Optical sensor package with encapsulant is between and separates substrates and multiple assemblies

Abstract

The present disclosure is directed to an optical sensor package with a first assembly and a second assembly with an encapsulant extending between and coupling the first assembly and the second assembly. The first assembly includes a first substrate, a first die on the first substrate, a transparent material on the first die, and an infrared filter on the transparent material. The second assembly includes a second substrate, a second die on the second substrate, a transparent material on the second die, and an infrared filter on the transparent material. Apertures are formed through the encapsulant aligned with the first die and the second die. The first die is configured to transmit light through one aperture, wherein the light reflects off an object to be detected and is received at the second die through another one of the apertures.

1 . A device, comprising:
 a first substrate having a first surface opposite a second surface;   a first die on the first surface of the first substrate;   a second substrate having a first surface opposite to a second surface;   a second die on the first surface of the second substrate;   an encapsulation layer having a first surface opposite a second surface, the encapsulation layer being on top and sides of the first die, on sides of the first substrate, on top and sides of the second die, and on sides of the second substrate, the encapsulation layer being between the first substrate and the second substrate, the second surface of the first substrate being coplanar with the second surface of the encapsulation layer.   
     
     
         2 . The device of  claim 1  wherein the second surface of the second substrate is coplanar with the second surface of the first substrate. 
     
     
         3 . The device of  claim 1  wherein the first surface of the encapsulation layer includes a first aperture and a second aperture. 
     
     
         4 . The device of  claim 3  wherein the first aperture is aligned with the first die and the second aperture is aligned with the second die. 
     
     
         5 . The device of  claim 4  wherein the encapsulation layer surrounds and is in contact with all sides of the first substrate and the encapsulation layer surrounds and is in contact with all sides of the second substrate. 
     
     
         6 . The device of  claim 1  comprising a first filter on the first die and a second filter on the second die. 
     
     
         7 . The device of  claim 6  wherein sides of the first filter are coplanar with the sides of the first substrate. 
     
     
         8 . The device of  claim 7  wherein sides of the second filter are coplanar with the sides of the second substrate. 
     
     
         9 . A device, comprising:
 a first substrate;   a first die on the first substrate;   a first transparent resin on the first die and on the first substrate, sidewalls of the first transparent resin and sidewalls of the first substrate being coplanar; and   an encapsulation layer on the sidewalls and on a first surface of the first transparent resin and on the sidewalls of the first substrate, the encapsulation layer having a first surface that is coplanar with a first surface of the first substrate.   
     
     
         10 . The device of  claim 9 , comprising a first aperture through the encapsulation layer that exposes the first surface of the transparent resin. 
     
     
         11 . The device of  claim 10 , comprising:
 a second substrate;   a second die on the second substrate;   a second transparent resin on the second die and on the second substrate.   
     
     
         12 . The device of  claim 11  wherein sidewalls of the second transparent resin and sidewalls of the second substrate are coplanar. 
     
     
         13 . The device of  claim 11  wherein the encapsulation layer is on the sidewalls and on a first surface of the second transparent resin and on the sidewalls of the second substrate, the first surface of the encapsulation layer is coplanar with a first surface of the second substrate. 
     
     
         14 . A device, comprising:
 a first substrate;   a first die on the first substrate;   a first transparent resin on the first die and the first substrate;   a second substrate;   a second die on the second substrate;   a second transparent resin on the second die and the second substrate;   an encapsulation layer on top and side surfaces of the first transparent resin, on side surfaces of the first substrate, on top and side surfaces of the second transparent resin, and on side surfaces of the second substrate.   
     
     
         15 . The device of  claim 14  wherein the encapsulation layer has a bottom surface that is coplanar with a bottom surface of the first substrate and is coplanar with a bottom surface of the second substrate. 
     
     
         16 . The device of  claim 15  wherein the encapsulation layer includes a first aperture that exposes the top surface of the first transparent resin. 
     
     
         17 . The device of  claim 16  wherein the encapsulation layer includes a second aperture that exposes the top surface of the second transparent resin.