Substrate processing apparatus and substrate processing method

Abstract

In the substrate processing apparatus, a support tray supporting a substrate is housed in an internal space of a chamber. A processing fluid is supplied into the internal space from one end side of the internal space. The support tray includes a tray member and a plurality of support members attached to the tray member in such a manner as to surround a substrate facing surface. The tray member has a downstream-side standing portion that has a downstream-side standing portion that stands upward further than the substrate facing surface while located in proximity to a peripheral surface of the substrate on a downstream side supported by the plurality of support members. An upper surface of the downstream-side standing portion is below the upper surface of the substrate in a vertical direction supported by the plurality of support members.

What is claimed is: 
     
         1 . A substrate processing apparatus that processes a substrate with a liquid adhering to an upper surface of the substrate using a processing fluid in a supercritical state, the apparatus comprising:
 a support tray including a tray member, having a substrate facing surface facing a lower surface of the substrate, and a plurality of support members attached to the tray member in such a manner as to surround the substrate facing surface, and being configured to support the substrate while separating the substrate upward from the substrate facing surface using the support members;   a chamber having an internal space capable of housing the support tray supporting the substrate; and   a fluid supplier configured to supply the processing fluid into the internal space from one end side of the internal space, thereby forming a laminar flow of the processing fluid flowing toward the other end side of the internal space along the upper surface of the substrate supported by the support tray, wherein   with the other end side of the internal space with respect to a first virtual line defined as a downstream side, the first virtual line passing through a center of the substrate facing surface and extending in a horizontal direction perpendicular to a flow direction of the laminar flow,   the tray member includes a downstream-side standing portion standing upward further than the substrate facing surface while located in proximity to a peripheral surface of the substrate on the downstream side supported by the plurality of support members, and   the downstream-side standing portion has an upper surface below the upper surface of the substrate in a vertical direction supported by the plurality of support members.   
     
     
         2 . The substrate processing apparatus according to  claim 1 , wherein
 the upper surface of the downstream-side standing portion is an inclined surface that becomes lower in height as the inclined surface extends further in the flow direction.   
     
     
         3 . The substrate processing apparatus according to  claim 2 , wherein
 with one side and the other side of the first virtual line with respect to a second virtual line defined as a left side and a right side respectively, the second virtual line passing through the center of the substrate facing surface and extending parallel to the flow direction,   the inclined surface has a left-side inclined region and a right-side inclined region, the left-side inclined region becoming lower in height as the left-side inclined region extends further from the second virtual line toward the left side, the right-side inclined region becoming lower in height as the right-side inclined region extends further from the second virtual line toward the right side.   
     
     
         4 . The substrate processing apparatus according to  claim 3 , wherein
 a left-side through hole is provided through a lowermost part of the left-side inclined region in the vertical direction, and   a right-side through hole is provided through a lowermost part of the right-side inclined region in the vertical direction.   
     
     
         5 . The substrate processing apparatus according to  claim 1 , wherein
 a downstream-side through hole is provided through the downstream-side standing portion in the vertical direction.   
     
     
         6 . The substrate processing apparatus according to  claim 1 , wherein
 a substrate facing side through hole is provided through a region of the tray member in the vertical direction, the region being in the substrate facing surface and in proximity to the downstream-side standing portion.   
     
     
         7 . The substrate processing apparatus according to  claim 1 , wherein
 a gap in the vertical direction between the upper surface of the downstream-side standing portion and the upper surface of the substrate supported by the plurality of support members is equal to or greater than 0.5 mm.   
     
     
         8 . The substrate processing apparatus according to  claim 7 , wherein
 in an adjoining region where the downstream-side standing portion and the substrate supported by the plurality of support members adjoin each other, the gap in the vertical direction between the upper surface of the downstream-side standing portion and the upper surface of the substrate supported by the plurality of support members is equal to or less than 1.0 mm.   
     
     
         9 . The substrate processing apparatus according to  claim 1 , wherein
 with the one end side of the internal space with respect to the first virtual line defined as an upstream side,   the tray member includes an upstream-side standing portion standing upward further than the substrate facing surface while located in proximity to a peripheral surface of the substrate on the upstream side supported by the plurality of support members, and   the upstream-side standing portion has an upper surface at the same height as the upper surface of the substrate in the vertical direction supported by the plurality of support members.   
     
     
         10 . A substrate processing method of processing a substrate with a liquid adhering to an upper surface of the substrate using a processing fluid in a supercritical state, the method comprising:
 housing a support tray into internal space of a chamber, the support tray supporting the substrate while separating the substrate upward from a substrate facing surface using a plurality of support members attached to a tray member having the substrate facing surface facing a lower surface of the substrate in such a manner as to surround the substrate facing surface;   supplying the processing fluid into the internal space from one end side of the internal space, thereby forming a laminar flow of the processing fluid flowing toward the other end side of the internal space along the upper surface of the substrate supported by the support tray; and   discharging the liquid together with the processing fluid in the laminar flow from the upper surface of the substrate toward the other end side of the internal space, wherein   with the other end side of the internal space with respect to a first virtual line defined as a downstream side, the first virtual line passing through a center of the substrate facing surface and extending in a horizontal direction perpendicular to a flow direction of the laminar flow,   the discharging operation is performed through a downstream-side standing portion standing upward further than the substrate facing surface while located in proximity to a peripheral surface of the substrate on the downstream side supported by the plurality of support members, and having an upper surface below the upper surface of the substrate in a vertical direction supported by the plurality of support members.