Glass dielectric layer with patterning

Abstract

Embodiments of the present disclosure may generally relate to systems, apparatus, and/or processes directed to a manufacturing process flow for packages that include one or more glass layers that include patterning features, such as electrically conductive traces, RDLs, and vias within the packages. In embodiments, a package may include a glass layer with a first side and a second side opposite the first side, where the glass layer is a dielectric layer. The package may include another layer coupled with the first side of the glass layer, and a pattern on the second side of the glass layer to receive a deposited material in at least a portion of the pattern.

What is claimed is: 
     
         1 . An apparatus, comprising:
 a glass layer having a first side and a second side opposite the first side; and   another layer coupled with the first side of the glass layer, wherein the glass layer includes a conductive trace at the second side, wherein the glass layer includes a conductive via extending from the trace towards the first side, and wherein the trace is conductively coupled to the via.   
     
     
         2 . The apparatus of  claim 1 , further comprising a bridge die in or on the glass layer. 
     
     
         3 . The apparatus of  claim 1 , wherein the trace and the via comprise a redistribution layer. 
     
     
         4 . The apparatus of  claim 3 , wherein the redistribution layer comprises a fan out redistribution layer. 
     
     
         5 . The apparatus of  claim 1 , wherein the another layer is a selected one of an organic substrate, an adhesive layer, or another glass layer. 
     
     
         6 . The apparatus of  claim 1 , further comprising
 a second glass layer with a first side and a second side opposite the first side, wherein the first side of the second glass layer is coupled with the second side of the first glass layer; and   wherein the second glass layer includes a second conductive trace at the second side of the second glass layer, wherein the second glass layer includes a second conductive via extending from the second trace towards the first side of the second glass layer, and wherein the second trace is conductively coupled to the second via.   
     
     
         7 . The apparatus of  claim 6 , wherein the trace comprises a first trace, wherein the via comprises a first via, wherein the first trace and the first via comprise a first redistribution layer, wherein the second trace and the second via comprise a second redistribution layer, and wherein the first redistribution layer and the second redistribution layer are conductively coupled. 
     
     
         8 . The apparatus of  claim 6 , further comprising a bridge die in or on the second glass layer. 
     
     
         9 . The apparatus of  claim 1 , wherein the another layer comprises an organic substrate, wherein the trace comprises a first trace, wherein the via comprises a first via, wherein the first trace and the first via comprise a first redistribution layer, the apparatus further comprising a second trace and a second via in the organic substrate, wherein the second trace and the second via comprise a second redistribution layer, and wherein the first redistribution layer and the second redistribution layer are conductively coupled. 
     
     
         10 . The apparatus of  claim 9 , further comprising an adhesive layer between the glass layer and the organic substrate. 
     
     
         11 . The apparatus of  claim 9 , wherein the glass layer is at least partially embedded within the organic substrate. 
     
     
         12 . An apparatus, comprising:
 a substrate comprising organic material, the substrate including a conductive interconnect;   a first layer on the substrate, the first layer comprising glass, the first layer including a first metal trace conductively coupled to the conductive interconnect; and   a second layer on the first layer, the second layer comprising glass, the second layer including a second metal trace conductively coupled to the first metal trace.   
     
     
         13 . The apparatus of  claim 12 , further comprising adhesive material between the first layer and the second layer. 
     
     
         14 . The apparatus of  claim 12 , further comprising a layer of organic material on the second layer. 
     
     
         15 . The apparatus of  claim 12 , further comprising a bridge die at least partially embedded in one of the first layer or the second layer. 
     
     
         16 . The apparatus of  claim 12 , wherein at least one of the first metal trace and the second metal trace comprise a redistribution layer. 
     
     
         17 . An apparatus, comprising:
 a first glass layer having a first surface and an opposing second surface;   a bridge die in the first glass layer;   at least one first metal via in the first glass layer and at the first surface;   a second glass layer over the first surface of the first glass layer, the second glass layer having a third surface and an opposing fourth surface, the fourth surface of the second glass layer facing the first surface of the first glass layer;   at least one second metal via in the second glass layer and at the fourth surface, the second metal via conductively coupled to the first metal via; and   at least one third metal via in the second glass layer and at the fourth surface, the third metal via conductively coupled to the bridge die.   
     
     
         18 . The apparatus of  claim 17 , further comprising:
 a third glass layer over the third surface of the second glass layer, the third glass layer having a fifth surface and an opposing sixth surface, the sixth surface of the third glass layer facing the third surface of the second glass layer;   a fourth metal via in the third glass layer and at the sixth surface;   a fifth metal via in the third glass layer and at the sixth surface; and   a metal trace in the third glass layer, the metal trace conductively coupling the fourth metal via to the fifth metal via;   wherein the fourth metal via is conductively coupled to third metal via, and wherein the fifth metal via is conductively coupled to the second metal via.   
     
     
         19 . The apparatus of  claim 18 , wherein the metal trace comprises a first metal trace, the apparatus further comprising:
 a second metal trace in the second glass layer, the second metal trace conductively coupling the fourth metal via to the third metal via; and   a third metal trace in the second glass layer, the third metal trace conductively coupling the fifth metal via to the second metal via.   
     
     
         20 . The apparatus of  claim 17 , further comprising adhesive material between the first glass layer and the second glass layer, and between the second glass layer and the third glass layer.