Copper-based alloy and metal matrix composite formed using same

Abstract

The disclosure relates generally to copper-based alloys, and more particularly to copper-based alloys adapted for forming metal matrix composite (MMC) materials, and to methods of making the MMC materials. In one aspect, an alloy for forming a matrix of an MMC material has an elemental composition including: manganese (Mn) at 5.6-10.4 weight percent (wt. %); nickel (Ni) at 3.5-6.5 wt. %; tin (Sn) at 1.4-4 wt. %; and copper (Cu) exceeding 55 wt. % and up to a balance of the elemental composition. The alloy has a solidus temperature lower than a melting temperature of Cu.

1 . An alloy comprising:
 manganese (Mn) at 5.6-10.4 weight percent (wt. %);   nickel (Ni) at 3.5-6.5 wt. %;   tin (Sn) at 1.4-4 wt. %; and   copper (Cu) exceeding 55 wt. % and up to a balance of the alloy,   wherein the alloy has a solidus temperature lower than a melting temperature of Cu.   
     
     
         2 . The alloy of  claim 1 , wherein the alloy comprises tin (Sn) at 1.4-2.6 wt. %. 
     
     
         3 . The alloy of  claim 1 , wherein the solidus temperature is lower than 1300 K. 
     
     
         4 . The alloy of  claim 1 , wherein the alloy forms a single phase solid solution having a face-centered cubic (FCC) crystal structure from a solidus temperature down to at least 400 K below the solidus temperature. 
     
     
         5 . The alloy of  claim 1 , wherein greater than 90 wt. % of the alloy is a single phase solid solution with a face-centered cubic (FCC) crystal structure at room temperature. 
     
     
         6 . The alloy of  claim 1 , wherein the alloy further comprises up to 2 wt. % of impurities. 
     
     
         7 . The alloy of  claim 1 , wherein the elemental composition does not include one or more of Si, B and Zn. 
     
     
         8 . The alloy of  claim 1 , wherein the alloy has an electrical conductivity higher than 2.5 MS/m. 
     
     
         9 . The alloy of  claim 1 , wherein the alloy has a thermal conductivity higher than 10 W/mK. 
     
     
         10 . The alloy of  claim 1 , wherein the alloy forms a matrix of a metal matrix composite (MMC) material, wherein the MMC material further comprises tungsten carbide particles. 
     
     
         11 . The alloy of  claim 10 , wherein the MMC material forms part of a drilling component. 
     
     
         12 . The alloy of  claim 10 , wherein the MMC material has a toughness greater than 4,000 in*lbf.in 3 . 
     
     
         13 . The alloy of  claim 1 , wherein the alloy is part of a feedstock for forming a metal matrix composite (MMC) material and wherein the feedstock further comprises tungsten carbide particles. 
     
     
         14 . A metal matrix composite material comprising reinforcement particles embedded in a copper-based matrix, wherein the copper-based matrix comprises greater than 55 wt. % copper (Cu) and greater than 1.4 wt. % tin (Sn). 
     
     
         15 . The metal matrix composite material of  claim 14 , wherein the copper-based matrix comprises:
 1.4-4 wt. % tin (Sn);   5.6-10.4 wt. % manganese (Mn); and   3.5-6.5 wt. % nickel (Ni),   wherein the copper-based matrix has a solidus temperature lower than Cu.   
     
     
         16 . The metal matrix composite material of  claim 15 , wherein the copper-based matrix comprises 1.4-2.6 wt. % tin (Sn). 
     
     
         17 . The metal matrix composite material of  claim 14 , wherein the solidus temperature of the copper-based matrix is lower than 1300 K. 
     
     
         18 . The metal matrix composite material of  claim 14 , wherein the copper-based matrix forms a single phase solid solution having a face-centered cubic (FCC) crystal structure from a solidus temperature down to at least 400K below the solidus temperature. 
     
     
         19 . The metal matrix composite material of  claim 14 , wherein greater than 90 wt. % of the copper-based matrix is a single-phase solid solution having a face-centered cubic (FCC) crystal structure at room temperature. 
     
     
         20 . The metal matrix composite material of  claim 14 , wherein the copper-based matrix comprises 2 wt. % or less of impurities. 
     
     
         21 . The metal matrix composite material of  claim 14 , wherein the copper-based matrix does not include one or more of Si, B and Zn. 
     
     
         22 . The metal matrix composite material of  claim 14 , wherein the copper-based matrix has an electrical conductivity higher than 2.5 MS/m. 
     
     
         23 . The metal matrix composite material of  claim 14 , wherein the copper-based matrix has a thermal conductivity higher than 10 W/mK. 
     
     
         24 . The metal matrix composite material of  claim 14 , wherein the reinforcement particles comprise tungsten carbide particles. 
     
     
         25 . The metal matrix composite material of  claim 24 , wherein tungsten carbide particles comprise 50-70 vol. % of the metal matrix composite material. 
     
     
         26 . The metal matrix composite material of  claim 24 , wherein the tungsten carbide particles have an average particle size of 1-200 μm. 
     
     
         27 . The metal matrix composite material of  claim 24 , wherein the tungsten carbide particles have a spheroidal shape having ratio, between a first length along a major axis and a second length along a minor axis, of 1.20 or lower. 
     
     
         28 . The metal matrix composite material of  claim 24 , wherein the tungsten carbide particles have a surface that is textured to have a grain boundary area fraction greater than 5.0%. 
     
     
         29 . The metal matrix composite material of  claim 14 , wherein the metal matrix composite material has a transverse rupture strength exceeding 175 ksi. 
     
     
         30 . The metal matrix composite material of  claim 14 , wherein the metal matrix composite material forms part of a drilling component.