Atomizing device, atomizing assembly thereof, and manufacturing process of atomizing assembly

Abstract

The present invention discloses an atomizing device, an atomizing assembly thereof, and a manufacturing process of the atomizing assembly. The atomizing assembly includes: a liquid conducting member configured for adsorbing an atomizable medium, and provided with at least two installation positions; a heating assembly sewn to the liquid conducting member; and electrodes, including at least two conductive electrodes respectively arranged on the installation positions and electrically connected to the heating assembly to enable the heating assembly to heat and atomize the atomizable medium on the liquid conducting member when electrified. The conductive electrode is fixed to the installation position in an assembly manner, so that the dry burning caused by the disengagement of the heating assembly and the liquid conducting member due to that the conductive electrode is stressed to pull the heating assembly during the assembly process is avoided; meanwhile, the manufacturing process is convenient and efficient.

What is claimed is: 
     
         1 . An atomizing assembly, comprising:
 a liquid conducting member ( 1 ) configured for adsorbing an atomizable medium, and provided with at least two installation positions ( 11 );   a heating assembly ( 2 ) sewn to the liquid conducting member ( 1 ); and   electrodes ( 3 ), including at least two conductive electrodes ( 31 ) respectively arranged on the at least two installation positions ( 11 ) and electrically connected to the heating assembly ( 2 ) to enable the heating assembly ( 2 ) to heat and atomize the atomizable medium on the liquid conducting member ( 1 ) when electrified.   
     
     
         2 . The atomizing assembly of  claim 1 , wherein the heating assembly ( 2 ) comprises at least two conductive portions ( 211 ) respectively located at the at least two installation positions ( 11 ), and the at least two conductive electrodes ( 31 ) respectively fix the at least two conductive portions ( 211 ) at the at least two installation positions ( 11 ) and are respectively conductive to the at least two conductive portions ( 211 ). 
     
     
         3 . The atomizing assembly of  claim 2 , wherein the heating assembly ( 2 ) comprises a first wire ( 21 ) sewn to the liquid conducting member ( 1 ), and
 wherein the first wire ( 21 ) is electrically conductive, and electrically connected to the at least two conductive electrodes ( 31 ).   
     
     
         4 . The atomizing assembly of  claim 3 , wherein the first wire ( 21 ) forms the at least two conductive portions ( 211 ) at the at least two installation positions ( 11 ). 
     
     
         5 . The atomizing assembly of  claim 3 , wherein the first wire ( 21 ) is made of one or more of a conductive metal alloy wire, a conductive metal fiber wire, a conductive carbon fiber wire, and a conductive graphite wire. 
     
     
         6 . The atomizing assembly of  claim 3 , wherein the heating assembly ( 2 ) further comprises a second wire ( 22 ) sewn to the liquid conducting member ( 1 ), and
 wherein the first wire ( 21 ) and the second wire ( 22 ) are sewn to the liquid conducting member ( 1 ) from two opposite sides of the liquid conducting member ( 1 ) and interwoven with each other.   
     
     
         7 . The atomizing assembly of  claim 1 , wherein each of the at least two installation positions ( 11 ) is a hole or a groove arranged on the liquid conducting member ( 1 ). 
     
     
         8 . The atomizing assembly of  claim 2 , wherein each of the at least two conductive electrodes ( 31 ) comprises a first conductive component ( 311 ) and a second conductive component ( 312 ), and
 wherein the first conductive component ( 311 ) and the second conductive component ( 312 ) are respectively arranged from two sides of the liquid conducting member ( 1 ) to one of the at least two installation positions ( 11 ), fix one of the at least two conductive portions ( 211 ), and are conductive with the one of the at least two conductive portions ( 211 ).   
     
     
         9 . The atomizing assembly of  claim 8 , wherein the first conductive component ( 311 ) and the second conductive component ( 312 ) are interconnected and fixed to the one of the at least two installation positions ( 11 ). 
     
     
         10 . The atomizing assembly of  claim 8 , wherein the first conductive component ( 311 ) comprises a first inserting portion ( 3111 ) and a first blocking portion ( 3112 ), and the second conductive component ( 312 ) comprises a second inserting portion ( 3121 ) and a second blocking portion ( 3122 ),
 wherein the first inserting portion ( 3111 ) and the second inserting portion ( 3121 ) are respectively inserted in the one of the at least two installation positions ( 11 ) and connected to each other, and   wherein the first blocking portion ( 3112 ) and the second blocking portion ( 3122 ) are located on and abut against two opposite sides of the liquid conducting member ( 1 ), respectively.   
     
