Maintenance method of plating apparatus

Abstract

Provided is a technique that allows suppressing a deformation of a membrane arranged in an inside of a plating tank. A maintenance method of plating apparatus includes circulating an anode liquid between an anode liquid tank and an anode chamber after having returned the anode liquid in the anode chamber to the anode liquid tank (step S 10 e ), and circulating a cathode liquid between a cathode liquid tank and a cathode chamber after having returned the cathode liquid in the cathode chamber to the cathode liquid tank and after the circulation of the anode liquid between the anode liquid tank and the anode chamber is started (step S 10 f ).

1 . A maintenance method of plating apparatus, comprising:
 returning an anode liquid remaining in an anode chamber partitioned below a membrane in an inside of a plating tank to an anode liquid tank for accumulating an anode liquid;   returning a cathode liquid remaining in a cathode chamber partitioned above the membrane in the inside of the plating tank to a cathode liquid tank for accumulating a cathode liquid;   circulating the anode liquid between the anode liquid tank and the anode chamber after having returned the anode liquid remaining in the anode chamber to the anode liquid tank; and   circulating the cathode liquid between the cathode liquid tank and the cathode chamber after having returned the cathode liquid remaining in the cathode chamber to the cathode liquid tank and after the circulation of the anode liquid between the anode liquid tank and the anode chamber is started.   
     
     
         2 . The maintenance method of plating apparatus according to  claim 1 , further comprising
 replenishing an anode liquid supplied from an anode liquid supply device into the anode liquid tank such that a liquid surface level of the anode liquid accumulated in the anode liquid tank becomes equal to or more than a predetermined level when the liquid surface level of the anode liquid accumulated in the anode liquid tank is less than the predetermined level set in advance.   
     
     
         3 . The maintenance method of plating apparatus according to  claim 2 , wherein
 the circulating of the anode liquid between the anode liquid tank and the anode chamber is performed after having returned the anode liquid remaining in the anode chamber to the anode liquid tank and when the liquid surface level of the anode liquid accumulated in the anode liquid tank is equal to or more than the predetermined level.   
     
     
         4 . The maintenance method of plating apparatus according to any one of  claims 1 to 3 , further comprising
 replenishing a cathode liquid supplied from a cathode liquid supply device into the cathode liquid tank such that a liquid surface level of the cathode liquid accumulated in the cathode liquid tank becomes equal to or more than a predetermined level when the liquid surface level of the cathode liquid accumulated in the cathode liquid tank is less than the predetermined level set in advance.   
     
     
         5 . The maintenance method of plating apparatus according to  claim 4 , further comprising
 returning the cathode liquid accumulated in the cathode liquid tank to the cathode liquid tank after having caused the cathode liquid to flow bypassing the cathode chamber before the circulating of the cathode liquid between the cathode liquid tank and the cathode chamber when the liquid surface level of the cathode liquid accumulated in the cathode liquid tank is equal to or more than the predetermined level.   
     
     
         6 . The maintenance method of plating apparatus according to any one of  claims 1 to 5 , wherein
 the circulating of the anode liquid between the anode liquid tank and the anode chamber includes adjusting a temperature of the anode liquid flowing from the anode liquid tank toward the anode chamber within a predetermined temperature range by a temperature controller.   
     
     
         7 . The maintenance method of plating apparatus according to any one of  claims 1 to 6 , wherein
 the circulating of the cathode liquid between the cathode liquid tank and the cathode chamber includes adjusting a temperature of the cathode liquid flowing from the cathode liquid tank toward the cathode chamber within a predetermined temperature range by a temperature controller.