Film forming method for forming metal film

Abstract

The method includes: placing a substrate on a mount base; covering the substrate with the screen mask including a penetrating portion of a predetermined pattern; pressing the substrate by the electrolyte membrane with a fluid pressure of a plating solution contacting the electrolyte membrane via the screen mask; and applying a voltage between an anode contacting the plating solution and the substrate so as to allow metal ions contained in the plating solution to pass through the electrolyte membrane and form a metal film derived from the metal ions in the predetermined pattern on the substrate. The substrate includes an outer edge portion formed by an opposite surface facing the screen mask and a side surface. A cushion member is disposed along the outer edge portion before pressing the substrate.

What is claimed is: 
     
         1 . A film forming method for forming a metal film, comprising:
 placing a substrate on a mount base;   covering the substrate with a screen mask including a penetrating portion of a predetermined pattern;   pressing the substrate by an electrolyte membrane with a fluid pressure of a plating solution contacting the electrolyte membrane via the screen mask; and   applying a voltage between an anode contacting the plating solution and the substrate so as to allow metal ions contained in the plating solution to pass through the electrolyte membrane and form a metal film derived from the metal ions in the predetermined pattern on the substrate,   wherein:   the substrate includes an outer edge portion formed by an opposite surface facing the screen mask and a side surface, and   a cushion member is disposed along the outer edge portion before pressing the substrate.   
     
     
         2 . The film forming method for forming a metal film according to  claim 1 , wherein:
 in placing the substrate, the substrate is housed in a recess of the mount base, the recess being formed for housing the substrate, and   in disposing the cushion member, the cushion member covers a gap formed between the side surface of the substrate and a side wall surface of the recess.   
     
     
         3 . The film forming method for forming a metal film according to  claim 2 , wherein:
 the cushion member is attached to the screen mask, and   in covering the substrate with the screen mask, the cushion member covers the gap.   
     
     
         4 . The film forming method for forming a metal film according to  claim 1 , wherein before placing the substrate, the cushion member is attached to the substrate along the outer edge portion. 
     
     
         5 . The film forming method for forming a metal film according to  claim 4 , wherein:
 the mount base includes the recess for housing the substrate,   the cushion member covers the side surface of the substrate by attaching the cushion member to the substrate, and   in placing the substrate, the substrate is housed in the recess while sandwiching the cushion member between the side wall surface of the recess and the side surface of the substrate.   
     
     
         6 . The film forming method for forming a metal film according to  claim 1 , wherein:
 the mount base includes the recess for housing the substrate,   the cushion member is attached to the side wall surface of the recess, and   in placing the substrate, the substrate is housed in the recess while sandwiching the cushion member between the side wall surface of the recess and the side surface of the substrate.   
     
     
         7 . The film forming method for forming a metal film according to  claim 1 , wherein:
 a peripheral edge of the screen mask is fixed to a frame on a side adjacent to the electrolyte membrane, and   in the frame, the screen mask covers the substrate.