Light-Emitting Device, Module, Electronic Device, and Method for Manufacturing Light-Emitting Device
Abstract
A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and the light-emitting element, with a gap left between the partition and the bonding layer. A pair of substrates overlap with each other under a reduced-pressure atmosphere and then exposed to an air atmosphere or a pressurized atmosphere, whereby the reduced-pressure state of a space surrounded by the pair of substrates and the partition is maintained and atmospheric pressure is applied to the pair of substrates. Alternatively, a light-emitting element and a bonding layer are formed over a substrate. A pair of substrates overlap with each other, and then, pressure is applied to the bonding layer with the use of a member having a projection before or at the same time as curing of the bonding layer.
Claims
exact text as granted — not AI-modified1 . A light-emitting device comprising:
a first substrate; a transistor over the first substrate; a light-emitting element electrically connected to the transistor; a first resin over the transistor and the light-emitting element; a second substrate over the first resin; and a second resin between the first substrate and the second substrate, wherein the first substrate comprises: a first region; a second region between an end portion of the first substrate and the first region; and a third region between the end portion of the first substrate and the second region, wherein the first region of the first substrate comprises a region overlapped with the transistor, a region overlapped with the light-emitting element, a region overlapped with the first resin, a region overlapped with the second resin, and a region overlapped with the second substrate, wherein the second region of the first substrate is not overlapped with the transistor and the light-emitting element, wherein the second region of the first substrate comprises a region overlapped with a portion in which a thickness of the first resin gradually decreases, a region overlapped with the second resin, and a region overlapped with the second substrate, wherein the third region of the first substrate is not overlapped with the transistor, the light-emitting element, and the first resin, and wherein the third region of the first substrate comprises a region overlapped with the second resin and a region overlapped with the second substrate.
2 . A light-emitting device comprising:
a first substrate; a transistor over the first substrate; a light-emitting element electrically connected to the transistor; a first resin over the transistor and the light-emitting element; a second substrate over the first resin; a second resin between the first substrate and the transistor; and a third resin, wherein the first substrate comprises: a first region; a second region between an end portion of the first substrate and the first region; and a third region between the end portion of the first substrate and the second region, wherein the first region of the first substrate comprises a region overlapped with the transistor, a region overlapped with the light-emitting element, a region overlapped with the first resin, a region overlapped with the second resin, and a region overlapped with the second substrate, wherein the second region of the first substrate is not overlapped with the transistor and the light-emitting element, wherein the second region of the first substrate comprises a region overlapped with a portion in which a thickness of the first resin gradually decreases, a region overlapped with the second resin, and a region overlapped with the second substrate, wherein the third region of the first substrate is not overlapped with the transistor, the light-emitting element, and the first resin, wherein the third region of the first substrate comprises a region overlapped with the second resin and a region overlapped with the second substrate, and wherein the third resin comprises a region in contact with a side surface of the first substrate and a side surface of the second substrate.
3 . A light-emitting device comprising:
a first substrate; a light-emitting element; a first resin over the light-emitting element; a second substrate over the first resin; a second resin between the first substrate; and a third resin, wherein the first substrate comprises: a first region; a second region between an end portion of the first substrate and the first region; and a third region between the end portion of the first substrate and the second region, wherein the first region of the first substrate comprises a region, a region overlapped with the light-emitting element, a region overlapped with the first resin, a region overlapped with the second resin, and a region overlapped with the second substrate, wherein the second region of the first substrate is not overlapped with the light-emitting element, wherein the second region of the first substrate comprises a region overlapped with a portion in which a thickness of the first resin gradually decreases, a region overlapped with the second resin, and a region overlapped with the second substrate, wherein the third region of the first substrate is not overlapped with the light-emitting element and the first resin, wherein the third region of the first substrate comprises a region overlapped with the second resin and a region overlapped with the second substrate, and wherein the third resin comprises a region in contact with a side surface of the first substrate and a side surface of the second substrate.
4 . The light-emitting device according to claim 1 , further comprising:
a touch sensor over the first resin, wherein the second substrate is over the touch sensor, wherein the first region of the first substrate comprises a region overlapped with the touch sensor, and wherein each of the second region and the third region of the first substrate is not overlapped with the touch sensor.
5 . The light-emitting device according to claim 2 , further comprising:
a touch sensor over the first resin, wherein the second substrate is over the touch sensor, wherein the first region of the first substrate comprises a region overlapped with the touch sensor, and wherein each of the second region and the third region of the first substrate is not overlapped with the touch sensor.
6 . The light-emitting device according to claim 3 , further comprising:
a touch sensor over the first resin, wherein the second substrate is over the touch sensor, wherein the first region of the first substrate comprises a region overlapped with the touch sensor, and wherein each of the second region and the third region of the first substrate is not overlapped with the touch sensor.
7 . A module comprising:
the light-emitting device according to claim 1 ; and a flexible printed circuit substrate.
8 . A module comprising:
the light-emitting device according to claim 2 ; and a flexible printed circuit substrate.
9 . A module comprising:
the light-emitting device according to claim 3 ; and a flexible printed circuit substrate.
10 . An electronic device comprising:
the module according to claim 7 ; and an antenna, a battery, a housing, a speaker, a microphone, an operation switch, or an operation button.
11 . An electronic device comprising:
the module according to claim 8 ; and an antenna, a battery, a housing, a speaker, a microphone, an operation switch, or an operation button.
12 . An electronic device comprising:
the module according to claim 9 ; and an antenna, a battery, a housing, a speaker, a microphone, an operation switch, or an operation button.
13 . The light-emitting device according to claim 1 , wherein the light-emitting element is positioned between the first resin and the second resin.
14 . The light-emitting device according to claim 2 , wherein the light-emitting element is positioned between the first resin and the second resin.
15 . The light-emitting device according to claim 3 , wherein the light-emitting element is positioned between the first resin and the second resin.Join the waitlist — get patent alerts
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