Plating apparatus

Abstract

An objective of the present invention is to provide a plating apparatus that allows a plating solution to smoothly contact a surface to be plated and that can inhibit bubbles from remaining on the surface to be plated. A substrate holder of the plating apparatus includes a head module that contacts and holds a substrate, a tilting module configured to tilt the head module, and an elevating/lowering module configured to elevate and lower the head module. The tilting module includes a first member, a second member supporting the head module, the second member being connected to the first member in a rotatable manner about a rotation axis, and an actuator that rotates the second member about the rotation axis. The rotation axis is offset from a center of the substrate held by the head module, and the elevating/lowering module is configured to elevate and lower the substrate holder by elevating and lowering the first member of the tilting module.

1 . A plating apparatus comprising:
 a plating tank in which a plating solution is stored, and an anode is disposed, and   a substrate holder disposed above the anode, the substrate holder holding a substrate as a cathode relative to an upper surface of the anode, the substrate holder including:
 a head module that contacts and holds the substrate, 
 a tilting module configured to tilt the head module, and 
 an elevating/lowering module configured to elevate and lower the head module, 
   wherein the tilting module includes a first member, a second member supporting the head module, the second member being connected to the first member in a rotatable manner about a rotation axis, and an actuator that rotates the second member about the rotation axis,   the rotation axis is offset from a center of the substrate held by the head module, and   the elevating/lowering module is configured to elevate and lower the substrate holder by elevating and lowering the first member of the tilting module.   
     
     
         2 . The plating apparatus according to  claim 1 , further comprising:
 a position adjustment module configured to move the head module in a horizontal direction,   wherein the position adjustment module moves the head module in the horizontal direction to compensate for horizontal movement of the center of the substrate held by the head module, when the tilting module tilts the head module.   
     
     
         3 . The plating apparatus according to  claim 2 , wherein the position adjustment module is configured to move the head module in the horizontal direction and a vertical direction and moves the head module in the horizontal direction and the vertical direction to compensate for horizontal and vertical movement of the center of the substrate held by the head module, when the tilting module tilts the head module. 
     
     
         4 . The plating apparatus according to  claim 1 , wherein the first member is a vertically extending plate-shaped member, and
 the second member is rotatably connected to the first member at an end portion in a horizontal direction.   
     
     
         5 . The plating apparatus according to  claim 1 , wherein the second member is rotatably connected to the first member on one end side in a horizontal direction and connected to the actuator on the other end side in the horizontal direction. 
     
     
         6 . The plating apparatus according to  claim 1 , wherein the rotation axis intersects with an axis extending perpendicularly through a center of a surface to be plated of the substrate. 
     
     
         7 . The plating apparatus according to  claim 1 , wherein the tilting module includes a biasing member that biases the second member in a direction in which a surface to be plated of the substrate is horizontal. 
     
     
         8 . The plating apparatus according to  claim 1 , further comprising:
 a rotation module configured to rotate the substrate about a rotation axis extending perpendicularly through a center of a surface to be plated.   
     
     
         9 . The plating apparatus according to  claim 8 , wherein the rotation module is supported on the second member. 
     
     
         10 . The plating apparatus according to  claim 1 , wherein the tilting module tilts the head module at a tilt angle in a range of 1 degree or more and 5 degrees or less. 
     
     
         11 . The plating apparatus according to  claim 1 , further comprising:
 a resistor disposed above the anode and below the substrate holder in an interior of the plating tank.