Conditioning assembly, method for manufacturing the same, and assembled conditioner using the same

Abstract

A conditioning assembly, a method for manufacturing the same, and an assembled conditioner using the same are provided. The conditioning assembly includes a composite substrate and a dressing part. The composite substrate includes a porous reinforced structure and a filling material. The filling material covers the porous reinforced structure and fills into the inside of the porous reinforced structure. The dressing part is combined with the composite substrate.

What is claimed is: 
     
         1 . A conditioning assembly, comprising:
 a composite substrate including a porous reinforced structure and a filling material, wherein the filling material covers the porous reinforced structure and fills into the porous reinforced structure; and   a dressing part combined with the composite substrate.   
     
     
         2 . The conditioning assembly according to  claim 1 , wherein a material constituting the porous reinforced structure is different from a material constituting the filling material, and the material constituting the porous reinforced structure is metal, glass fiber, carbon fiber, polymer or any combination thereof. 
     
     
         3 . The conditioning assembly according to  claim 1 , wherein a material constituting the porous reinforced structure is nickel, iron, tungsten, copper, silver, magnesium, aluminum, titanium, nickel alloy, iron alloy, tungsten alloy, copper alloy, silver alloy, magnesium alloy, aluminum alloy, titanium alloy or stainless steel. 
     
     
         4 . The conditioning assembly according to  claim 1 , wherein a porosity of the porous reinforced structure ranges from 40% to 97%, the porous reinforced structure includes a plurality of openings, and an average pore diameter of the openings ranges from 50 μm to 500 μm. 
     
     
         5 . The conditioning assembly according to  claim 1 , wherein the porous reinforced structure has a mesh structure, a foamed structure, a fiber structure or a fin structure. 
     
     
         6 . The conditioning assembly according to  claim 1 , further comprising: a carrier, wherein the composite substrate is fixed on a joint surface of the carrier. 
     
     
         7 . The conditioning assembly according to  claim 6 , wherein the carrier has a positioning structure, and the composite substrate is combined with the carrier through the positioning structure. 
     
     
         8 . The conditioning assembly according to  claim 1 , wherein the dressing part includes a plurality of abrasive grains, and each of the abrasive grains is partially embedded into the composite substrate and protrudes from an upper surface of the composite substrate. 
     
     
         9 . The conditioning assembly according to  claim 1 , wherein the dressing part further includes a corrosion-resistant coating layer, and the corrosion-resistant coating layer at least covers an upper surface of the composite substrate. 
     
     
         10 . The conditioning assembly according to  claim 1 , wherein the filling material includes a plurality of conductive particles dispersed therein. 
     
     
         11 . An assembled conditioner, comprising:
 a base; and   a conditioning assembly disposed on the base;   wherein the conditioning assembly includes:
 a composite substrate including a porous reinforced structure and a filling material, wherein the filling material covers the porous reinforced structure and fills into the porous reinforced structure; and 
 a dressing part combined with the composite substrate. 
   
     
     
         12 . A method for manufacturing a conditioning assembly, comprising:
 embedding a dressing part into an uncured composite substrate, wherein the uncured composite substrate includes a porous reinforced structure and a filling resin material, and the filling resin material wraps the porous reinforced structure and penetrates into the porous reinforced structure; and   curing the filling resin material to form a composite substrate and fix the dressing part.   
     
     
         13 . The method for manufacturing the conditioning assembly according to  claim 12 , wherein the step of embedding the dressing part into the uncured composite substrate further includes:
 providing the porous reinforced structure, wherein the porous reinforced structure has a first surface and a second surface opposite the first surface;   embedding the dressing part into the porous reinforced structure, and adjusting horizontal height positions of a plurality of cutting tips of the dressing part, wherein the cutting tips protrude from the uncured composite substrate, and a vertical height difference between any two of the cutting tips does not exceed 20 μm; and   providing the filling resin material to cover the porous reinforced structure and penetrate into the porous reinforced structure, wherein the first surface of the porous reinforced structure is lower than a liquid level of the filling resin material.   
     
     
         14 . The method for manufacturing the conditioning assembly according to  claim 13 , wherein after the step of providing the filling resin material to cover the porous reinforced structure and penetrate into the porous reinforced structure, embedding the dressing part into the porous reinforced structure. 
     
     
         15 . The method for manufacturing the conditioning assembly according to  claim 13 , wherein the step of embedding the dressing part into the uncured composite substrate further includes: fixing the porous reinforced structure on a carrier, wherein the porous reinforced structure is provided in such a manner that the second surface faces the carrier. 
     
     
         16 . The method for manufacturing the conditioning assembly according to  claim 12 , further comprising: after the step of curing the filling resin material, forming a corrosion-resistant coating layer. 
     
     
         17 . The method for manufacturing the conditioning assembly according to  claim 12 , wherein the filling resin material contains a plurality of conductive particles dispersed therein. 
     
     
         18 . The method for manufacturing the conditioning assembly according to  claim 12 , further comprising: fixing the composite substrate on a carrier.