Electrolytic polishing device, system and method

Abstract

An electrolytic polishing device is provided and includes an electrolytic bath used for accommodating an electrolyte. A polishing channel for a to-be-polished workpiece to pass through is provided in the electrolytic bath. An anode plate assembly and a cathode plate assembly are arranged in the electrolytic bath along the extending direction of the polishing channel and are separated by a partition plate assembly. The anode plate assembly includes two anode plates, which are oppositely arranged and respectively located on two sides of the polishing channel. The cathode plate assembly includes two cathode plates, which are oppositely arranged and respectively located on two sides of the polishing channel. The partition plate assembly includes two partition plates, which are oppositely arranged and respectively located on two sides of the polishing channel. The anode plate assembly and the cathode plate assembly can be connected with a power supply.

What is claimed is: 
     
         1 . An electrolytic polishing device, comprising an electrolytic bath used for accommodating electrolyte, wherein a polishing channel for a to-be-polished workpiece to pass through is provided in the electrolytic bath, an anode plate assembly and a cathode plate assembly are also provided in the electrolytic bath along an extending direction of the polishing channel, and the anode plate assembly and the cathode plate assembly are separated by a partition plate assembly; the anode plate assembly comprises two anode plates, which are oppositely arranged and are respectively located on two sides of the polishing channel; the cathode plate assembly comprises two cathode plates, which are oppositely arranged and are respectively located on the two sides of the polishing channel; the partition plate assembly comprises two partition plates, which are oppositely arranged and are respectively located on the two sides of the polishing channel; wherein, the anode plate assembly and the cathode plate assembly are capable of connecting with a power supply. 
     
     
         2 . The electrolytic polishing device according to  claim 1 , wherein the anode plate assembly comprises a plurality of anode plate assemblies, and the cathode plate assembly comprises a plurality of cathode plate assemblies, and the plurality of anode plate assemblies and the plurality of cathode plate assemblies are alternately arranged. 
     
     
         3 . The electrolytic polishing device according to  claim 1 , wherein the anode plate assembly comprises one anode plate assembly, the cathode plate assembly comprises two cathode plate assemblies, and the two cathode plate assemblies are respectively located on two sides of the one anode plate assembly. 
     
     
         4 . The electrolytic polishing device according to  claim 3 , wherein a plurality of partition plate assemblies are arranged between the two cathode plate assemblies and side walls of the electrolytic bath. 
     
     
         5 . The electrolytic polishing device according to  claim 1 , further comprising an electrolyte tank, and the electrolyte tank is connected with the electrolytic bath for providing the electrolyte for the electrolyte tank. 
     
     
         6 . The electrolytic polishing device according to  claim 5 , wherein the electrolyte tank is located below the electrolytic bath and is capable of surrounding a bottom of the electrolytic bath; an opening is formed in a side wall, along the extending direction of the polishing channel, of the electrolytic bath, and the electrolyte in the electrolytic bath is capable of falling into the electrolyte tank through the opening; and the electrolyte tank is connected with the electrolytic bath through a pipeline and an acid-resistant pump, thereby providing the electrolyte for the electrolytic bath. 
     
     
         7 . The electrolytic polishing device according to  claim 6 , wherein an electrolyte chamber is formed in the bottom of the electrolytic bath, the electrolyte tank is connected with the electrolyte chamber through the pipeline, and a plurality of jet holes for spraying the electrolyte into the electrolytic bath are formed in a top of the electrolyte chamber. 
     
     
         8 . An electrolytic polishing system, comprising a cleaning device and the electrolytic polishing device according to  claim 1 , wherein the cleaning device is capable of cleaning the to-be-polished workpiece after polishing is completed. 
     
     
         9 . An electrolytic polishing method, using the electrolytic polishing device according to  claim 1 , and comprising:
 S1, putting a to-be-polished workpiece into the polishing channel to move along the polishing channel for polishing; and   S2, after the polishing is completed, taking out the to-be-polished workpiece.   
     
     
         10 . The electrolytic polishing method according to  claim 9 , further comprising the following steps after the step S2:
 S21, cleaning the to-be-polished workpiece after the polishing is completed;   S22, drying the to-be-polished workpiece after the cleaning is completed; and   S23, measuring a surface roughness of the to-be-polished workpiece after the drying is completed.   
     
