Electroplating apparatus for surface modification of pipes

Abstract

The electroplating apparatus for surface modification of pipes includes: a housing comprising an inner space accommodating an electrode, a plating solution, and a pipe therein, and a plating solution inlet disposed on a lower surface of the housing and allowing the plating solution to be injected therethrough; a plating auxiliary part disposed inside the housing, vertically fixing the pipe inserted into the housing, and guiding the plating solution injected into the housing to flow toward an upper portion of the housing; and an auxiliary support part disposed inside the housing, spacing the plating auxiliary part and the plating solution inlet apart from each other by a predetermined distance, and guiding the plating solution introduced through the plating solution inlet to flow in a direction, where the plating auxiliary part is disposed.

What is claimed is: 
     
         1 . An electroplating apparatus for surface modification of pipes comprising:
 a housing comprising an inner space accommodating an electrode, a plating solution, and a pipe therein, and a plating solution inlet disposed on a lower surface of the housing and allowing the plating solution to be injected therethrough;   a plating auxiliary part disposed inside the housing, vertically fixing the pipe inserted into the housing, and guiding the plating solution injected into the housing to flow toward an upper portion of the housing; and   an auxiliary support part disposed inside the housing, spacing the plating auxiliary part and the plating solution inlet apart from each other by a predetermined distance, and guiding the plating solution introduced through the plating solution inlet to flow in a direction, where the plating auxiliary part is disposed.   
     
     
         2 . The apparatus of  claim 1 , further comprising a plating solution supply pipe connected to the plating solution inlet for supplying the plating solution into the housing. 
     
     
         3 . The apparatus of  claim 1 , wherein the housing has a structure, in which the upper portion is open and the lower surface is provided with a plating solution outlet allowing the plating solution injected into the housing through the plating solution inlet to be discharged therethrough. 
     
     
         4 . The apparatus of  claim 1 , further comprising at least one discharge pipe for discharging the plating solution injected into the housing and a valve for controlling the discharge of the plating solution. 
     
     
         5 . The apparatus of  claim 1 , wherein the plating auxiliary part comprises:
 a support plate disposed inside the housing and supporting the pipe inserted into the housing;   a pipe fixing portion disposed on an upper surface of the support plate and vertically fixing the pipe inserted into the housing; and   a plating solution guide portion disposed on the support plate and guiding the plating solution injected into the housing to flow toward the upper portion of the housing.   
     
     
         6 . The apparatus of  claim 5 , wherein a lower surface and an upper surface of the support plate are disposed parallel to the lower surface of the housing. 
     
     
         7 . The apparatus of  claim 5 , wherein the pipe fixing portion protrudes upward from the upper surface of the support plate in a ring shape having an inner diameter corresponding to an outer diameter of the pipe so that the pipe is inserted therein. 
     
     
         8 . The apparatus of  claim 5 , wherein at least one inner plating solution passage hole is disposed on the upper surface of the support plate at a position inside the pipe fixing portion, thereby allowing the plating solution injected into the housing to pass therethrough inside the pipe. 
     
     
         9 . The apparatus of  claim 5 , wherein the plating auxiliary part comprises an electrode fixing portion disposed at a center of the upper surface of the support plate and fixing the electrode inserted into the housing. 
     
     
         10 . The apparatus of  claim 1 , wherein the electrode has an outer surface spaced apart from an inner surface of the pipe by a predetermined distance. 
     
     
         11 . The apparatus of  claim 1 , wherein the auxiliary support part has an open upper portion so that the plating auxiliary part is inserted therein, and a protruding step disposed therein to support the plating auxiliary part so that the inserted plating auxiliary part does not contact with the lower surface of the housing. 
     
     
         12 . The apparatus of  claim 8 , further comprising a cover disposed inside the housing, supported by an upper end of the pipe and an upper end of the auxiliary support part, and preventing the plating solution passing through the inner plating solution passage hole from flowing between an outer surface of the pipe and an inner surface of the auxiliary support part. 
     
     
         13 . The apparatus of  claim 12 , wherein the cover comprises at least one hollow communicating with an inside of the pipe so that the plating solution passing through the inside of the pipe passes therethrough. 
     
     
         14 . The apparatus of  claim 12 , wherein the cover further comprises a cable passage hole disposed on an upper surface of the cover to allow a cable for connecting to the pipe to pass therethrough. 
     
     
         15 . The apparatus of  claim 5 , wherein the plating solution guide portion further comprises an outer plating solution passage hole disposed on the upper surface of the support plate at a position outside the pipe fixing portion, allowing the plating solution injected into the housing to pass therethrough, and guiding the plating solution to flow outside the pipe.