US2024101230A1PendingUtilityA1

Board with board bumper

Assignee: HYDROFLEX TECHPriority: Sep 26, 2022Filed: Sep 26, 2022Published: Mar 28, 2024
Est. expirySep 26, 2042(~16.2 yrs left)· nominal 20-yr term from priority
B63B 32/59B63B 32/57A63C 17/01
27
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

The present invention relates to a method of manufacturing a board for sport equipment and the board for sport equipment thereof. The method comprises the steps of molding a substrate on a first mold; transferring the substrate to a second mold; and injecting a thermoplastic material into a cavity provided between at least a part of an edge side of the substrate and the second mold to form the board with a board bumper on the at least a part of the edge side of the substrate.

Claims

exact text as granted — not AI-modified
1 . A method of manufacturing a board for sport equipment, the method comprising the steps of:
 forming a substrate on a first mold;   transferring the substrate to a second mold; and   injecting a material into a cavity provided between at least a part of an edge side of the substrate and the second mold to form the board with a board bumper on the at least a part of the edge side of the substrate.   
     
     
         2 . The method of  claim 1 , further comprising the step of:
 encompassing, when forming the board with the board bumper, a protrusion formed at the edge side surface of the substrate by the bumper.   
     
     
         3 . The method of  claim 1 , wherein the material comprises a thermoplastic or a thermosetting material. 
     
     
         4 . The method of  claim 1 , wherein forming the substrate on the first mold comprises:
 placing a shaped core sandwiched between a first layer and a second layer of fiber cloth in the first mold;   introducing a resin into the first mold; and   bonding the resin to the first and second layers of fiber cloth by curing to form the substrate.   
     
     
         5 . The method of  claim 4 , further comprising the steps of:
 forming the protrusion by coming together the first layer and second layer at the edge side surface of the substrate and bonding using the resin.   
     
     
         6 . The method of  claim 4 , wherein the shaped core comprises a foam of at least one of polyurethane, polystyrene, polyethylene, and polyethylene terephthalate. 
     
     
         7 . The method of  claim 4 , wherein the fiber cloth comprises at least one of fiberglass, carbon fiber, aramid fiber and natural plant fiber. 
     
     
         8 . The method of  claim 4 , wherein the resin comprises epoxy or polyester. 
     
     
         9 . The method of  claim 4 , wherein molding the substrate on the first mold comprises one of a resin transfer molding (RTM) process, vacuum assisted RTM (VARTM) process, and light RTM process. 
     
     
         10 . The method  claim 1 , wherein the second mold has a profile defining the cavity. 
     
     
         11 . The method of  claim 1 , wherein the method further comprises the step of:
 selecting at least one portion of the second mold defining a part of the profile of the second mold based on intended behavior properties of the board.   
     
     
         12 . A board for sport equipment comprising:
 a substrate having a first surface, a second surface opposite to the first surface and a side surface connecting the first surface and the second surface; and   a board bumper molded on at least a part of the side surface of the substrate.   
     
     
         13 . The board of  claim 12 , wherein the substrate comprises:
 a shaped core placed in between a first layer and a second layer of fiber cloth and bounded to the layers by a resin.   
     
     
         14 . The board of  claim 13 , wherein the first layer and second layer come together at the edge side surface of the substrate to form a protrusion encompassed by the bumper at the edge of the substrate. 
     
     
         15 . The board of claim  16 , wherein the board bumper has a shape selectable based on intended behavior properties of the board.

Join the waitlist — get patent alerts

Track US2024101230A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.