US2024030246A1PendingUtilityA1

Imaging device and electronic device

Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPPriority: Dec 21, 2020Filed: Nov 11, 2021Published: Jan 25, 2024
Est. expiryDec 21, 2040(~14.4 yrs left)· nominal 20-yr term from priority
H10F 39/18H10F 39/8033H10F 39/802H10F 39/80373H10D 30/60H10D 30/021H10D 84/00H10D 84/038H10D 84/0126H10F 39/12H10F 39/8037H01L 27/14612H01L 27/14643H01L 27/14603
52
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Claims

Abstract

Provided are an imaging device and an electronic device capable of improving the charge transfer characteristic. The imaging device includes a semiconductor substrate and a vertical transistor provided on the semiconductor substrate. The semiconductor substrate is provided with a hole opened to the first main surface side. The vertical transistor includes a first gate electrode provided inside the hole, and a second gate electrode provided outside the hole and connected to the first gate electrode. The first gate electrode includes a first part and a second part including a material having conductivity different from conductivity of the first part.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An imaging device comprising
 a semiconductor substrate, and   a vertical transistor provided on the semiconductor substrate, wherein:   the semiconductor substrate is provided with a hole opened to a first main surface side;   the vertical transistor includes   a first gate electrode provided inside the hole, and   a second gate electrode provided outside the hole and connected to the first gate electrode; and   the first gate electrode includes   a first part, and   a second part including a material having conductivity different from conductivity of the first part.   
     
     
         2 . The imaging device according to  claim 1 , wherein
 the first part is located between the second part and the second gate electrode.   
     
     
         3 . The imaging device according to  claim 1 , wherein
 the first part and the second part face each other in a direction parallel to the first main surface.   
     
     
         4 . The imaging device according to  claim 1 , wherein
 each of the first part and the second part includes a semiconductor of a first conductivity type, and   an impurity concentration of the first conductivity type in the second part is lower than an impurity concentration of the first conductivity type in the first part.   
     
     
         5 . The imaging device according to  claim 4 , wherein
 the first gate electrode further includes a third part that is located on an opposite side of the first part with the second part interposed therebetween and includes a semiconductor of a first conductivity type, and   an impurity concentration of the first conductivity type in the third part is lower than an impurity concentration of the first conductivity type in the second part.   
     
     
         6 . The imaging device according to  claim 1 , wherein
 the first part includes a semiconductor of a first conductivity type, and   the second part includes a non-doped semiconductor.   
     
     
         7 . The imaging device according to  claim 1 , wherein
 the first part includes a semiconductor of a first conductivity type, and   the second part includes a semiconductor of a second conductivity type.   
     
     
         8 . The imaging device according to  claim 1 , wherein
 the first part includes a semiconductor of a first conductivity type, and   the second part includes metal.   
     
     
         9 . The imaging device according to  claim 1  further comprising
 a photoelectric conversion unit provided on the semiconductor substrate, and 
 a charge holding unit that is provided on the semiconductor substrate and holds charge generated in the photoelectric conversion unit, wherein 
 the vertical transistor is used as a transfer transistor that transfers charge from the photoelectric conversion unit to the charge holding unit. 
 
     
     
         10 . An electronic device, comprising:
 an optical component;   an imaging device on which light transmitted through the optical component is incident; and   a signal processing circuit that processes a signal output from the imaging device, wherein:   the imaging device includes   a semiconductor substrate, and   a vertical transistor provided on the semiconductor substrate;   the semiconductor substrate is provided with a hole opened to a first main surface side;   the vertical transistor includes   a first gate electrode provided inside the hole, and   a second gate electrode provided outside the hole and connected to the first gate electrode; and   the first gate electrode includes   a first part, and   a second part including a material having conductivity different from conductivity of the first part.

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