Electroplating shield device

Abstract

An electroplating shield device, methods of fabricating the same, and methods of electroplating with the electroplating shield device are disclosed herein. The method of electroplating includes positioning an object in an electroplating shield device. The electroplating shield device may include a conduit configured to receive the object and a plurality of openings selectively extended between inner and outer surfaces of the conduit. The openings may be positioned between first and second ends of the conduit. The method may also include forming a layer on the object by transferring fluid through the plurality of openings to at least one of a first continuous section of the object comprising a minor of the object and a second continuous section of the object comprising a major of the object. A ratio of a thickness of the major to the minor after forming the layer may range from approximately 1:1 to approximately 1:18.

What is claimed is: 
     
         1 . A method of electroplating a part, comprising:
 positioning an object in an electroplating shield device, the electroplating shield device comprising a conduit configured to receive the object and a plurality of openings selectively extended between inner and outer surfaces of the conduit, the openings being positioned between first and second ends of the conduit; and   forming a layer on the object by transferring fluid through the plurality of openings to at least one of a first continuous section of the object comprising a minor of the object and a second continuous section of the object comprising a major of the object;   wherein a ratio of a thickness of the major to the minor after forming the layer ranges from approximately 1:1 to approximately 1:18.   
     
     
         2 . The method of  claim 1 , wherein the plurality of openings are selectively extended in helical shape, and wherein the conduit is formed of a metal alloy. 
     
     
         3 . The method of  claim 2 , wherein the metal alloy is selected from one or more nickel-chromium alloys, one or more cobalt alloys, and one or more iron alloys. 
     
     
         4 . The method of  claim 1 , wherein the conduit is formed of one or more nickel-chromium alloys. 
     
     
         5 . The method of  claim 1 , wherein the conduit is formed of material comprising a melting point of approximately 1390° C. to 1425° C. 
     
     
         6 . The method of  claim 1 , wherein the conduit is formed of material comprising a melting point in excess of about 800° C. 
     
     
         7 . The method of  claim 1 , wherein the layer is formed in an electroplating chamber. 
     
     
         8 . The method of  claim 1 , wherein the object is electroplated prior to positioning in the electroplating shield device and forming the layer. 
     
     
         9 . The method of  claim 8 , wherein the ratio of the thickness of the major to the minor after forming the layer is approximately 1:18. 
     
     
         10 . The method of  claim 1 , wherein the layer is formed substantially on the first continuous section of the object comprising the minor of the object. 
     
     
         11 . The method of  claim 1 , wherein the layer is formed by transferring fluid through the plurality of openings to the first continuous section of the object comprising the minor of the object and the second continuous section of the object comprising the major of the object. 
     
     
         12 . The method of  claim 11 , wherein the ratio of the thickness of the major to the minor after forming the layer is approximately 1:1. 
     
     
         13 . An electroplating shield device comprising:
 a conduit extending from a first end to a second end, the conduit being hollow and configured to receive an object for electroplating;   a plurality of openings selectively extended between inner and outer surfaces, the openings being positioned between the first and second ends of the conduit; and   wherein the plurality of openings are configured to transfer fluid to at least one of a first continuous section of the object and a second continuous section of the object.   
     
     
         14 . The electroplating shield device of  claim 13 , wherein the conduit is formed of one or more nickel-chromium alloys, one or more chromium alloys, or one or more iron alloys. 
     
     
         15 . The electroplating shield device of  claim 14 , wherein the first continuous section of the object comprises a minor of the object and the second continuous section of the object comprises a major of the object, and wherein the plurality of openings of the conduit are configured to plate the object with a major-to-minor plating ratio ranging from approximately 1:1 to approximately 1:18. 
     
     
         16 . The electroplating shield device of  claim 13 , wherein the conduit is formed of material comprising a melting point of approximately 1390° C. to 1425° C. 
     
     
         17 . The electroplating shield device of  claim 13 , wherein the conduit is formed of material comprising a melting point in excess of about 800° C. 
     
     
         18 . The electroplating shield device of  claim 13 , wherein the plurality of openings form a continuous helical section on a surface of the conduit between the first and second ends. 
     
     
         19 . The electroplating shield device of  claim 13 , wherein the conduit comprises:
 a first section proximate to the first end, the first section comprising a first cylindrical surface without the plurality of openings; and   a second section proximate to the second end, the second section comprising a second cylindrical surface without the plurality of openings.   
     
     
         20 . A method of fabricating an electroplating shield device, comprising:
 forming a plurality of openings on a strip; and   forming a conduit with the strip;   wherein the conduit is configured to receive an object for electroplating; and   wherein the plurality of openings are configured to transfer fluid to at least one of a first continuous section of the object comprising a minor of the object and a second continuous section of the object comprising a major of the object in a major-to-minor plating ratio ranging from approximately 1:1 to approximately 1:18.