Coil component
Abstract
A coil component in which stress is relieved and a coil is stably positioned is to be provided. A coil component of the present disclosure includes a base body; and a coil provided in the base body. The base body includes a plurality of laminated magnetic layers. The coil includes a plurality of laminated coil wirings. The magnetic layers and the coil wirings are alternately laminated. A gap portion is provided between each of the magnetic layers and each of the coil wirings. Part of the coil wirings contacts the magnetic layers, and a region containing a metal oxide is present on part of a surface of each of the coil wirings on a side of the gap portion.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method for manufacturing a coil component, comprising:
forming a metal-containing layer on a magnetic sheet that becomes a magnetic layer after being fired; forming, on the metal-containing layer, a coil conductive paste layer that becomes a coil wiring after being fired; and providing a region containing a metal oxide on a surface of the coil wiring while forming a gap portion between the coil wiring and the magnetic layer by melting a metal contained in the metal-containing layer by firing.
2 . A method for manufacturing a coil component according to claim 1 , wherein
a melting point of a metal contained in the metal oxide is 850° C. or less.
3 . A method for manufacturing a coil component according to claim 1 , wherein
the metal oxide comprises at least one of Cu oxide, Zn oxide, Bi oxide, and Sn oxide.
4 . A method for manufacturing a coil component according to claim 1 , wherein
a shape of the region containing the metal oxide comprises at least one of a land-like shape and a band-like shape.
5 . A method for manufacturing a coil component according to claim 4 , wherein
the shape of the region containing the metal oxide comprises a land-like shape, and the land-like shape has an equivalent circle diameter of 0.1 μm or more.
6 . A method for manufacturing a coil component according to claim 1 , wherein a proportion of the region containing the metal oxide with respect to a surface area of the coil wiring is from 10% to 80%.Join the waitlist — get patent alerts
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