High-density faus and optical interconnection devices and related methods

Abstract

A optoelectronic assembly is provided including a photonic integrated circuit (PIC) including at least one electronic connection element and plurality of waveguides disposed on a PIC face, a printed circuit board (PCB) including at least one PCB electronic connection element, which is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB, a lidless fiber array unit including a support substrate having a substantially flat first surface and a signal fiber array including a plurality of optical fibers supported on the first surface, and an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides.

What is claimed is: 
     
         1 . A optoelectronic assembly, comprising:
 a photonic integrated circuit (PIC), comprising at least one electronic connection element and plurality of waveguides disposed on a PIC face;   a printed circuit board (PCB) comprising at least one PCB electronic connection element, wherein the at least one PCB electronic connection element is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB;   a lidless fiber array unit, comprising:
 a cap disposed on the PIC, wherein the cap is configured to retain the lidless fiber array unit in contact with the plurality of waveguides. 
   
     
     
         2 . The optoelectronic assembly of  claim 1 , wherein the cap comprises a protrusion disposed on the support substrate. 
     
     
         3 . The optoelectronic assembly of  claim 1 , wherein the cap comprises a depression disposed on the support substrate. 
     
     
         4 . The optoelectronic assembly of  claim 3 , wherein the cap extends from the PIC over a portion of IC over a portion of IC over a portion of IC over a portion of an alignment substrate to form a receiving area. 
     
     
         5 . The optoelectronic assembly of  claim 1 , wherein the cap is bonded to a top surface of the PIC. 
     
     
         6 . The optoelectronic assembly of  claim 1 , wherein the cap comprises one of a protrusion and a depression and the other of the protrusion and the depression is disposed on the support substrate. 
     
     
         7 . The optoelectronic assembly of  claim 6 , wherein engagement of the depression by the protrusion resists removal of the lidless fiber array unit from the cap. 
     
     
         8 . The optoelectronic assembly of  claim 1 , wherein the cap is disposed on a top surface of the PIC. 
     
     
         9 . The optoelectronic assembly of  claim 1 , wherein the cap comprises one of a protrusion and a depression and the other of the protrusion and the depression is disposed on the support substrate, and wherein engagement of the depression by the protrusion resists removal of the lidless fiber array unit from the cap. 
     
     
         10 . An optoelectronic assembly, comprising:
 a photonic integrated circuit (PIC), comprising at least one electronic connection element and plurality of waveguides disposed on a PIC face;   a printed circuit board (PCB) comprising at least one PCB electronic connection element, wherein the at least one PCB electronic connection element is complementary to the at least one electronic connection element of the PIC and the PIC is configured to be flip chip mounted to the PCB;   a lidless fiber array unit, comprising:
 a support substrate having a substantially flat first surface; and 
 a signal fiber array comprising a plurality of optical fibers supported on the first surface, an alignment substrate disposed on the PIC face and configured to align the plurality of optical fibers of the signal fiber array with the plurality of waveguides; and 
 a cap disposed on the PIC, wherein the cap is configured to retain the lidless fiber array unit in contact with the plurality of waveguides. 
   
     
     
         11 . The optoelectronic assembly of  claim 10 , wherein the cap comprises a protrusion disposed on the support substrate. 
     
     
         12 . The optoelectronic assembly of  claim 10 , wherein the cap comprises a depression disposed on the support substrate. 
     
     
         13 . The optoelectronic assembly of  claim 12 , wherein the cap extends from the PIC over a portion of IC over a portion of IC over a portion of IC over a portion of an alignment substrate to form a receiving area. 
     
     
         14 . The optoelectronic assembly of  claim 10 , wherein the cap is bonded to a top surface of the PIC. 
     
     
         15 . The optoelectronic assembly of  claim 10 , wherein the cap comprises one of a protrusion and a depression and the other of the protrusion and the depression is disposed on the support substrate. 
     
     
         16 . The optoelectronic assembly of  claim 15 , wherein engagement of the depression by the protrusion resists removal of the lidless fiber array unit from the cap. 
     
     
         17 . The optoelectronic assembly of  claim 10 , wherein the cap is disposed on a top surface of the PIC. 
     
     
         18 . The optoelectronic assembly of  claim 10 , wherein the cap comprises one of a protrusion and a depression and the other of the protrusion and the depression is disposed on the support substrate, and wherein engagement of the depression by the protrusion resists removal of the lidless fiber array unit from the cap.