US2024023364A1PendingUtilityA1

Display apparatus

Assignee: SAMSUNG DISPLAY CO LTDPriority: Apr 23, 2019Filed: Feb 24, 2023Published: Jan 18, 2024
Est. expiryApr 23, 2039(~12.7 yrs left)· nominal 20-yr term from priority
H10K 59/8731H10K 59/8722H10K 50/844G06F 3/0412G06F 3/041H10K 50/84H10K 50/8426H10K 59/40H10K 77/10H10K 59/126Y02E10/549G06F 2203/04111G06F 3/0446G06F 3/0443G06F 2203/04103Y02P70/50H10K 71/851H10K 2102/00
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Claims

Abstract

A display apparatus may prevent a thin-film encapsulation layer and a substrate or a thin-film encapsulation layer and a buffer layer from being separated from each other when a base layer and the substrate are cut. A display apparatus may include a display panel including a substrate, a display layer on the substrate, and a thin-film encapsulation layer covering the display layer; an input sensing member including a base layer facing the substrate of the display panel, and sensing electrodes above the base layer; and a resin layer between the thin-film encapsulation layer and the base layer, and an end of the thin-film encapsulation layer protrudes from the resin layer toward an end of the substrate.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A display apparatus comprising:
 a display panel comprising a substrate, a display layer on the substrate, and a thin-film encapsulation layer covering the display layer;   an input sensing member comprising a base layer facing the substrate of the display panel, and sensing electrodes above the base layer; and   a resin layer between the thin-film encapsulation layer and the base layer,   wherein an end of the thin-film encapsulation layer protrudes from an end of the resin layer toward an end of the substrate, and the end of the resin layer has a thickness greater than a thickness of a portion of the resin layer overlapping the display layer, and   wherein, in a plan view as seen along a direction intersecting an upper surface of the base layer, an area of the base layer is greater than an area of the thin-film encapsulation layer, and the area of the thin film encapsulation layer is greater than an area of the resin layer.

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