Film formation device for metal film

Abstract

The film formation device includes an anode made of an insoluble porous body, an electrolyte membrane disposed between a substrate serving as an anode and a cathode, and a housing provided with an accommodation chamber for storing a plating solution containing metal ions between the anode and the electrolyte membrane. The film formation device further includes a diaphragm that covers a cathode side of the anode and is attached so as to be in contact with the cathode side of the anode. The diaphragm is permeable to water and hydrogen ions and impermeable to oxygen gas. The anode is attached so as to close the opening on the side opposite to the cathode side of the accommodation housing so that the cathode side is exposed to the accommodation chamber via the diaphragm and the side opposite to the cathode side is exposed to the outside of the accommodation housing.

What is claimed is: 
     
         1 . A film formation device for a metal film, the film formation device comprising:
 an anode;   an electrolyte membrane disposed between the anode and a substrate, the substrate serving as a cathode;   an accommodation housing provided with an accommodation chamber that accommodates a plating solution containing a metal ion between the anode and the electrolyte membrane;   a power supply device that applies a voltage between the anode and the substrate; and   a pressurizing device that pressurizes the plating solution accommodated in the accommodation chamber,   wherein the electrolyte membrane is attached so as to cover an opening of the accommodation housing on the cathode side, the opening communicating with the accommodation chamber,   wherein the film formation device forms the metal film on a surface of the substrate by reducing the metal ion impregnated in the electrolyte membrane by applying the voltage while pressing the surface of the substrate with the electrolyte membrane,   wherein the film formation device further includes a diaphragm that is attached so as to cover a surface of the anode on the cathode side and contact the surface of the anode on the cathode side,   wherein the diaphragm is a membrane that is permeable to water and a hydrogen ion, and impermeable to oxygen gas,   wherein the anode is attached so as to close an opening of the accommodation housing on a side opposite to the cathode side in such a manner that the surface of the anode on the cathode side is exposed to the accommodation chamber via the diaphragm, and a surface of the anode on a side opposite to the cathode side is exposed to an outside of the accommodation housing, the opening communicating with the accommodation chamber, and   wherein the anode is made of a porous body insoluble in the plating solution.