US2024240994A1PendingUtilityA1

Thermal Sensor insitu monitoring of Magnetic Recording head

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Assignee: WESTERN DIGITAL TECH INCPriority: Jan 17, 2023Filed: Jul 19, 2023Published: Jul 18, 2024
Est. expiryJan 17, 2043(~16.5 yrs left)· nominal 20-yr term from priority
Inventors:Quang LeXiaoyong LiuBrian R. YorkCherngye HwangRohan Babu NagabhiravaKuok San HoHisashi TakanoSon LeNam Hai PhamHuy H. Ho
G11B 5/3906G11B 2005/0021G01K 7/36
43
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Claims

Abstract

The present disclosure generally relates to temperature detection devices, comprising an antiferromagnetic (AFM) layer a ferromagnetic (FM) layer disposed on the AFM layer and a spin-orbit torque (SOT) material layer disposed on the FM layer. The SOT material layer may comprise: a SOT material portion; a SOT material portion and an insulating material portion; or a plurality of SOT material portions and a plurality of insulating material portions. The temperature detection devices may also have a second FM layer disposed on the SOT material layer. The temperature detection devices may also have a second AFM layer disposed on the second FM layer. In another embodiment, the temperature detection devices may also have a heat sink.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A temperature detection device, comprising:
 a temperature detection stack, comprising:
 a first antiferromagnetic (AFM) layer; 
 a first ferromagnetic (FM) layer disposed on the first AFM layer; 
 a spin-orbit torque (SOT) material layer disposed on the first FM layer, wherein the SOT material layer further comprises:
 one or more SOT material layer portions; 
 
 a second FM layer disposed on the SOT material layer; and 
 a second AFM layer disposed on the second FM layer. 
   
     
     
         2 . The temperature detection device of  claim 1 , further comprising a heat sink, wherein the heat sink is adjacent to the temperature detection stack. 
     
     
         3 . The temperature detection device of  claim 2 , wherein the temperature detection device includes a media facing surface (MFS) and wherein a first SOT material layer portion of the one or more SOT material layer portions is recessed from the MFS. 
     
     
         4 . The temperature detection device of  claim 3 , wherein the first AFM layer has a surface at the MFS. 
     
     
         5 . The temperature detection device of  claim 3 , wherein the SOT material layer further comprises an insulating material layer portion disposed between the first SOT material layer portion and the MFS. 
     
     
         6 . The temperature detection device of  claim 2 , wherein the SOT material layer further comprises one or more insulating material layer portions, wherein a first insulating material layer portion of the one or more insulating material layer portions is disposed between the one or more SOT material layer portions and the heat sink. 
     
     
         7 . The temperature detection device of  claim 6 , wherein the one or more SOT material layer portions is a first SOT material layer portion and a second SOT material layer portion. 
     
     
         8 . The temperature detection device of  claim 6 , wherein the one or more insulating material layer portions further comprises a second insulating material layer portion, wherein the second insulating material layer portion is disposed between the one or more SOT material layer portions and a media facing surface (MFS). 
     
     
         9 . The temperature detection device of  claim 2 , wherein the temperature detection stack has a first thickness and the heat sink has a second thickness, wherein the first thickness is greater than the second thickness. 
     
     
         10 . The temperature detection device of  claim 1 , wherein the SOT material layer further comprises:
 a first insulating material layer portion; and   a second insulating material layer portion,   wherein the one or more SOT material layer portions comprises a first SOT material layer portion, a second SOT material layer portion, and a third SOT material layer portion, and   wherein the first SOT material layer portion, the second SOT material layer portion, and the third SOT material layer portion are alternating with the first insulating material layer portion and the second insulating material layer portion.   
     
     
         11 . The temperature detection device of  claim 1 , wherein the SOT material layer has a first length, and the first FM layer has a second length, wherein the first length is less than the second length. 
     
     
         12 . The temperature detection device of  claim 1 , wherein the one or more SOT material layer portions comprises BiSb. 
     
     
         13 . The temperature detection device of  claim 1 , wherein the one or more SOT material layer portions comprises a topological insulator, a topological half-Heusler alloy, or a weakly oxidized heavy metal. 
     
