Apparatus for fabricating display panel and fabricating method thereof
Abstract
An apparatus for fabricating a display panel and a fabricating method of a display panel are provided. An apparatus for fabricating a display panel includes a loading module of a large-area fabricating substrate fabricated and separated into a plurality of display panels, a solvent application module configured to apply a metal bonding solvent onto the large-area fabricating substrate, and an element transfer module configured to transfer a plurality of light emitting elements or at least one integrated circuit onto the large-area fabricating substrate on which the metal bonding solvent is applied, and the loading module includes a groove type discharge path through which the metal bonding solvent applied by the solvent application module flows and is discharged.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An apparatus for fabricating a display panel, the apparatus comprising:
a loading module of a large-area fabricating substrate fabricated and separated into a plurality of display panels; a solvent application module configured to apply a metal bonding solvent onto the large-area fabricating substrate; and an element transfer module configured to transfer a plurality of light emitting elements or at least one integrated circuit onto the large-area fabricating substrate on which the metal bonding solvent is applied, wherein the loading module comprises a groove type discharge path through which the metal bonding solvent applied by the solvent application module flows and is discharged.
2 . The apparatus of claim 1 , wherein the groove type discharge path comprises:
a plurality of linear flow grooves forming a flow path of the metal bonding solvent; and a plurality of discharge grooves to discharge the metal bonding solvent flowing through the plurality of linear flow grooves.
3 . The apparatus of claim 2 , wherein the groove type discharge path further comprises a plurality of discharge grooves formed in a lower or side direction of the plurality of discharge grooves to discharge the metal bonding solvent in the lower or side direction.
4 . The apparatus of claim 3 ,
wherein the plurality of discharge grooves are formed on an end and an opposite end of each of the plurality of linear flow grooves, and wherein the plurality of discharge grooves are formed to pass through each of the plurality of discharge grooves in the lower direction or the side direction.
5 . The apparatus of claim 3 , further comprising a storage container having a collecting space on a lower, rear surface or side surface of the loading module so as to correspond to the passing direction of a discharge groove formed respectively in the plurality of discharge grooves.
6 . The apparatus of claim 2 , wherein the plurality of linear flow grooves are formed respectively in first and second directions of a loading surface of the loading module and some areas intersect in the first and second directions to coincide or overlap with each other.
7 . The apparatus of claim 6 , wherein the plurality of linear flow grooves are additionally formed on an outer edge of the loading surface in a same shape as an outer edge shape of the loading surface corresponding to an area and outer edge shape of the loading surface of the loading module.
8 . The apparatus of claim 6 , wherein the plurality of linear flow grooves are additionally formed on an outer edge of the loading surface in a shape surrounding the outer edge of the loading surface larger than an area of the loading surface of the loading module.
9 . The apparatus of claim 2 , wherein the plurality of linear flow grooves are formed in a straight or curved shape, formed in a mesh type by crossing each other, and formed in a plurality of separate forms.
10 . The apparatus of claim 2 , wherein cross-sections of the plurality of linear flow grooves are formed in a V-shape or U-shape, and the metal bonding solvent is filled into the plurality of linear flow grooves and the metal bonding solvent flows along a longitudinal direction of the linear flow grooves.
11 . The apparatus of claim 10 ,
wherein each of the plurality of linear flow grooves is formed to have a gradient, and wherein each of the plurality of linear flow grooves is formed to have a highest gradient at a center of a loading surface and a lowest gradient closer to an edge of the loading surface.
12 . The apparatus of claim 2 , wherein the large-area fabricating substrate comprises a plurality of groove lines forming a flow path of the metal bonding solvent applied onto a front surface of the large-area fabricating substrate.
13 . The apparatus of claim 12 , wherein the plurality of groove lines are formed in the first and second directions of the front surface of the large-area fabricating substrate and some areas intersect in the first and second directions to coincide or overlap with each other.
14 . The apparatus of claim 13 , wherein the plurality of groove lines are formed in a straight shape, formed in a mesh type by crossing each other, and formed in a plurality of separate forms.
15 . The apparatus of claim 13 , wherein the plurality of groove lines are formed respectively at positions overlapping the plurality of linear flow grooves formed in the loading module to correspond respectively between a plurality of discharge grooves formed in the loading module.
16 . The apparatus of claim 1 , wherein the element transfer module comprises:
a transfer member in which a pressing header is fixed to a fixing portion of a pressing direction; a transfer driving member to move the transfer member and the pressing header in the pressing direction or a detaching direction using a fixing frame of the transfer member; a pressure sensing module between the pressing header and the transfer member to generate pressure detection signals according to a pressure applied to the pressing header; a gradient setting module to set a gradient of the pressing header based on a magnitude of the pressure detection signals; and a gradient control module to control the gradient of the pressing header, the transfer member, and the fixing frame according to a control of the gradient setting module.
17 . The apparatus of claim 16 ,
wherein the pressure sensing module uses a plurality of pressure sensors located in each different position in different directions to sense a magnitude of the pressure applied to the pressing header and generate pressure sensing signals based on the magnitude of the pressure, and wherein the pressure sensing module uses at least one signal transmission circuit to transmit the pressure detection signals with a directional code in respect to each of the plurality of pressure sensors to the gradient setting module.
18 . The apparatus of claim 17 ,
wherein the gradient setting module detects a magnitude deviation between the pressure detection signals and calculates horizontal gradient setting values of the pressing header for making the magnitude deviation between the pressure detection signals zero, and generates gradient control signals corresponding to magnitudes of the calculated horizontal gradient setting values to transmit the gradient control signals to the gradient control module.
19 . The apparatus of claim 18 , wherein the gradient control module adjusts horizontal gradients of a plurality of pressure controllers, the transfer member, and the pressing header formed on a flat plate type support frame by controlling the horizontal gradient of the flat plate type support frame of the transfer driving member based on the gradient control signals.
20 . A fabricating method of a display panel, the method comprising:
loading, onto a loading module, a large-area fabricating substrate fabricated and separated into a plurality of display panels; applying a metal bonding solvent onto the large-area fabricating substrate using a solvent application module; and transferring a plurality of light emitting elements or at least one integrated circuit on the large-area fabricating substrate applied with the metal bonding solvent using an element transfer module, wherein, before transferring the light emitting elements or the at least one integrated circuit, the metal bonding solvent applied on the large-area fabricating substrate flows and is discharged through a groove type discharge path formed in the loading module.Join the waitlist — get patent alerts
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