US2024047947A1PendingUtilityA1
Emitter array with shared via to an ohmic metal shared between adjacent emitters
Est. expiryMar 28, 2038(~11.7 yrs left)· nominal 20-yr term from priority
H01S 5/423H01S 5/0425H01S 5/028H01S 5/04254H01S 5/18311H01S 5/04256H01S 5/0282H01S 2301/176H01S 5/18305H01S 5/18377H01S 5/183H01S 5/18308H01S 5/1833H01S 5/2063
84
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Claims
Abstract
An emitter array may comprise a plurality of emitters that includes two adjacent emitters. The emitter array may comprise a plurality of emitters that includes two adjacent emitters. The ohmic metal layer may include a portion that is shared by, and located between, the two adjacent emitters. The emitter array may comprise a protective layer over the ohmic metal layer. The emitter array may comprise a via through the protective layer to the portion. The via is shared by, and located between, the two adjacent emitters.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A space-conserving vertical cavity surface emitting laser (VCSEL) array, comprising:
a plurality of VCSELs including two adjacent VCSELs; a metallization layer; and an ohmic metal layer associated with the plurality of VCSELs,
wherein a portion of the ohmic metal layer is shared by the two adjacent VCSELs,
wherein a first radial distance from each of the two adjacent VCSELs to the portion of the ohmic metal layer is less than a second radial distance from each of the two adjacent VCSELs to a trench shared by the two adjacent VCSELs, and
wherein a difference between an optical aperture diameter of at least one of the two adjacent VCSELs and a pitch distance between the two adjacent VCSELs is reduced, relative to emitter arrays without the portion of the ohmic metal layer.
2 . The VCSEL array of claim 1 , wherein the difference between the optical aperture diameter and the pitch distance is less than 9 microns.
3 . The VCSEL array of claim 1 , wherein the optical aperture diameter is between 4 microns and 20 microns.
4 . The VCSEL array of claim 1 , wherein the pitch distance is between 16 microns and 20 microns.
5 . The VCSEL array of claim 1 , wherein a via to the portion of the ohmic metal layer is shared by the two adjacent VCSELs.
6 . The VCSEL array of claim 5 , wherein the via electrically connects the metallization layer to the ohmic metal layer.
7 . The VCSEL array of claim 1 , wherein the ohmic metal layer comprises a plurality of separate ohmic metal portions that surround at least one of the plurality of VCSELs.
8 . A high-density vertical cavity surface emitting laser (VCSEL) array, comprising:
a plurality of VCSELs including two adjacent VCSELs; a metallization layer; and an ohmic metal layer associated with the plurality of VCSELs,
wherein a portion of the ohmic metal layer is shared by the two adjacent VCSELs,
wherein a first radial distance from each of the two adjacent VCSELs to the portion of the ohmic metal layer is less than a second radial distance from each of the two adjacent VCSELs to a trench shared by the two adjacent VCSELs, and
wherein a ratio of an optical aperture diameter of one of the two adjacent VCSELs to a pitch distance between the two adjacent VCSELs enables the plurality of VCSELs to be arranged at a higher density than emitter arrays without the portion of the ohmic metal layer.
9 . The VCSEL array of claim 8 , wherein the ratio of the optical aperture diameter and the pitch distance is greater than 11:20.
10 . The VCSEL array of claim 8 , wherein the optical aperture diameter is between 4 microns and 20 microns.
11 . The VCSEL array of claim 8 , wherein the pitch distance is between 16 microns and 20 microns.
12 . The VCSEL array of claim 8 , wherein the ohmic metal layer comprises a plurality of separate ohmic metal portions that surround at least one of the plurality of VCSELs.
13 . The VCSEL array of claim 8 , wherein a via to the portion of the ohmic metal layer is shared by the two adjacent VCSELs.
14 . The VCSEL array of claim 13 , wherein the via electrically connects the metallization layer to the ohmic metal layer.
15 . A space-conserving emitter array, comprising:
a plurality of emitters including two adjacent emitters; a metallization layer; and an ohmic metal layer associated with the plurality of emitters,
wherein a portion of the ohmic metal layer is shared by the two adjacent emitters,
wherein a trench is shared by the two adjacent emitters, and
wherein a difference between an optical aperture diameter of at least one of the two adjacent emitters and a pitch distance between the two adjacent emitters is reduced, relative to emitter arrays without the portion of the ohmic metal layer.
16 . The emitter array of claim 15 , wherein the difference between the optical aperture diameter and the pitch distance is less than 9 microns.
17 . The emitter array of claim 15 , wherein the optical aperture diameter is between 4 microns and 20 microns.
18 . The emitter array of claim 15 , wherein the pitch distance is between 16 microns and 20 microns.
19 . The emitter array of claim 15 , wherein a via to the portion of the ohmic metal layer is shared by the two adjacent emitters.
20 . The emitter array of claim 15 , wherein the ohmic metal layer comprises a plurality of separate ohmic metal portions that surround at least one of the plurality of emitters.Join the waitlist — get patent alerts
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