Molded integrated circuit package with sensor assembly

Abstract

Embodiments of the present disclosure include a structure with a substrate, an electronic device, and a molding compound layer. The substrate has a first surface and a second surface opposite to the first surface, where the substrate includes a first opening. The electronic device is disposed on the first surface of the substrate and includes a second opening aligned with the first opening of the substrate. Further, the molding compound layer is disposed on the second surface of the substrate and includes a third opening aligned with the second opening of the electronic device.

What is claimed is: 
     
         1 . A structure, comprising:
 a substrate with a first surface and a second surface opposite to the first surface, wherein the substrate comprises a first opening ( FIG.  1 ,  102   );   an electronic device disposed on the first surface of the substrate, wherein the electronic device comprises a second opening aligned with the first opening of the substrate; and   a molding compound layer disposed on the second surface of the substrate, wherein the molding compound layer comprises a third opening aligned with the second opening of the electronic device.   
     
     
         2 . The structure of  claim 1 , further comprising:
 an other molding compound layer disposed on the first surface of the substrate, wherein the other molding compound layer comprises a fourth opening aligned with a fifth opening of the electronic device, and wherein the fifth opening is on an opposite surface of the electronic device to that of the second opening.   
     
     
         3 . The structure of  claim 2 , further comprising:
 an other substrate in contact with the other molding compound layer, wherein the other substrate comprises a sixth opening aligned with the fifth opening of the electronic device; and   an interposer structure disposed in the other molding compound layer and electrically connected to the substrate and the other substrate.   
     
     
         4 . The structure of  claim 1 , further comprising:
 a guide structure disposed along sidewalls of the third opening of the molding compound layer.   
     
     
         5 . The structure of  claim 4 , wherein the guide structure comprises an L-shaped structure disposed on the second surface of the substrate. 
     
     
         6 . The structure of  claim 4 , wherein the guide structure comprises a metallic barrier structure disposed on the second surface of the substrate. 
     
     
         7 . The structure of  claim 1 , wherein the substrate comprises a printed circuit board. 
     
     
         8 . The structure of  claim 1 , wherein the electronic device comprises a microphone device. 
     
     
         9 . A structure, comprising:
 a printed circuit board (PCB) with a first surface and a second surface opposite to the first surface, wherein the PCB comprises a PCB opening;   a first molding compound layer disposed on the first surface of the PCB, wherein the first molding compound layer comprises a sound guide opening aligned with the PCB opening;   a microphone device disposed on the second surface of the PCB, wherein the microphone device comprises a sound inlet opening aligned with the PCB opening and the sound guide opening; and   a second molding compound layer disposed on the second surface of the PCB and surrounding the microphone device.   
     
     
         10 . The structure of  claim 9 , further comprising:
 an L-shaped sound guide structure disposed along substantially vertical sidewalls of the sound guide opening.   
     
     
         11 . The structure of  claim 9 , further comprising:
 a metallic barrier layer disposed along angled sidewalls of the sound guide opening.   
     
     
         12 . The structure of  claim 9 , wherein the microphone device further comprises:
 a barometric relief vent on a surface of the microphone device opposite to that of the sound inlet opening.   
     
     
         13 . The structure of  claim 12 , wherein the second molding compound layer comprises an opening aligned with the barometric relief vent. 
     
     
         14 . The structure of  claim 13 , further comprising:
 a flexible PCB in contact with the second molding compound layer, wherein the flexible PCB comprises an opening aligned with the opening of the second molding compound layer and the barometric relief vent.   
     
     
         15 . A method, comprising:
 attaching an electronic device to a first surface of a substrate and over a first opening in the substrate, wherein the electronic device comprises a second opening aligned with the first opening in the substrate;   forming a first molding compound layer over the first surface of the substrate and to surround the electronic device; and   forming, over a second surface of the substrate, a second molding compound layer with a third opening aligned with the first opening of the substrate and the second opening of the electronic device.   
     
     
         16 . The method of  claim 15 , wherein attaching the electronic device comprises surface mounting the electronic device to the first surface of the substrate. 
     
     
         17 . The method of  claim 15 , forming the first molding compound layer comprises:
 attaching an interposer structure to the first surface of the substrate, wherein disposing the first molding compound layer comprises:
 disposing a film in contact with the interposer structure; and 
 performing a molding encapsulation process around the interposer structure. 
   
     
     
         18 . The method of  claim 15 , wherein forming the second molding compound layer comprises attaching a guide structure on the second surface of the substrate and over the first opening. 
     
     
         19 . The method of  claim 18 , wherein forming the second molding compound layer comprises:
 disposing a film over the guide structure; and   performing a molding encapsulation process around the guide structure to form the third opening.   
     
     
         20 . The method of  claim 15 , wherein forming the second molding compound layer comprises:
 landing an insert portion of a molding chase on the first opening in the substrate; and   performing a molding encapsulation process around the insert portion to form the third opening in the second molding compound layer.   
     
     
         21 . A method, comprising:
 attaching an electronic device to a first surface of a substrate and over a first opening in the substrate, wherein the electronic device comprises a second opening aligned with the first opening in the substrate and a third opening on a surface of the electronic device opposite to that of the second opening;   forming a first molding compound layer over the first surface of the substrate and to surround the electronic device, wherein the first molding compound layer comprises a fourth opening aligned with the third opening of the electronic device; and   forming, over a second surface of the substrate, a second molding compound layer with a fifth opening aligned with the first opening in the substrate and the second opening of the electronic device.   
     
     
         22 . The method of  claim 21 , wherein attaching the electronic device comprises covering the third opening of the electronic device with a tape. 
     
     
         23 . The method of  claim 22 , wherein disposing the first molding compound layer comprises forming the fourth opening through the first molding compound layer and the tape to expose the third opening of the electronic device. 
     
     
         24 . The method of  claim 23 , wherein forming the fourth opening comprises irradiating, with a laser, a portion of the first molding compound layer and the tape to expose the third opening of the electronic device. 
     
     
         25 . The method of  claim 21 , wherein forming the first molding compound layer comprises:
 landing an insert portion of a molding chase on the third opening of the electronic device; and   performing a molding encapsulation process around the insert portion to form the fourth opening in the first molding compound layer.