Electronic assembly and electronic device

Abstract

An electronic assembly includes a circuit board assembly and a liquid cold plate. The circuit board assembly includes a board, a first heat-generating component, and a second heat-generating component, where the first heat-generating component and the second heat-generating component are disposed on the board. The liquid cold plate includes a liquid inlet and a liquid outlet. The liquid cold plate includes a first cooling region and a second cooling region, where the second cooling region is closer to the liquid outlet than the first cooling region. A heat dissipation capability of the first cooling region is stronger than that of the second cooling region. A heat-generating density of the first heat-generating component is greater than that of the second heat-generating component, the first heat-generating component is thermally connected to the first cooling region, and the second heat-generating component is thermally connected to the second cooling region.

1 . An electronic assembly, comprising:
 a circuit board assembly; and   a liquid cold plate;   wherein the circuit board assembly comprises a board, a first heat-generating component, and a second heat-generating component;   wherein the first heat-generating component and the second heat-generating component are disposed on the board, and a heat-generating density of the first heat-generating component is greater than that of the second heat-generating component;   wherein the liquid cold plate comprises a liquid inlet and a liquid outlet, and a cooling working medium flows into the liquid cold plate from the liquid inlet and flows out of the liquid cold plate from the liquid outlet; and   wherein the liquid cold plate comprises a first cooling region and a second cooling region, the second cooling region is closer to the liquid outlet than the first cooling region, the first heat-generating component is thermally connected to the first cooling region, and the second heat-generating component is thermally connected to the second cooling region.   
     
     
         2 . The electronic assembly according to  claim 1 , wherein there are a plurality of first heat dissipation fins in the first cooling region, there are a plurality of second heat dissipation fins in the second cooling region, and a density of the plurality of first heat dissipation fins is greater than that of the plurality of second heat dissipation fins. 
     
     
         3 . The electronic assembly according to  claim 2 , further comprising a shovel tooth radiator, wherein the shovel tooth radiator is disposed in the first cooling region, and the shovel tooth radiator is fixedly connected to the liquid cold plate. 
     
     
         4 . The electronic assembly according to  claim 1 , further comprising:
 a spoiler, wherein the spoiler comprises a plurality of protrusion structures;   wherein the first cooling region comprises a plurality of fourth heat dissipation fins, each protrusion structure in the plurality of protrusion structures and each fourth heat dissipation fin in the plurality of fourth heat dissipation fins are sequentially disposed spaced from each other, and there is a preset gap between a protrusion structure and a fourth heat dissipation fin that are adjacent.   
     
     
         5 . The electronic assembly according to  claim 4 , wherein each protrusion structure in the plurality of protrusion structures is a trapezoidal tooth or a cambered tooth. 
     
     
         6 . The electronic assembly according to  claim 4 ,
 wherein the liquid cold plate comprises a die-cast liquid cold plate and a cover plate, and the die-cast liquid cold plate is covered by the cover plate to form a passageway; and   wherein the spoiler comprises a positioning piece, the positioning piece is connected to the die-cast liquid cold plate in a position limiting manner, and the spoiler is crimped between the cover plate and the die-cast liquid cold plate.   
     
     
         7 . The electronic assembly according to  claim 2 , wherein a distance between two surfaces that are of the first cooling region and the first heat-generating component and that face each other is less than or equal to 0.1 mm. 
     
     
         8 . The electronic assembly according to  claim 7 , wherein the first heat-generating component is thermally connected to the first cooling region by using a first thermal connection layer. 
     
     
         9 . The electronic assembly according to  claim 2 , wherein a gluing groove is disposed on a side that is of the second cooling region and that faces the second heat-generating component, the second heat-generating component is located in the gluing groove, and the second heat-generating component is thermally connected to the gluing groove by using pouring sealant. 
     
     
         10 . The electronic assembly according to  claim 9 , wherein one second heat-generating component is accommodated in one gluing groove. 
     
     
         11 . The electronic assembly according to  claim 9 , wherein a gap between the second heat-generating component and the gluing groove is less than or equal to a preset width. 
     
     
         12 . The electronic assembly according to  claim 2 ,
 wherein the circuit board assembly further comprises a third heat-generating component, the third heat-generating component is disposed on the board, and the heat-generating density of the second heat-generating component is greater than that of the third heat-generating component; and   wherein the liquid cold plate further comprises a third cooling region, the third cooling region and the first cooling region are respectively located on two sides of the second cooling region, and the third heat-generating component is thermally connected to the third cooling region.   
     
     
         13 . The electronic assembly according to  claim 12 , wherein a distance between two surfaces that are of the third cooling region and the third heat-generating component and that face each other is less than or equal to 2.5 mm. 
     
     
         14 . The electronic assembly according to  claim 13 , wherein the third heat-generating component is thermally connected to the third cooling region by using a second thermal connection layer. 
     
     
         15 . The electronic assembly according to a  claim 2 ,
 wherein the liquid cold plate comprises a plurality of passageways, and an extension direction of the passageway intersects with a direction in which the liquid inlet faces the liquid outlet; and   wherein the plurality of passageways are sequentially connected in series, and columnar teeth are disposed between two adjacent passageways.   
     
     
         16 . The electronic assembly according to  claim 2 , wherein the circuit board assembly comprises at least two first heat-generating components, the first cooling region comprises a main passageway and at least two sub-passageways, the at least two sub-passageways are thermally connected to the at least two first heat-generating components in a one-to-one correspondence manner, and the at least two sub-passageways are separately connected to the main passageway. 
     
     
         17 . The electronic assembly according to  claim 2 , wherein the electronic assembly is a charger. 
     
     
         18 . A charging pile, comprising:
 a housing; and   a plurality of electronic assemblies, wherein electronic assemblies in the plurality of electronic assemblies are installed inside the housing,   wherein each electronic assembly in the plurality of electronic assemblies comprises a circuit board assembly and a liquid cold plate, wherein the circuit board assembly comprises a board, a first heat-generating component, and a second heat-generating component, wherein the first heat-generating component and the second heat-generating component are disposed on the board, and a heat-generating density of the first heat-generating component is greater than that of the second heat-generating component, wherein the liquid cold plate comprises a liquid inlet and a liquid outlet, and a cooling working medium flows into the liquid cold plate from the liquid inlet and flows out of the liquid cold plate from the liquid outlet; and   wherein the liquid cold plate comprises a first cooling region and a second cooling region, the second cooling region is closer to the liquid outlet than the first cooling region, the first heat-generating component is thermally connected to the first cooling region, and the second heat-generating component is thermally connected to the second cooling region.   
     
     
         19 . The charging pile according to  claim 18 , wherein, for each electronic assembly in the plurality of electronic assemblies, there are a plurality of first heat dissipation fins in the first cooling region, there are a plurality of second heat dissipation fins in the second cooling region, and a density of the plurality of first heat dissipation fins is greater than that of the plurality of second heat dissipation fins. 
     
     
         20 . The charging pile according to  claim 19 , wherein each electronic assembly in the plurality of electronic assemblies further comprises a shovel tooth radiator, wherein the shovel tooth radiator is disposed in the first cooling region of the electronic assembly, and the shovel tooth radiator is fixedly connected to the liquid cold plate of the electronic assembly.