US2024035897A1PendingUtilityA1

In-contact Continuous Temperature Measurement Probe for Non-insulated Electric-Current Carrying Conductor

Assignee: UNIV SOUTH CAROLINAPriority: Oct 30, 2019Filed: Oct 9, 2023Published: Feb 1, 2024
Est. expiryOct 30, 2039(~13.3 yrs left)· nominal 20-yr term from priority
G01K 7/04H10N 10/00H10N 10/01H10N 10/10H10N 10/17G01K 1/02G01K 1/14G01K 1/143
68
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

An in-contact temperature measurement probe, which can measure temperature accurately on the surface of a current carrying wire, rod, heater, or other device, while maintaining the safety of the user via employing non-electrically conductive but thermally conductive materials.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method for forming an in-contact temperature probe comprising:
 selecting a shape for the in-contact temperature probe that conforms to a shape of a measured surface;   forming a mold that conforms to the selected shape of the in-contact temperature probe;   inserting a molding tube into the mold;   drilling at least one hole in a surface of the molding tube;   placing at least one thermocouple inside the molding tube;   injecting thermally conductive adhesive into the molding tube to form an in-contact temperature probe structure; and   curing the in-contact temperature probe structure.   
     
     
         2 . The method of  claim 1  further comprising, injecting the thermally conductive adhesive such that no air gaps form in the in-contact temperature probe structure. 
     
     
         3 . The method of  claim 1  further comprising, selecting the at least one thermocouple and the thermally conductive adhesive to withstand temperatures up to 200 degrees Celsius. 
     
     
         4 . The method of  claim 1  further comprising, defining multiple holes in the molding tube. 
     
     
         5 . The method of  claim 1  further comprising, shaping the in-contact temperature probe to completely enclose an inner space. 
     
     
         6 . The method of  claim 1  further comprising, shaping the in-contact temperature probe to partially enclose an inner space. 
     
     
         7 . The method of  claim 1  further comprising, shaping the in-contact temperature probe to measure temperature over a predefined length of the measured surface as opposed to a single point on the measured surface. 
     
     
         8 . The method of  claim 1  further comprising, forming a shaped thermocouple array in the molding tube.

Join the waitlist — get patent alerts

Track US2024035897A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.