     
         11 . The electrolytic polishing system according to  claim 8 , wherein, the electrolytic polishing device comprises an electrolytic bath used for accommodating electrolyte, wherein a polishing channel for a to-be-polished workpiece to pass through is provided in the electrolytic bath, an anode plate assembly and a cathode plate assembly are also provided in the electrolytic bath along an extending direction of the polishing channel, and the anode plate assembly and the cathode plate assembly are separated by a partition plate assembly; the anode plate assembly comprises two anode plates, which are oppositely arranged and are respectively located on two sides of the polishing channel; the cathode plate assembly comprises two cathode plates, which are oppositely arranged and are respectively located on the two sides of the polishing channel; the partition plate assembly comprises two partition plates, which are oppositely arranged and are respectively located on the two sides of the polishing channel; wherein, the anode plate assembly and the cathode plate assembly are capable of connecting with a power supply 
     
     
         12 . The electrolytic polishing system according to  claim 11 , wherein the anode plate assembly comprises a plurality of anode plate assemblies, and the cathode plate assembly comprises a plurality of cathode plate assemblies, and the plurality of anode plate assemblies and the plurality of cathode plate assemblies are alternately arranged. 
     
     
         13 . The electrolytic polishing system according to  claim 11 , wherein the anode plate assembly comprises one anode plate assembly, the cathode plate assembly comprises two cathode plate assemblies, and the two cathode plate assemblies are respectively located on two sides of the one anode plate assembly. 
     
     
         14 . The electrolytic polishing system according to  claim 13 , wherein a plurality of partition plate assemblies are arranged between the two cathode plate assemblies and side walls of the electrolytic bath. 
     
     
         15 . The electrolytic polishing system according to  claim 11 , further comprising an electrolyte tank, and the electrolyte tank is connected with the electrolytic bath for providing the electrolyte for the electrolyte tank. 
     
     
         16 . The electrolytic polishing system according to  claim 15 , wherein the electrolyte tank is located below the electrolytic bath and is capable of surrounding a bottom of the electrolytic bath; an opening is formed in a side wall, along the extending direction of the polishing channel, of the electrolytic bath, and the electrolyte in the electrolytic bath is capable of falling into the electrolyte tank through the opening; and the electrolyte tank is connected with the electrolytic bath through a pipeline and an acid-resistant pump, thereby providing the electrolyte for the electrolytic bath. 
     
     
         17 . The electrolytic polishing system according to  claim 16 , wherein an electrolyte chamber is formed in the bottom of the electrolytic bath, the electrolyte tank is connected with the electrolyte chamber through the pipeline, and a plurality of jet holes for spraying the electrolyte into the electrolytic bath are formed in a top of the electrolyte chamber. 
     
     
         18 . The electrolytic polishing method according to  claim 9 , wherein, the electrolytic polishing device comprises an electrolytic bath used for accommodating electrolyte, wherein a polishing channel for a to-be-polished workpiece to pass through is provided in the electrolytic bath, an anode plate assembly and a cathode plate assembly are also provided in the electrolytic bath along an extending direction of the polishing channel, and the anode plate assembly and the cathode plate assembly are separated by a partition plate assembly; the anode plate assembly comprises two anode plates, which are oppositely arranged and are respectively located on two sides of the polishing channel; the cathode plate assembly comprises two cathode plates, which are oppositely arranged and are respectively located on the two sides of the polishing channel; the partition plate assembly comprises two partition plates, which are oppositely arranged and are respectively located on the two sides of the polishing channel; wherein, the anode plate assembly and the cathode plate assembly are capable of connecting with a power supply. 
     
     
         19 . The electrolytic polishing method according to  claim 18 , wherein the anode plate assembly comprises a plurality of anode plate assemblies, and the cathode plate assembly comprises a plurality of cathode plate assemblies, and the plurality of anode plate assemblies and the plurality of cathode plate assemblies are alternately arranged. 
     
     
         20 . The electrolytic polishing method according to  claim 18 , wherein the anode plate assembly comprises one anode plate assembly, the cathode plate assembly comprises two cathode plate assemblies, and the two cathode plate assemblies are respectively located on two sides of the one anode plate assembly.