . The semiconductor manufacturing apparatus according to  claim 1 ,
 wherein the at least one runner includes a slope between the one end side and the other end side.   
     
     
         5 . The semiconductor manufacturing apparatus according to  claim 1 ,
 wherein the at least one runner includes a recess protruding upward on the one end side.   
     
     
         6 . The semiconductor manufacturing apparatus according to  claim 5 ,
 wherein the recess is acute-angled.   
     
     
         7 . The semiconductor manufacturing apparatus according to  claim 1 , further comprising
 dies supporting the plurality of molded parts from below when at least one runner part connecting the molded parts is cut, the molded parts being adjacent to each other.   
     
     
         8 . A method of manufacturing a semiconductor device, the method comprising the steps of:
 (a) preparing a molded product including a plurality of molded parts and at least one runner part connecting the molded parts, the molded parts being adjacent to each other;   (b) applying a load of a punch with one end side of the at least one runner part being in contact with the punch, the one end side being connected to one of the adjacent molded parts; and   (c) cutting the at least one runner part with application of a load of the punch with an other end side of the at least one runner part being in contact with the punch, the other end side being connected to an other of the adjacent molded parts,   wherein no lead frame included in the semiconductor device is disposed in the at least one runner part.   
     
     
         9 . The semiconductor manufacturing apparatus according to  claim 2 , further comprising
 dies supporting the plurality of molded parts from below when at least one runner part connecting the molded parts is cut, the molded parts being adjacent to each other.   
     
     
         10 . The semiconductor manufacturing apparatus according to  claim 3 , further comprising
 dies supporting the plurality of molded parts from below when at least one runner part connecting the molded parts is cut, the molded parts being adjacent to each other.   
     
     
         11 . The semiconductor manufacturing apparatus according to  claim 4 , further comprising
 dies supporting the plurality of molded parts from below when at least one runner part connecting the molded parts is cut, the molded parts being adjacent to each other.   
     
     
         12 . The semiconductor manufacturing apparatus according to  claim 5 , further comprising
 dies supporting the plurality of molded parts from below when at least one runner part connecting the molded parts is cut, the molded parts being adjacent to each other.   
     
     
         13 . The semiconductor manufacturing apparatus according to  claim 6 , further comprising
 dies supporting the plurality of molded parts from below when at least one runner part connecting the molded parts is cut, the molded parts being adjacent to each other.