Method, holder and adapter for treating microchip substrates

Abstract

Described is a method for wet-chemical treatment of microchip substrates, wherein the microchip substrates are inserted into a holding device. The holding device is docked using an adapter onto a unit for wet-chemical treatment, such as metallization.

1 . Method for wet-chemical treatment of a microchip substrate,
 the method comprising:
 Loading a holding device with at least one microchip substrate, wherein the holding device surrounds the microchip substrate, 
 Applying a polymer film onto the area of the holding device that surrounds the microchip substrate and onto the microchip substrate, 
 Producing an electrical connection between the microchip substrate and the area of the holding device surrounding the microchip substrate, 
 Executing the wet-chemical treatment, 
 At least partially removing the polymer film from the microchip substrate arranged in the holding device, and 
 Extracting the treated microchip substrate from the holding device, wherein the steps of loading the holding device, applying the polymer film, producing the electrically-conductive connection, removing the polymer film, and extracting the microchip substrate are executed independently of the wet-chemical treatment. 
   
     
     
         2 - 4 . (canceled) 
     
     
         5 . The method according to  claim 1 , wherein the polymer film is attached when the polymer film is glued on with the input of heat and application of pressing force, the heat being generated by means of laser radiation. 
     
     
         6 - 7 . (canceled) 
     
     
         8 . The method according to  claim 5 , wherein the pressing force is applied using a laser-permeable die is used. 
     
     
         9 - 11 . (canceled) 
     
     
         12 . The method according to  claim 1 , wherein a polymer film is used, which film as a strip conductor has a conductor film comprising a carrier film and at least one electrically-conductive layer. 
     
     
         13 - 14 . (canceled) 
     
     
         15 . The method according to  claim 1 , wherein as a polymer film, a dry-lacquer film is used. 
     
     
         16 - 19 . (canceled) 
     
     
         20 . The method according to  claim 1 , wherein a polymer film is used, which film as a strip conductor carries an annular conductor film, the annular conductor film being connected to the polymer film by gluing. 
     
     
         21 . The method according to  claim 1 , wherein the polymer film and/or the conductor film is/are laser-trimmed. 
     
     
         22 . (canceled) 
     
     
         23 . The method according to  claim 1 , wherein the removal of the polymer film is done by laser. 
     
     
         24 . The method according to  claim 1 , wherein the polymer film is removed chemically and/or mechanically. 
     
     
         25 . The method according to  claim 1 , wherein at least one edge of the microchip substrate is cleaned after the polymer film is removed. 
     
     
         26 . The method according to wherein the cleaning is done by means of laser. 
     
     
         27 . The method according to  claim 25 , wherein the face, the back side, and the edge of the microchip substrate are cleaned. 
     
     
         28 . The method according to one of  claims 1  to  27 ,  claim 1 , wherein the holding device is loaded with two microchip substrates. 
     
     
         29 . Holding device ( 1 ) for use during wet-chemical treatment of a microchip substrate, comprising a frame provided in the area of the outer edge of the holding device, a receiving space-bounded by the frame and optionally a base plate for a microchip substrate, wherein the frame is made of electrically-conductive material with at least one electrically-conductive coating and in addition to the at least one electrically-conductive coating with an electrically-insulating coating or electrically-insulating material with an electrically-conductive coating. 
     
     
         30 . (canceled) 
     
     
         31 . The holding device according to  claim 29 , characterized in wherein in the base plate, at least one opening is provided, which opening is covered by the frame or a microchip substrate, with which the holding device is loaded. 
     
     
         32 .- 35 . (canceled) 
     
     
         36 . The holding device according to  claim 29 , wherein in the base plate, at least three openings for the passage of pins for raising the microchip substrate from the holding device, at least two openings for centering the holding device on an adapter, at least one opening for testing the seal of the applied polymer and at least one opening for applying underpressure and for ventilation are provided, wherein at least one selected opening is provided for at least one of the above-mentioned functions. 
     
     
         37 . The holding device according to  claim 29 , wherein the frame is made of electrically-conductive material, aside from two electrically-conductive areas of the surface, is coated in an electrically-insulating manner. 
     
     
         38 . (canceled) 
     
     
         39 . The holding device according to  claim 31 , wherein the opening in the base plate is provided in the area of the electrically-conductive coating of the frame. 
     
     
         40 . (canceled) 
     
     
         41 . Adapter for connecting a holding device according to  claim 29  to an electrolytic metallizing unit, comprising a base element with two connecting pins, seal to be applied to the holding device, and sealing surfaces to be applied to the holding device, and recesses, to which underpressure can be applied, in the surface of the base element that faces the holding device to be received. 
     
     
         42 . (canceled) 
     
     
         43 . The adapter according to  claim 41 , wherein electrical contact is made by the connecting pins to form an annular contact sheet provided in the adapter. 
     
     
         44 . The adapter according to  claim 41 , wherein the connecting pins are made hollow and can be connected to a vacuum source. 
     
     
         45 - 51 . (canceled)