Void forming module, method of preparing a structure and use of such module in the preparation of a structure

Abstract

There is provided a void forming module ( 100 ), the module including a support surface ( 110 ) including a first generally planar upper region ( 112 ), a second generally planar lower region ( 114 ), and a third generally convex region ( 116 ) joining the first region and the second region. At least one of the first region, the second region, and/or the third region includes at least one aperture ( 120,122 ) for the passage of fluid through the void forming module. There is also provided a structure ( 200 ) including the void forming module, a method of preparing a structure, and the use of the void forming module.

1 . A void forming module, the module including a support surface including:
 a first generally planar upper region,   a second generally planar lower region, and   a third generally convex region joining the first region and the second region;   
       wherein at least one of the first region, the second region, and/or the third region includes at least one aperture for the passage of fluid through the void forming module. 
     
     
         2 . The void forming module of  claim 1 , wherein the third region of the support surface at least partially conforms to a lateral surface of an imaginary curved frustum or curved truncated cone. 
     
     
         3 . The void forming module of  claim 1  or  2 , wherein module further includes a void forming surface including:
 a first generally planar upper region, 
 a second generally planar lower region, and 
 a third generally concave region joining the first region and the second region; 
 
       wherein the module provides a void between the first region of the void forming surface and the second region of the void forming surface. 
     
     
         4 . The void forming module of  claim 3 , wherein the third region of the void forming surface at least partially conforms to a lateral surface of an imaginary curved frustum or curved truncated cone. 
     
     
         5 . The void forming module of any preceding claim, wherein the second region of the support surface is generally circular. 
     
     
         6 . The void forming module of any preceding claim, wherein the third region of the support surface meets the first region of the support surface at a generally circular edge. 
     
     
         7 . The void forming module of any preceding claim, wherein the second region of the void forming surface is generally circular. 
     
     
         8 . The void forming module of any preceding claim, wherein the third region of the void forming surface meets the first region of the void forming surface at a generally circular edge. 
     
     
         9 . The void forming module of any preceding claim, further including a strengthening formation supporting the third region of the support surface and/or the first region of the support surface. 
     
     
         10 . The void forming module of  claim 9 , wherein the strengthening formation is or includes a fillet, protrusion, rib, and/or fin. 
     
     
         11 . The void forming module of  claim 9  or  10  when directly or indirectly dependent on  claim 3 , wherein the strengthening formation extends from the second region of the void forming surface to the first region of the void forming surface. 
     
     
         12 . The void forming module of any preceding claim when directly or indirectly dependent on  claim 3 , wherein the second region of the support surface and the second region of the void forming surface is or includes a grid having apertures being at least one of the at least one apertures. 
     
     
         13 . The void forming module of any preceding claim when directly or indirectly dependent on  claim 3 , wherein the third region of the support surface and the third region of the void forming surface includes at least one aperture of the at least one apertures. 
     
     
         14 . The void forming module of any preceding claim when directly or indirectly dependent on  claim 3 , wherein the first region of the support surface and the first region of the void forming surface includes at least one aperture of the at least one apertures. 
     
     
         15 . The void forming module according to any preceding claim, wherein the support surface further includes:
 a plurality of further second generally planar lower regions, and   a plurality of third generally convex regions joining the first region and the further second regions.   
     
     
         16 . The void forming module according to  claim 15 , wherein the plurality of second regions of the support surface form an array. 
     
     
         17 . The void forming module according to  claim 15  or  16 , wherein the plurality of third regions of the support surface form an array. 
     
     
         18 . The void forming module according to any preceding claim when directly or indirectly dependent on  claim 3 , wherein the void forming surface further includes:
 a plurality of further second generally planar lower regions, and   a plurality of third generally concave regions joining the first region and the further second regions.   
     
     
         19 . The void forming module according to  claim 18 , wherein the plurality of second regions of the void forming surface form an array. 
     
     
         20 . The void forming module according to  claim 18  or  19 , wherein the plurality of third regions of the void forming surface form an array. 
     
     
         21 . The void forming module of any preceding claim, further including a mating formation adapted to mate with a mating formation of another corresponding module. 
     
     
         22 . A structure including a void forming module according to any preceding claim. 
     
     
         23 . A structure according to  claim 22 , further including a permeable or impermeable subbase layer or base course layer supported by the first, second, and/or third regions of the support surface. 
     
     
         24 . A method of preparing a structure including:
 providing a void forming module, the module including a support surface including:
 a first generally planar upper region, 
 a second generally planar lower region, and 
 a third generally convex region joining the first region and the second region; 
 wherein at least one of the first region, the second region, and/or the third region includes at least one aperture for the passage of fluid through the void forming module, 
   and providing a permeable or impermeable subbase layer or base course on the first, second, and/or third regions of the support surface.   
     
     
         25 . Use of the void forming module according to any of  claims 1  to  21  in the preparation of a structure.