Substrate rotation processing device and substrate polishing device

Abstract

A substrate drying device as a substrate rotation processing device includes: a substrate holding mechanism, holding a substrate horizontally; a rotating cover, configured to surround the substrate and having a side wall part surrounding the substrate and a bottom surface part in an inner side of the side wall part; a rotation mechanism, rotating the substrate held by the substrate holding mechanism and the rotating cover; and a gas supply nozzle, supplying gas with respect to a back surface of the substrate held by the substrate holding mechanism through the bottom surface part of the rotating cover. Multiple discharge holes for discharging gas supplied from the gas supply nozzle are formed on the bottom surface part of the rotating cover. The discharge holes have inclined surfaces formed inclined with respect to a rotating surface of the rotating cover.

What is claimed is: 
     
         1 . A substrate rotation processing device, comprising: a substrate holding mechanism, holding a substrate horizontally;
 a rotating cover, configured to surround the substrate and having a side wall part surrounding the substrate and a bottom surface part in an inner side of the side wall part;   a rotation mechanism, rotating the substrate held by the substrate holding mechanism and the rotating cover; and   a gas supply nozzle, supplying gas with respect to a back surface of the substrate held by the substrate holding mechanism through the bottom surface part of the rotating cover,   wherein a plurality of discharge holes for discharging gas supplied from the gas supply nozzle are formed on the bottom surface part of the rotating cover, and the discharge holes have inclined surfaces formed inclined with respect to a rotating surface of the rotating cover.   
     
     
         2 . The substrate rotation processing device according to  claim 1 , wherein the discharge holes are circular when the rotating cover is viewed from above. 
     
     
         3 . The substrate rotation processing device according to  claim 1 , wherein the discharge holes are rectangular when the rotating cover is viewed from above. 
     
     
         4 . The substrate rotation processing device according to  claim 1 , wherein the bottom surface part of the rotating cover is provided with a plurality of impellers formed inclined with respect to the rotating surface of the rotating cover, and the discharge holes are formed between two adjacent impellers. 
     
     
         5 . The substrate rotation processing device according to  claim 1 , further comprising a cleaning liquid supply nozzle that supplies cleaning liquid to the substrate. 
     
     
         6 . A substrate polishing device, comprising the substrate rotation processing device according to  claim 1 , wherein the substrate polishing device performs a polishing process on the substrate, and the substrate rotation processing device is a substrate drying device that performs a drying process on the substrate after the polishing process.