Radio-frequency module and communication apparatus

Abstract

A radio-frequency module includes a mounting substrate having a first main surface, an electronic component, and a second receive filter. The electronic component includes a transmit filter and a first receive filter and is disposed on the first main surface of the mounting substrate. The second receive filter is stacked on the electronic component. The pass band of the transmit filter and that of the second receive filter do not exactly match each other. In a plan view in a thickness direction of the mounting substrate, a first region of the electronic component where the first receive filter is located overlaps or matches the second receive filter, and a second region of the electronic component where the transmit filter is located overlaps none of filters disposed on the first main surface of the mounting substrate.

What is claimed is: 
     
         1 . A radio-frequency module comprising:
 a mounting substrate having first and second main surfaces;   an electronic component that includes a transmit filter and a first receive filter and that is disposed on the first main surface of the mounting substrate; and   a second receive filter stacked on the electronic component, wherein   a pass band of the transmit filter and a pass band of the second receive filter do not exactly match each other, and   in a plan view in a thickness direction of the mounting substrate,
 a first region of the electronic component where the first receive filter is located overlaps or matches the second receive filter, and 
 a second region of the electronic component where the transmit filter is located overlaps none of filters disposed on the first main surface of the mounting substrate. 
   
     
     
         2 . The radio-frequency module according to  claim 1 , wherein:
 the electronic component has a through-via which passes through the first region in the thickness direction of the mounting substrate; and   the through-via has a first end and a second end, the first end being connected to the second receive filter, the second end being connected to the mounting substrate or the first receive filter.   
     
     
         3 . The radio-frequency module according to  claim 1 , further comprising:
 a third receive filter,   wherein the radio-frequency module is able to perform simultaneous communication using a signal of a first band which passes through the transmit filter and a signal of a second band which passes through the third receive filter, and   wherein the third receive filter is disposed on the second main surface of the mounting substrate.   
     
     
         4 . The radio-frequency module according to  claim 3 , wherein, in a plan view in the thickness direction of the mounting substrate, the second region of the electronic component and the third receive filter do not overlap each other. 
     
     
         5 . The radio-frequency module according to  claim 4 , wherein:
 the radio-frequency module is able to perform communication using a signal of a third band which passes through the second receive filter; and   the radio-frequency module does not perform simultaneous communication using a signal of the third band and a signal of the first band.   
     
     
         6 . The radio-frequency module according to  claim 3 , further comprising:
 a shield member disposed on the second main surface of the mounting substrate,   wherein the shield member is located substantially around the third receive filter.   
     
     
         7 . The radio-frequency module according to  claim 3 , wherein:
 the radio-frequency module includes a plurality of the third receive filters; and   the electronic component is assumed as a first electronic component, and the plurality of the third receive filters are included in a second electronic component, the second electronic component being disposed on the second main surface of the mounting substrate.   
     
     
         8 . The radio-frequency module according to  claim 7 , wherein the plurality of the third receive filters include a filter that allows a signal of Band 12 of 3GPP LTE standards to pass therethrough, a filter that allows a signal of Band 13 of 3GPP LTE standards to pass therethrough, and a filter that allows a signal of Band 14 of 3GPP LTE standards to pass therethrough. 
     
     
         9 . A communication apparatus comprising:
 the radio-frequency module according to  claim 1 ; and   a signal processing circuit connected to the radio-frequency module.   
     
     
         10 . The radio-frequency module according to  claim 3 , wherein:
 the radio-frequency module is able to perform communication using a signal of a third band which passes through the second receive filter; and   the radio-frequency module does not perform simultaneous communication using a signal of the third band and a signal of the first band.   
     
     
         11 . The radio-frequency module according to  claim 1 , wherein:
 the electronic component has a through-via which passes through the first region in the thickness direction of the mounting substrate.   
     
     
         12 . The radio-frequency module according to  claim 1 , wherein:
 the through-via has a first end and a second end, the first end being connected to the second receive filter, the second end being connected to the mounting substrate or the first receive filter.   
     
     
         13 . The radio-frequency module according to  claim 2 , further comprising:
 a third receive filter,   wherein the radio-frequency module is able to perform simultaneous communication using a signal of a first band which passes through the transmit filter and a signal of a second band which passes through the third receive filter, and   wherein the third receive filter is disposed on the second main surface of the mounting substrate.   
     
     
         14 . The radio-frequency module according to  claim 13 , wherein, in a plan view in the thickness direction of the mounting substrate, the second region of the electronic component and the third receive filter do not overlap each other. 
     
     
         15 . The radio-frequency module according to  claim 14 , wherein:
 the radio-frequency module is able to perform communication using a signal of a third band which passes through the second receive filter; and   the radio-frequency module does not perform simultaneous communication using a signal of the third band and a signal of the first band.   
     
     
         16 . The radio-frequency module according to  claim 13 , further comprising:
 a shield member disposed on the second main surface of the mounting substrate,   wherein the shield member is located substantially around the third receive filter.   
     
     
         17 . The radio-frequency module according to  claim 13 , wherein:
 the radio-frequency module includes a plurality of the third receive filters; and   the electronic component is assumed as a first electronic component, and the plurality of the third receive filters are included in a second electronic component, the second electronic component being disposed on the second main surface of the mounting substrate.   
     
     
         18 . The radio-frequency module according to  claim 17 , wherein the plurality of the third receive filters include a filter that allows a signal of Band 12 of 3GPP LTE standards to pass therethrough, a filter that allows a signal of Band 13 of 3GPP LTE standards to pass therethrough, and a filter that allows a signal of Band 14 of 3GPP LTE standards to pass therethrough. 
     
     
         19 . A communication apparatus comprising:
 the radio-frequency module according to  claim 3 ; and   a signal processing circuit connected to the radio-frequency module.   
     
     
         20 . A communication apparatus comprising:
 the radio-frequency module according to  claim 13 ; and   a signal processing circuit connected to the radio-frequency module.