Thermal management apparatus and method

Abstract

Aspects of the disclosure are directed to thermal management. In accordance with one aspect, an apparatus includes a metal mesh layer; a porous metal powder layer coupled to the metal mesh layer; and a metal substrate coupled to the porous metal powder layer. In accordance with one aspect, a method includes introducing a working fluid from a condenser structure into a boiler structure to generate a vaporized fluid; transporting the vaporized fluid through a hybrid wick structure coupled to the boiler structure to generate a pressurized fluid; and injecting the pressurized fluid into the condenser structure to convert the pressurized fluid into a condensed fluid.

What is claimed is: 
     
         1 . An apparatus comprising:
 a metal mesh layer;   a porous metal powder layer coupled to the metal mesh layer; and   a metal substrate coupled to the porous metal powder layer.   
     
     
         2 . The apparatus of  claim 1  further comprising a working fluid surrounding the metal mesh layer, the porous metal powder layer and the metal substrate. 
     
     
         3 . The apparatus of  claim 2 , wherein heat flows through the metal substrate, the porous metal powder layer and the metal mesh layer to the working fluid. 
     
     
         4 . The apparatus of  claim 2 , wherein the metal mesh layer is a copper mesh layer, an aluminum mesh layer, a silver mesh layer or a metal alloy layer. 
     
     
         5 . The apparatus of  claim 2 , wherein the porous metal powder layer is a porous copper powder layer, a porous aluminum powder layer, a porous silver powder layer or a porous metal alloy powder layer. 
     
     
         6 . The apparatus of  claim 4 , wherein the porous metal powder layer is a porous copper powder layer, a porous aluminum powder layer, a porous silver powder layer or a porous metal alloy powder layer. 
     
     
         7 . The apparatus of  claim 6 , wherein the metal substrate is a copper substrate, an aluminum substrate a silver substrate or a metal alloy substrate. 
     
     
         8 . The apparatus of  claim 7 , further comprising a heat source coupled to the metal substrate, wherein heat generated from the heat source flows to the working fluid. 
     
     
         9 . The apparatus of  claim 8 , wherein the heat flows through one or more of the following: metal substrate, porous metal powder layer and metal mesh layer. 
     
     
         10 . The apparatus of  claim 2 , further comprising:
 a first boiler structure;   a condenser structure coupled to the first boiler structure; and   one or more interconnect tubes linking the first boiler structure with the condenser structure.   
     
     
         11 . The apparatus of  claim 10 , wherein the condenser structure includes one or more metal foam condenser components. 
     
     
         12 . The apparatus of  claim 10 , further comprising
 a second boiler structure; and   one or more boiler tubes linking the second boiler structure to the first boiler structure.   
     
     
         13 . The apparatus of  claim 12 , wherein the condenser structure includes one or more metal foam condenser components. 
     
     
         14 . The apparatus of  claim 1 , wherein one or more of the metal mesh layer, the porous metal powder layer or the metal substrate includes a plurality of micro cavities. 
     
     
         15 . The apparatus of  claim 1 , wherein the metal substrate includes a plurality of fins.