Stacked substrate manufacturing method, stacked substrate manufacturing apparatus, stacked substrate manufacturing system, and substrate processing apparatus

Abstract

A method of manufacturing a stacked substrate by bonding a first substrate and a second substrate, including a step of determining, based on information about curving of each of the first substrate and the second substrate, whether or not the first substrate and the second substrate satisfy a predetermined condition, and, a step of bonding the first substrate and the second substrate if the predetermined condition is satisfied. The stacked substrate manufacturing method described above includes a step of estimating, based on the information, an amount of misalignment which occurs after the first substrate is bonded to the second substrate and the predetermined condition may include that the amount of misalignment is equal to or less than a threshold.

1 - 23 . (canceled) 
     
     
         24 . A stacked substrate manufacturing method for manufacturing a stacked substrate by bonding a first substrate and a second substrate, the stacked substrate manufacturing method comprising:
 obtaining, from a storing unit that stores information about deformation of a plurality of substrates including the first substrate, the deformation being in a direction intersecting a bonding surface of each of the plurality of substrates, information about the deformation of the first substrate in the direction intersecting the bonding surface of the first substrate; and   determining, based on the obtained information, a bonding condition to bond the first substrate and the second substrate.   
     
     
         25 . The stacked substrate manufacturing method according to  claim 24 , wherein
 the bonding condition includes such a condition that an amount of misalignment between the first substrate and the second substrate is equal to or less than a threshold when the first substrate and the second substrate are bonded to each other.   
     
     
         26 . The stacked substrate manufacturing method according to  claim 25 , wherein
 the bonding condition includes a correction amount to correct the misalignment.   
     
     
         27 . The stacked substrate manufacturing method according to  claim 26 , wherein
 the bonding condition includes a deformation amount to change a shape of at least one of the first substrate and the second substrate.   
     
     
         28 . The stacked substrate manufacturing method according to  claim 24 , wherein
 the bonding condition includes such a condition that (i) an amount of misalignment between the first substrate and the second substrate when the first substrate and the second substrate are bonded to each other or (ii) a difference between the amount of the misalignment and a threshold is within a magnitude that is correctable by a correcting unit configured to correct the misalignment between the first substrate and the second substrate.   
     
     
         29 . The stacked substrate manufacturing method according to  claim 24 , further comprising at least one of:
 estimating, based on the information about the deformation, an amount of distortion occurring in the first substrate when the first substrate and the second substrate are bonded to each other, or   calculating, based on the information about the deformation, an amount of misalignment between the first substrate and the second substrate when the first substrate and the second substrate are bonded to each other.   
     
     
         30 . The stacked substrate manufacturing method according to  claim 24 , wherein
 the bonding condition includes a combination of the first substrate and the second substrate to be bonded to each other.   
     
     
         31 . The stacked substrate manufacturing method according to  claim 30 , wherein
 the bonding condition includes such a condition that a combination of a state of distortion of the first substrate and a state of distortion of the second substrate corresponds to a predetermined combination.   
     
     
         32 . The stacked substrate manufacturing method according to  claim 31 , further comprising:
 when the combination of the state of the distortion of the first substrate and the state of the distortion of the second substrate does not correspond to the predetermined combination, selecting, from a plurality of other second substrates and instead of the second substrate with which the combination does not correspond to the predetermined combination, another second substrate with which the combination corresponds to the predetermined combination.   
     
     
         33 . The stacked substrate manufacturing method according to  claim 32 , wherein
 the bonding condition includes a manufacturing condition to manufacture a substrate with which an amount of misalignment between the substrate and the first substrate becomes equal to or less than a threshold when the substrate and the first substrate are bonded to each other.   
     
     
         34 . The stacked substrate manufacturing method according to  claim 33 , further comprising:
 manufacturing the second substrate such that a magnification ratio of the second substrate when bonded to the first substrate becomes within a predetermined range relative to a magnification ratio of the first substrate.   
     
     
         35 . The stacked substrate manufacturing method according to  claim 24 , further comprising:
 measuring a shape of the first substrate to obtain the information about the deformation.   
     
     
         36 . The stacked substrate manufacturing method according to  claim 35 , wherein
 the information about the deformation includes information indicating at least one of a warpage magnitude, a warpage direction, a deflection magnitude, or a deflection direction of the first substrate.   
     
     
         37 . The stacked substrate manufacturing method according to  claim 35 , wherein
 the information about the deformation includes information about global curving obtained from displacements at a plurality of positions in the first substrate relative to a center of the first substrate.   
     
     
         38 . The stacked substrate manufacturing method according to  claim 24 , wherein
 the information about the deformation is estimated based on a manufacturing process of the first substrate.   
     
     
         39 . The stacked substrate manufacturing method according to  claim 38 , wherein
 the information about the deformation includes at least one of information indicating a manufacturing process of the first substrate, information indicating a stress distribution in the first substrate, or information indicating a specification of a structural body fabricated on the first substrate.   
     
     
         40 . The stacked substrate manufacturing method according to  claim 24 , wherein
 the information about the deformation is obtained by an apparatus other than an apparatus to manufacture the stacked substrate by bonding the first substrate and the second substrate.   
     
     
         41 . The stacked substrate manufacturing method according to  claim 24 , wherein
 obtaining the information about the deformation is performed before measuring positions of the first substrate and the second substrate by an apparatus to manufacture the stacked substrate.   
     
     
         42 . The stacked substrate manufacturing method according to  claim 24 , wherein
 obtaining the information about the deformation is performed before importing the first substrate and the second substrate into an apparatus to manufacture the stacked substrate.   
     
     
         43 . The stacked substrate manufacturing method according to  claim 24 , wherein
 the bonding condition includes a control condition for a stacked substrate manufacturing apparatus to bond the first substrate and the second substrate.   
     
     
         44 . The stacked substrate manufacturing method according to  claim 43 , wherein
 the control condition includes a correction condition to correct an amount of misalignment between the first substrate and the second substrate, the misalignment occurring while a contact region created between the first substrate and the second substrate is expanding.   
     
     
         45 . The stacked substrate manufacturing method according to  claim 24 , wherein
 the information, which is stored in the storing unit and about the deformation of the plurality of substrates in the direction intersecting the bonding surface, is previously measured using an external apparatus.   
     
     
         46 . A stacked substrate manufacturing apparatus for manufacturing a stacked substrate by bonding a first substrate and a second substrate, the stacked substrate manufacturing apparatus comprising:
 an obtaining unit configured to obtain, from a storing unit that stores information about deformation of a plurality of substrates including the first substrate, the deformation being in a direction intersecting a bonding surface of each of the plurality of substrates, information about the deformation of the first substrate in the direction intersecting the bonding surface of the first substrate; and   a control unit configured to determine, based on the information obtained by the obtaining unit, a bonding condition to bond the first substrate and the second substrate.   
     
     
         47 . The stacked substrate manufacturing apparatus according to  claim 46 , further comprising:
 a first stage configured to hold the first substrate; and   a second stage configured to hold the second substrate, wherein   the bonding condition includes a control condition for the first stage and the second stage.   
     
     
         48 . The stacked substrate manufacturing apparatus according to  claim 47 , wherein
 the control condition includes a correction condition to correct an amount of misalignment between the first substrate and the second substrate, the misalignment occurring while a contact region created between the first substrate and the second substrate is expanding.   
     
     
         49 . The stacked substrate manufacturing apparatus according to  claim 46 , wherein
 the information, which is stored in the storing unit and about the deformation of the plurality of substrates in the direction intersecting the bonding surface, is previously measured using an external apparatus.