Processing system, pad transporting apparatus, liquid-receiving apparatus, and polishing apparatus

Abstract

An improved apparatus for use in replacing a polishing pad is disclosed. processing system includes: a polishing device configured to polish a workpiece; a pad break-in device configured to perform a pad break-in process of a polishing pad; and a pad transporting device configured to transport a pad structure from the pad break-in device to the polishing device. The pad structure includes at least the polishing pad. The pad transporting device includes a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.

What is claimed is: 
     
         1 . A processing system comprising:
 a polishing device configured to polish a workpiece;   a pad break-in device configured to perform a pad break-in process of a polishing pad; and   a pad transporting device configured to transport a pad structure, the pad structure including at least the polishing pad,   the polishing device includes a polishing table, a pad chuck configured to fix the pad structure, transported by the pad transporting device, to the polishing table, and a polishing head configured to press the workpiece against the polishing pad,   the pad transporting device includes a holding hand configured to hold the pad structure, and a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.   
     
     
         2 . The processing system according to  claim 1 , wherein the pad transporting device further includes a tilting device configured to tilt the liquid receiving tray and the holding hand. 
     
     
         3 . The processing system according to  claim 1 , wherein the pad transporting device further includes a hand elevating device configured to vertically move the holding hand. 
     
     
         4 . The processing system according to  claim 1 , wherein the pad transporting device further includes a drain line coupled to the liquid receiving tray. 
     
     
         5 . The processing system according to  claim 1 , wherein the pad structure includes the polishing pad and a support plate supporting the polishing pad. 
     
     
         6 . The processing system according to  claim 1 , wherein the polishing device includes a lifting mechanism configured to receive the pad structure from the pad transporting device and to place the pad structure on the polishing table. 
     
     
         7 . The processing system according to  claim 1 , wherein the pad break-in device includes a processing table configured to hold the pad structure, a processing head configured to press a dummy workpiece against the polishing pad of the pad structure on the processing table; and a liquid supply nozzle configured to supply liquid onto the polishing pad of the pad structure on the processing table. 
     
     
         8 . The processing system according to  claim 7 , wherein the pad break-in device further includes a pad monitoring device configured to monitor the break-in process of the polishing pad. 
     
     
         9 . A pad transporting apparatus for transporting a pad structure including at least a polishing pad, comprising:
 a holding hand configured to hold the pad structure; and   a liquid receiving tray arranged under the holding hand and configured to receive liquid dropped from the pad structure.   
     
     
         10 . The pad transporting apparatus according to  claim 9 , further comprising a tilting device configured to tilt the liquid receiving tray and the holding hand. 
     
     
         11 . The pad transporting apparatus according to  claim 9 , further comprising a hand elevating device configured to vertically move the holding hand. 
     
     
         12 . The pad transporting apparatus according to  claim 9 , further comprising a drain line coupled to the liquid receiving tray. 
     
     
         13 . The pad transporting apparatus according to  claim 9 , wherein the pad structure includes the polishing pad and a support plate supporting the polishing pad. 
     
     
         14 . A liquid receiving apparatus comprising:
 a support plate configured to support a polishing pad; and   a liquid receiving tray detachably attached to a side surface of the support plate.   
     
     
         15 . The liquid receiving apparatus according to  claim 14 , wherein the liquid receiving tray has a plurality of segments. 
     
     
         16 . A polishing apparatus for polishing a workpiece, comprising:
 a support plate configured to support a polishing pad;   a liquid receiving tray detachably attached to a side surface of the support plate;   a polishing table configured to hold the support plate; and   a polishing head configured to press the workpiece against the polishing pad.   
     
     
         17 . The processing system according to  claim 1 , wherein the pad transporting device is configured to transport a pad structure from the pad break-in device to the polishing device.