Imaging device, solid state image sensor, and electronic device

Abstract

To suppress generation of flare and ghosts. A solid state image sensor includes: a pixel array configured to generate a pixel signal according to an amount of incident light by photoelectric conversion in units of pixels arranged in an array manner; a glass substrate bonded with a light-receiving surface of the pixel array; and a light-shielding film formed on a peripheral portion that is an outside of an effective pixel region of the pixel array, in which the light-shielding film is formed at a front stage of the glass substrate. The present disclosure can be adapted to an imaging device.

1 . An electronic apparatus comprising:
 a solid state image sensor comprising:
 an integrated assembly comprising: 
 a pixel array; 
 an optical assembly comprising one or more transparent materials mounted with the pixel array in the integrated assembly; and 
 a light shield arranged to block light at a periphery of the integrated assembly, wherein a part of the light shield is disposed on at least one of the one or more transparent materials and wherein a width of a substrate including the pixel array is the same as a width of the optical assembly; 
 a plurality of lenses mounted apart from the pixel array; 
 a signal processing circuit arranged to receive signals from sensors in the pixel array; 
 a memory arranged to store image data; 
 a monitor arranged to display image data; and 
 a control circuit configured to control transfer of signal electric charges in the solid state image sensor. 
   
     
     
         2 . An integrated assembly for an imaging device comprising:
 a pixel array;   an optical assembly comprising one or more transparent materials mounted with the pixel array in the integrated assembly; and   a light shield arranged to block light at a periphery of the integrated assembly, wherein a part of the light shield is disposed on at least one of the one or more transparent materials and wherein a width of a substrate including the pixel array is the same as a width of the optical assembly, wherein the optical assembly comprises a glass substrate and an infrared filter, the integrated assembly further comprising a non-flat film disposed on the infrared filter.   
     
     
         3 . The integrated assembly of  claim 2 , wherein the glass substrate is bonded directly to the pixel array with an adhesive layer. 
     
     
         4 . An integrated assembly for an imaging device comprising:
 a pixel array;   a glass substrate affixed to the pixel array with an adhesive layer;   an infrared filter affixed to the glass substrate;   a non-flat film affixed to the infrared filter; and   a light shield configured to block light at a periphery of the pixel array, wherein the light shield is disposed on the glass substrate or on the infrared filter.   
     
     
         5 . The integrated assembly of  claim 4 , wherein the glass substrate and the adhesive layer are in direct contact with each other and wherein the pixel array and the adhesive layer are in direct contact with each other. 
     
     
         6 . The integrated assembly of  claim 4 , wherein the glass substrate is affixed to the pixel array with no cavity between the glass substrate and the pixel array. 
     
     
         7 . The integrated assembly of  claim 4 , wherein the light shield comprises a photosensitive black resist. 
     
     
         8 . The integrated assembly of  claim 4 , wherein a width of a substrate including the pixel array is the same as a width of the glass substrate. 
     
     
         9 . An integrated assembly for an imaging device comprising:
 a pixel array;   a transparent substrate affixed to the pixel array;   a non-flat film disposed on the transparent substrate; and   a light shield configured to block light at a periphery of the pixel array, wherein the light shield is disposed on the transparent substrate.   
     
     
         10 . The integrated assembly of  claim 9 , wherein the transparent substrate comprises a glass substrate that is bonded to the pixel array and wherein the light shield is formed on a periphery of the glass substrate. 
     
     
         11 . The integrated assembly of  claim 10 , wherein the pixel array and glass substrate are part of a chip size package. 
     
     
         12 . The integrated assembly of  claim 9 , wherein the transparent substrate comprises a glass substrate, further comprising an infrared filter formed on the glass substrate, wherein the glass substrate is bonded to the pixel array and wherein the light shield is formed on a periphery of the infrared filter. 
     
     
         13 . An imaging device, comprising a lens group and an integrated assembly according to  claim 9 . 
     
     
         14 . A camera module including an imaging apparatus, the imaging apparatus comprising:
 integrated assembly according to  claim 9 ; and   a plurality of lenses mounted apart from the pixel array.