US2024033836A1PendingUtilityA1
Methods and apparatus for cutting profiles
Assignee: SEOUL LASER DIEBOARD SYSTEM CO LTDPriority: Nov 6, 2007Filed: Jul 5, 2023Published: Feb 1, 2024
Est. expiryNov 6, 2027(~1.3 yrs left)· nominal 20-yr term from priority
Inventors:Sang Moo Lee
B23D 15/002B21D 28/02B21D 11/08B23D 23/00B23D 3/00Y10T83/162Y10T83/8736Y10T83/0524B21D 28/243B21D 5/00B21D 43/28
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Claims
Abstract
An apparatus for cutting a profile, including: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive the cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive the cutter up and down along the first surface of the profile.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An apparatus for cutting a profile, comprising:
a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive said cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive said cutter up and down along the first surface of the profile.Join the waitlist — get patent alerts
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