     
         14 . The temperature detection device of  claim 13 , wherein:
 the topological insulator is BiSb, Bi 2 Se 3 , Bi2T 3 , (BiSb) 2 Te 3 , or SnTe;   the topological half-Heusler alloy is YPtBi, LuPtBi, LuPdBi, ScPtBi, YAuPb, LaPtBi, or CePtBi; and   the weakly oxidized heavy metal is WO x , TaO x , or PtO x , wherein x is a number greater than zero.   
     
     
         15 . The temperature detection device of  claim 1 , wherein the one or more SOT material layer portions comprises a seed layer. 
     
     
         16 . A magnetic recording head comprising the temperature detection device of  claim 1 . 
     
     
         17 . A magnetic recording device, comprising the magnetic recording head of  claim 16 . 
     
     
         18 . A temperature detection device, comprising:
 a spin-orbit torque (SOT) portion having a first surface at a media facing surface (MFS);   a heat sink portion disposed adjacent the SOT portion recessed from the MFS;   a first ferromagnetic (FM) portion disposed adjacent to a second surface of the SOT portion and the heat sink portion, wherein the first FM portion has a surface at the MFS;   a second FM portion disposed adjacent to a third surface of the SOT portion, the third surface being opposite the second surface, wherein the second FM portion has a surface at the MFS;   an first antiferromagnetic (AFM) portion spaced from the SOT portion and disposed adjacent to the first FM portion and the heat sink portion, wherein the first AFM portion has a surface disposed at the MFS; and   a second AFM portion spaced from the SOT portion and disposed adjacent the second FM portion and the heat sink portion, wherein the second AFM portion has a surface disposed at the MFS.   
     
     
         19 . The temperature detection device of  claim 18 , wherein the SOT portion comprises a seed layer, a buffer layer, a nucleation layer, a SOT material sub-layer, an interlayer, a barrier layer, a cap layer, and an electrode. 
     
     
         20 . The temperature detection device of  claim 18 , wherein the SOT portion comprises a seed layer, a texture layer, a buffer layer, a nucleation layer, a SOT material sub-layer, a first interlayer, a second interlayer, a barrier layer, and a cap layer. 
     
     
         21 . The temperature detection device of  claim 18 , wherein the SOT portion comprises a seed layer, a texture layer, a buffer layer, a SOT material sub-layer, an interlayer, and a cap layer. 
     
     
         22 . A magnetic recording head comprising the temperature detection device of  claim 18 . 
     
     
         23 . The magnetic recording head of  claim 22 , further comprising a read head and a write head, wherein the temperature detection device is disposed adjacent to the write head. 
     
     
         24 . A magnetic recording device, comprising the magnetic recording head of  claim 22 . 
     
     
         25 . A temperature detection device, comprising:
 a spin-orbit torque (SOT) portion having a first surface at a media facing surface (MFS), a second surface opposite the first surface, a third surface connecting the first and second surfaces, and a fourth surface opposite the third surface, wherein the first surface has a first length and the third surface has a second length, and wherein the first length is greater than the second length;   a heat sink portion disposed adjacent the SOT portion;   a ferromagnetic (FM) portion disposed adjacent to the SOT portion; and   an antiferromagnetic (AFM) portion spaced from the SOT portion and disposed adjacent the FM portion and the heat sink portion.   
     
     
         26 . The temperature detection device of  claim 25 , wherein the FM portion has a fifth surface disposed at the MFS, a sixth surface opposite the fifth surface, a seventh surface connecting the fifth surface to the sixth surface, and an eighth surface opposite the seventh surface, wherein the fifth surface has a third length, wherein the seventh surface has a fourth length, and wherein the third length is greater than the first length. 
     
     
         27 . The temperature detection device of  claim 26 , wherein the fourth length is greater than the third length. 
     
     
         28 . A magnetic recording head comprising the temperature detection device of  claim 25 . 
     
     
         29 . A magnetic recording device, comprising the magnetic recording head of  claim 28 .

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