Endpoint detection window, chemical mechanical polishing pad with window and preparation method thereof
Abstract
The present invention relates to B24B, and more specifically, the present invention relates to an endpoint detection window, a chemical mechanical polishing pad with a window and a preparation method thereof. A side surface of the window is provided with a plurality of circumferential grooves. In the present invention, a column-shaped window with a specially designed side surface structure is provided and subjected to integrated pouring and molding with a polishing pad to manufacture a chemical mechanical polishing pad having high bonding strength between the window and the polishing pad. As a side surface of the window is of a multi-groove structure, not only is the bonding contact area between the window and the pad increased, but also a convex structure is formed by a polishing pad body material poured into the grooves so as to form an embedded bonding manner with a groove structure of a window material.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An endpoint detection window, wherein a side surface of the window is provided with a plurality of circumferential grooves, and the maximum circumferential depression depth (R) of the grooves is 0.5-3 mm.
2 . The endpoint detection window of claim 1 , wherein the maximum radial width (L) of the grooves is equal to or greater than R.
3 . The endpoint detection window of claim 1 , wherein the depression area of the grooves is equal to or less than 2R 2 .
4 . The endpoint detection window of claim 1 , wherein the maximum radial width (L) of the grooves is equal to or less than 5R.
5 . The endpoint detection window of claim 1 , wherein the shape of the grooves is selected from one or more of an arc, a polygon and a wave shape;
and the polygon is selected from one or more of a triangle, a rectangle and a zigzag.
6 . The endpoint detection window of claim 1 , wherein the distance (H) of adjacent edges of the adjacent grooves is 0-5R.
7 . The endpoint detection window of claim 1 , wherein the roughness of an exposed surface of the window is 0.1-10 Ra.
8 . The endpoint detection window of claim 1 , wherein the shape of the exposed surface of the window is selected from one or more of a circle, an ellipse and a rounded rectangle.
9 . A chemical mechanical polishing pad with a window, wherein the chemical mechanical polishing pad is provided with the endpoint detection window of claim 1 .
10 . A preparation method of the chemical mechanical polishing pad with a window of claim 9 , wherein the chemical mechanical polishing pad is prepared by integrated pouring.Join the waitlist — get patent alerts
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