US2024023237A1PendingUtilityA1

Wiring circuit board

Assignee: NITTO DENKO CORPPriority: Nov 25, 2020Filed: Oct 26, 2021Published: Jan 18, 2024
Est. expiryNov 25, 2040(~14.3 yrs left)· nominal 20-yr term from priority
H05K 1/0281H05K 1/189H05K 2201/09727H05K 2201/0191H05K 1/05G11B 21/21H05K 1/0271H05K 1/181
43
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Claims

Abstract

A wiring circuit board includes a first insulating layer and a conductive pattern. The conductive pattern has a first terminal, and a wiring connected to the first terminal. The wiring has a first portion disposed away from the first terminal, and a second portion disposed between the first terminal and the first portion. The first portion of the wiring and the first terminal include a portion consisting of the first conductive layer and the second conductive layer. The second portion of the wiring consists of the first conductive layer.

Claims

exact text as granted — not AI-modified
1 . A wiring circuit board comprising:
 a first insulating layer, and   a conductive pattern disposed on the first insulating layer and having a terminal and a wiring connected to the terminal, the wiring having a first portion disposed away from the terminal and a second portion disposed between the terminal and the first portion, wherein   the conductive pattern has   a first conductive layer disposed on the first insulating layer and   a second conductive layer disposed on the first conductive layer;   the first portion of the wiring and the terminal include a portion consisting of the first conductive layer and the second conductive layer; and   the second portion of the wiring consists of the first conductive layer or the second conductive layer.   
     
     
         2 . A wiring circuit board comprising:
 a first insulating layer;   a conductive pattern disposed on the first insulating layer, having a terminal and a wiring connected to the terminal, the wiring having a first portion disposed away from the terminal and a second portion disposed between the terminal and the first portion, and having a first conductive layer disposed on the first insulating layer and a second conductive layer disposed on the first conductive layer; and   an intermediate insulating layer disposed between the first conductive layer and the second conductive layer; wherein   the terminal includes a portion consisting of the first conductive layer, the second conductive layer, and the intermediate insulating layer;   the first portion of the wiring includes a portion consisting of the first conductive layer and the second conductive layer; and
 the second portion of the wiring consists of at least one of the first conductive layer and the second conductive layer. 
   
     
     
         3 . The wiring circuit board according to  claim 1 , wherein
 a width of the first portion is wider than the width of the second portion.   
     
     
         4 . The wiring circuit board according to  claim 1  further comprising:
 a second insulating layer disposed on the first insulating layer and covering the wiring, wherein 
 the second insulating layer is disposed at an interval from the terminal. 
 
     
     
         5 . The wiring circuit board according to  claim 4 , wherein
 the second insulating layer disposed on the second portion is thinner than the second conductive layer of the terminal.   
     
     
         6 . The wiring circuit board according to  claim 1  further comprising:
 a second insulating layer disposed on the first insulating layer and covering the wiring, wherein 
 the second insulating layer disposed on the second portion is thinner than the second conductive layer of the terminal. 
 
     
     
         7 . The wiring circuit board according to  claim 1 , wherein
 the second portion of the wiring consists of the first conductive layer and   the entire second conductive layer is in contact with the first conductive layer.   
     
     
         8 . The wiring circuit board according to  claim 1 , wherein
 the second portion of the wiring consists of the second conductive layer and   the entire first conductive layer is in contact with the second conductive layer.

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