Method of manufacturing composite article

Abstract

A method of manufacturing a composite article includes providing a polishing pad; rubbing over the polishing pad to produce a polishing pad debris; collecting the polishing pad debris; providing a wood material; and applying a force over the wood material and the polishing pad debris to form the composite article, wherein the composite article includes the wood material and the polishing pad debris, and the rubbing of the polishing pad includes removing a portion of the polishing pad to produce the polishing pad debris.

1 . A method of manufacturing a composite article, comprising:
 rubbing a polishing pad to produce polishing pad debris;   collecting the polishing pad debris;   providing a wood material; and   applying a force over the wood material and the polishing pad debris to form the composite article including the wood material and the polishing pad debris.   
     
     
         2 . The method of  claim 1 , wherein the rubbing of the polishing pad includes grinding a semiconductor structure by the polishing pad. 
     
     
         3 . The method of  claim 2 , wherein the semiconductor structure is a substrate or a wafer. 
     
     
         4 . The method of  claim 1 , wherein the polishing pad and the polishing pad debris include polyurethane (PU). 
     
     
         5 . The method of  claim 1 , wherein a thickness of the polishing pad is reduced by the rubbing of the polishing pad. 
     
     
         6 . The method of  claim 1 , wherein the rubbing of the polishing pad includes removing a portion of the polishing pad. 
     
     
         7 . The method of  claim 1 , wherein a first content of the polishing pad debris in the composite article is less than a second content of the wood material in the composite article. 
     
     
         8 . The method of  claim 7 , wherein a ratio of the first content to the second content is about 3:7. 
     
     
         9 . The method of  claim 1 , wherein the application of the force includes compressing the wood material and the polishing pad debris to form the composite article. 
     
     
         10 . The method of  claim 1 , further comprising assembling the composite article with a plurality of wooden bars to form a pallet. 
     
     
         11 . The method of  claim 1 , wherein the composite article is in a block configuration. 
     
     
         12 . A method of manufacturing a composite article, comprising:
 providing a polishing pad;   providing a semiconductor structure disposed above the polishing pad;   polishing the semiconductor structure by the polishing pad;   collecting polishing pad debris produced upon the polishing;   providing a wood material; and   compressing the wood material and the polishing pad debris to form the composite article,   
       wherein the polishing pad debris includes a portion of the polishing pad removed from the polishing pad upon the polishing. 
     
     
         13 . The method of  claim 12 , wherein the polishing pad debris is cleaned prior to the compression. 
     
     
         14 . The method of  claim 12 , further comprising:
 providing a plurality of wooden bars arranged substantially in parallel to each other;   attaching the composite article to an end of one of the plurality of wooden bars.   
     
     
         15 . The method of  claim 12 , wherein the semiconductor structure is rotated relative to the polishing pad during the polishing. 
     
     
         16 . The method of  claim 12 , wherein the polishing pad is rotated relative to the semiconductor structure during the polishing. 
     
     
         17 . The method of  claim 12 , wherein the semiconductor structure and the polishing pad are rotated simultaneously during the polishing. 
     
     
         18 . A method of manufacturing a composite article, comprising:
 rubbing a semiconductor structure by a polishing pad to produce debris, wherein the debris includes polishing pad debris and semiconductor structure debris;   cleaning the debris;   providing a wood material; and   applying a force over the wood material and the debris after the cleaning to form the composite article.   
     
     
         19 . The method of  claim 18 , wherein the cleaning of the debris includes removing the semiconductor structure debris from the debris. 
     
     
         20 . The method of  claim 18 , wherein the semiconductor structure debris in the debris after the cleaning is almost absent.