US2024116861A1PendingUtilityA1

Dithiapolyether diol, method for producing same, snag plating solution containing dithiapolyether diol, and method for forming plating film with use of snag plating solution

Assignee: MITSUBISHI MATERIALS CORPPriority: Dec 12, 2019Filed: Dec 11, 2020Published: Apr 11, 2024
Est. expiryDec 12, 2039(~13.4 yrs left)· nominal 20-yr term from priority
Inventors:Koji Tatsumi
C07C 323/12C25D 3/56C25D 3/60C07C 319/22C25D 3/64
54
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

This dithiapolyether diol has a halogen content of less than 10 ppm and a purity of 80% or more and is represented by the following general formula (1) or (2). In the general formula (1) or (2), x and y are arbitrary natural numbers

Claims

exact text as granted — not AI-modified
1 . Dithiapolyether diol,
 wherein a halogen content is 10 ppm or less, a purity is 80% or more, and the dithiapolyether diol is represented by the following general formula (1) or (2), and   in the general formula (1) or (2), x and y are arbitrary natural numbers,   
       
         
           
           
               
               
           
         
       
     
     
         2 . The dithiapolyether diol according to  claim 1 ,
 wherein a color number in Hazen units (APHA) as measured according to JIS K 0071-1 (1998) is 100 or less.   
     
     
         3 . A SnAg plating solution comprising:
 the dithiapolyether diol according to  claim 1 .   
     
     
         4 - 8 . (canceled)

Join the waitlist — get patent alerts

Track US2024116861A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.