     
         11 . The atomizing assembly of  claim 10 , wherein the one of the at least two conductive portions ( 211 ) is clamped between the first blocking portion ( 3112 ) and the liquid conducting member ( 1 ), and/or,
 wherein the one of the at least two conductive portions ( 211 ) is clamped between the second blocking portion ( 3122 ) and the liquid conducting member ( 1 ), and/or,   wherein the one of the at least two conductive portions ( 211 ) is clamped between the first inserting portion ( 3111 ), the second inserting portion ( 3121 ), and an inner wall of the one of the at least two installation positions ( 11 ).   
     
     
         12 . The atomizing assembly of  claim 10 , wherein the first inserting portion ( 3111 ) and the second inserting portion ( 3121 ) are mutually connected in a sleeved manner, or,
 wherein the first inserting portion ( 3111 ) and the second inserting portion ( 3121 ) are mutually connected in an inserted manner, or,   wherein the first inserting portion ( 3111 ) and the second inserting portion ( 3121 ) are mutually connected in a snap-fit manner.   
     
     
         13 . The atomizing assembly of  claim 2 , wherein each of the at least two conductive electrodes ( 31 ) comprises a third inserting portion ( 3131 ), and a third blocking portion ( 3132 ) and a fourth blocking portion ( 3133 ) that are respectively arranged at two ends of the third inserting portion ( 3131 ),
 wherein the third inserting portion ( 3131 ) is inserted in one of the at least two installation positions ( 11 ), and   wherein the third blocking portion ( 3132 ) and the fourth blocking portion ( 3133 ) respectively abut against two sides of the liquid conducting member ( 1 ).   
     
     
         14 . The atomizing assembly of  claim 13 , wherein one of the at least two conductive portions ( 211 ) is clamped between the third blocking portion ( 3132 ) and the liquid conducting member ( 1 ), and/or,
 wherein the one of the at least two conductive portions ( 211 ) is clamped between the fourth blocking portion ( 3133 ) and the liquid conducting member ( 1 ), and/or,   wherein the one of the at least two conductive portions ( 211 ) is clamped between the third inserting portion ( 3131 ) and an inner wall surface of the one of the at least two installation positions ( 11 ).   
     
     
         15 . The atomizing assembly of  claim 1 , wherein each of the at least two conductive electrodes ( 31 ) comprises an extension portion ( 314 ) extending away from one of the at least two installation positions ( 11 ), and
 wherein the extension portion is arranged along a surface of the liquid conducting member ( 1 ) or at an angle with the surface of the liquid conducting member ( 1 ).   
     
     
         16 . An atomizing device, comprising the atomizing assembly of  claim 1 . 
     
     
         17 . A manufacturing process of an atomizing assembly, comprising the steps of:
 providing a liquid conducting substrate that is flexible, and forming an installation position ( 11 ) on the liquid conducting substrate,   sewing a heating assembly ( 2 ) to the liquid conducting substrate, and   mounting a conductive electrode ( 31 ) to the installation position ( 11 ) and electrically connecting the conductive electrode ( 31 ) to the heating assembly ( 2 ).   
     
     
         18 . The manufacturing process of the atomizing assembly of  claim 17 , wherein the step of sewing a heating assembly ( 2 ) to the liquid conducting substrate comprises the step of:
 providing a first wire ( 21 ) that is electrically conductive, and threading the first wire ( 21 ) through the liquid conducting substrate to sew it to the liquid conducting substrate to form the heating assembly ( 2 ).   
     
     
         19 . The manufacturing process of the atomizing assembly of  claim 17 , wherein the step of sewing a heating assembly ( 2 ) to the liquid conducting substrate comprises the step of:
 providing a first wire ( 21 ) that is flexible and electrically conductive and a second wire ( 22 ) that is flexible, and sewing the first wire ( 21 ) and second wire ( 22 ) to the liquid conducting substrate from two opposite sides of the liquid conducting substrate in an interwoven manner to form the heating assembly ( 2 ).   
     
     
         20 . The manufacturing process of the atomizing assembly of  claim 18 , wherein the first wire ( 21 ) forms a conductive portion ( 211 ) at the installation position ( 11 ),
 wherein the conductive electrode ( 31 ) comprises a first conductive component ( 311 ) and a second conductive component ( 312 ), and the manufacturing process further comprises the step of:   mounting the first conductive component ( 311 ) and the second conductive component ( 312 ) from two sides of the liquid conducting member ( 1 ) to the installation position ( 11 ), respectively, and connecting the first conductive component ( 311 ) and the second conductive component ( 312 ) with each other and fixing them to the installation position ( 11 ) to clamp the conductive portion ( 211 ) and the liquid conducting substrate and to be conductive with the conducting portion ( 211 ).