Systems and methods for joining a first structure and a second structure with a choreographed adhesive de-aeration process
Abstract
An example method of joining a first structure and a second structure is described that includes placing an adhesive within a bond cavity for bonding a first structure to a second structure, securing a vacuum bag to the first structure and the second structure so as to surround a portion of the first structure and the second structure, evacuating the bond cavity via a vacuum port to deaerate the adhesive within the bond cavity, after deaerating the adhesive, moving the first structure and the second structure relative to one another such that deaerated adhesive is disposed between the first structure and the second structure, and curing, via one or more heaters, the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A system for joining a first structure and a second structure, the system comprising:
one or more fixtures forming a bond cavity between a first structure and a second structure via positioning of the first structure relative to the second structure and to cause movement of the first structure and the second structure relative to one another; a vacuum bag to secure the first structure and the second structure by surrounding a portion of the first structure and the second structure; a vacuum port coupled to the vacuum bag for evacuating the bond cavity to deaerate an adhesive within the bond cavity such that deaerated adhesive is disposed between the first structure and the second structure; and one or more heaters for curing the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.
2 . The system of claim 1 , further comprising:
a collapsible standoff positioned between the first structure and the second structure to control a position of the first structure relative to the second structure, wherein the collapsible standoff collapses at a predetermined temperature.
3 . The system of claim 1 , further comprising:
a collapsible standoff positioned in the adhesive within the bond cavity.
4 . The system of claim 1 , wherein the adhesive is placed within the bond cavity on each bonding surface of the first structure and the second structure for bonding the first structure to the second structure.
5 . The system of claim 1 , further comprising:
a spacer inserted into a bottom area of the bond cavity to control bondline thickness.
6 . The system of claim 1 , further comprising:
a collapsible standoff inserted into a bottom area of the bond cavity to control a distance of distribution of the adhesive into the bond cavity based on temperature, wherein the collapsible standoff collapses at a predetermined temperature.
7 . The system of claim 6 , wherein a thickness of a bondline between the first structure and the second structure is controlled via a residual thickness of a collapsed collapsible standoff.
8 . The system of claim 1 , further comprising:
a semi-permeable breather material placed at one or more exits of the bond cavity.
9 . The system of claim 1 , wherein the vacuum port continuously evacuates the bond cavity while the one or more fixtures cause movement of the first structure and the second structure to one another.
10 . The system of claim 1 , further comprising:
a collapsible standoff placed in a hole of a surface of the second structure, wherein the surface of the second structure is configured to move toward the first structure, wherein the adhesive is placed in the hole of the surface of the second structure, and wherein the one or more fixtures cause movement of the first structure and the second structure relative to one another to force the first structure against the collapsible standoff to contact the collapsible standoff and force the adhesive to flow between the first structure and the second structure.
11 . The system of claim 10 , wherein the one or more heaters cure the deaerated adhesive and cause the collapsible standoff to collapse due to heating and thermal softening at a predetermined temperature.
12 . The system of claim 11 , wherein the vacuum port continuously evacuates the bond cavity while the one or more heaters cure the deaerated adhesive.
13 . The system of claim 1 , further comprising:
a collapsible standoff placed between the first structure and the second structure to control a position of the first structure relative to the second structure, wherein the collapsible standoff collapses at a predetermined temperature due to thermal softening; the one or more heaters apply heat to achieve a first temperature to cause the collapsible standoff to collapse resulting in the first structure and the second structure moving toward each other due to vacuum pressure.
14 . The system of claim 13 , wherein the one or more heaters apply heat to achieve a second temperature higher than the first temperature to cure the deaerated adhesive and bond the first structure to the second structure.
15 . The system of claim 1 , wherein the first structure comprises a component of a wing of an aircraft and the second structure comprises a wing skin of the wing of the aircraft.
16 . A system for joining a first structure and a second structure, the system comprising:
one or more fixtures forming a bond cavity between a first structure and a second structure via positioning of the first structure relative to the second structure and to cause movement of the first structure and the second structure relative to one another; a collapsible standoff positioned between the first structure and the second structure to control a position of the first structure relative to the second structure; a vacuum bag to secure the first structure and the second structure by surrounding a portion of the first structure and the second structure; a vacuum port coupled to the vacuum bag for evacuating the bond cavity to deaerate an adhesive within the bond cavity such that deaerated adhesive is disposed between the first structure and the second structure; and one or more heaters for curing the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.
17 . The system of claim 16 , wherein the collapsible standoff comprises include a thermoplastic material.
18 . The system of claim 16 , wherein the collapsible standoff comprises a spiral or spring-like configuration.
19 . The system of claim 16 , wherein the collapsible standoff comprises a hollow column configuration.
20 . The system of claim 16 , wherein the collapsible standoff collapses in a one-dimensional manner while providing alignment and spacing between the first structure and the second structure.Join the waitlist — get patent alerts
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