US2024006443A1PendingUtilityA1

Solid-state imaging device, imaging device, and electronic apparatus

Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPPriority: Aug 22, 2018Filed: Jul 7, 2023Published: Jan 4, 2024
Est. expiryAug 22, 2038(~12.1 yrs left)· nominal 20-yr term from priority
Inventors:Keiji Nishida
H10W 20/40H10W 20/01H10P 14/40H10F 39/8053H10F 39/809H10F 39/8063H10F 39/804H10F 39/806H01L 27/14627H01L 27/14621H04N 25/00
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Claims

Abstract

The present disclosure relates to a solid-state imaging device, an imaging device, and an electronic apparatus that are capable of suppressing generation of flare and also suppressing coloring caused by the flare with a simple configuration. A high refractive index layer is formed between a solid-state imaging element and a transparent protective substrate (glass substrate). When reflected light caused by diffracted light generated from an on-chip lens is reflected at an interface with the high refractive index layer, the reflected light is entirely reflected at a surface layer that is a transparent protective substrate and then the reflected light is sufficiently attenuated before being incident again. Consequently, flare and coloring caused by the flare are suppressed. The present disclosure is adaptable to an imaging device.

Claims

exact text as granted — not AI-modified
1 . A solid-state imaging device wherein
 a high refractive index layer having a refractive index higher than a refractive index of any one of a transparent protective substrate and a surface layer of an imaging surface of a solid-state imaging element is formed in a prior stage of the solid-state imaging element in a light incident direction.   
     
     
         2 . The solid-state imaging device according to  claim 1 , wherein
 the high refractive index layer is formed between the transparent protective substrate and the solid-state imaging element.   
     
     
         3 . The solid-state imaging device according to  claim 2 , wherein
 the high refractive index layer is formed between the solid-state imaging element and a bonding resin layer having a refractive index lower than the refractive index of the high refractive index layer.   
     
     
         4 . The solid-state imaging device according to  claim 2 , wherein
 the high refractive index layer is formed between the transparent protective substrate and the bonding resin layer having the refractive index lower than the refractive index of the high refractive index layer.   
     
     
         5 . The solid-state imaging device according to  claim 2 , wherein
 a plurality of the high refractive index layer is formed.   
     
     
         6 . The solid-state imaging device according to  claim 5 , wherein
 the high refractive index layers are each formed, between the transparent protective substrate and the bonding resin layer having the refractive index lower than the refractive index of the high refractive index layer and between the bonding resin layer and the solid-state imaging element.   
     
     
         7 . The solid-state imaging device according to  claim 2 , wherein
 the high refractive index layer includes a bonding resin layer having a high refractive index and formed between the transparent protective substrate and the solid-state imaging element.   
     
     
         8 . The solid-state imaging device according to  claim 1 , wherein
 the high refractive index layer includes a transparent protective substrate made to have a high refractive index, and a bonding resin layer is formed between the transparent protective substrate made to have the high refractive index and the solid-state imaging element.   
     
     
         9 . The solid-state imaging device according to  claim 1 , wherein
 the high refractive index layer is formed in a prior stage of the transparent protective substrate, and a bonding resin layer is formed between the transparent protective substrate and the solid-state imaging element.   
     
     
         10 . The solid-state imaging device according to  claim 1 , wherein
 a lens group including a plurality of lenses that adjusts a focal point is formed by pasting the lens group in a final stage to a most prior stage in the light incident direction.   
     
     
         11 . The solid-state imaging device according to  claim 10 , wherein
 the lens group in the final stage includes a concave lens, a convex lens, and a combination of the concave lens and the convex lens.   
     
     
         12 . The solid-state imaging device according to  claim 1 , wherein
 the high refractive index layer includes a single-layer film.   
     
     
         13 . The solid-state imaging device according to  claim 1 , wherein
 the surface layer of the imaging surface of the solid-state imaging element is a flattening film that flattens a surface layer of an on-chip lens.   
     
     
         14 . An imaging device wherein
 a high refractive index layer having a refractive index higher than a refractive index of any one of a transparent protective substrate and a surface layer of an imaging surface of a solid-state imaging element is formed in a prior stage of the solid-state imaging element in a light incident direction.   
     
     
         15 . An electronic apparatus wherein
 a high refractive index layer having a refractive index higher than a refractive index of any one of a transparent protective substrate and a surface layer of an imaging surface of a solid-state imaging element is formed in a prior stage of the solid-state imaging element in a light incident direction.

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